Qualcomm has made the long-awaited foray into the ARM-based server chipsets and the trade media is presenting its 24-core SoC prototype as a challenger to Intel’s hegemony in the cloud server market. Is it so?… Read More
WEBINAR: Edge AI Optimization: How to Design Future-Proof Architectures for Next-Gen Intelligent DevicesEdge AI is rapidly transforming how intelligent solutions…Read More
WEBINAR Unpacking System Performance: Supercharge Your Systems with Lossless Compression IPsIn today's data-driven systems—from cloud storage and AI…Read More
ChipAgents Tackles Debug. This is ImportantInnovation is never ending in verification, for performance,…Read More
Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and AnalysisIn a major announcement at the 2025 Design…Read More
CEO Interview with Faraj Aalaei of CognichipFaraj Aalaei is a successful visionary entrepreneur with…Read More
Extendible Processor Architectures for IoT Applications
The Internet of Things has become a ubiquitous term, to refer to a broad (and somewhat ill-defined) set of electronic products and potential applications – e.g., wearables, household appliances and controllers, medical applications, retail applications (signage, RFID), industrial automation, machine-to-machine communication,… Read More
IoT chipsets and enterprise emulation tools
When most people talk about the IoT, it is usually all about wearables-this and low-power-that – because everyone is chasing the next huge consumer post-mobile device market. Mobile devices have provided the model. The smartphone is the on-ramp to the IoT for most consumers, with Bluetooth, Wi-Fi, and LTE, and maybe a dozen or … Read More
Is the IP market expected to decline by 2020?
To answer this question, I will share the results about Interface IP, more precisely the Top 5. The Top 5 protocols, USB, PCIe, Ethernet, DDRn and MIPI, are part of the interface IP market and each of them has been characterized by very strong growth rate. If you compute actual numbers for 2010 to 2014, it results to a Cumulated Annual… Read More
Learning about 3D Integration of ICs and Systems
We blog a lot about Moore’s Law, and even “More than Moore” where 3D integration of ICs and systems are used to get lower product costs. One big challenge with 3D integration of ICs is that most EDA software was really intended only for abstracting at 2D or 2.5D structures. Over the past several years there have … Read More
Our Own Cadence Amongst the Best Multinational Workplaces!
There were some very happy faces around MemCon this week for a variety of reasons. Paul McLellan was smiling because he now works full time for Cadence and has the best medical benefits ever and of course I was smiling because there was free food! … Read More
Wafer-Level Chip-Scale Packaging Technology Challenges and Solutions
At the recent TSMC OIP symposium, Bill Acito from Cadence and Chin-her Chien from TSMC provided an insightful presentation on their recent collaboration, to support TSMC’s Integrated FanOut (InFO) packaging solution. The chip and package implementation environments remain quite separate. The issues uncovered in bridging… Read More
A Connectivity Verification Idea
A Wirble
In case you hadn’t noticed, I like to write from time to time about EDA product ideas. I assume these are somewhat original, but given the maxim “there’s nothing new under the sun…”, I may well be wrong. In any event, I like to share these ideas if only to demonstrate that innovation in EDA is not stalled because we’ve run out big,… Read More
EUV sees further delays?
Headwinds which will likely continue into 2016…
ASML reported revenues of 1.55B Euros with EPS of 0.75 Euros more or less in line with expectations. Orders were the weak spot, falling to 904M Euros versus the previous Q2 orders of 1.523B Euros. The company guided Q4 revenues to be down about 10% to 1.4B Euros below current flattish… Read More
Why ARM Enabling Easy Access to Customized SOC’s Matters
The introduction of the Arduino heralded the huge growth and interest in MCU based designs by people who could never before easily put together the hardware and software system required for implementation of their ideas. I remember the first time I saw the Arduino in use. I was at a talk on how a system for controlling propane jet solenoids… Read More
Facing the Quantum Nature of EUV Lithography