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Last year Arm announced their support for standards-based virtual prototyping in automotive, along with a portfolio of new AE (automotive enhanced) cores. They also suggested that in 2025 they would be following Arm directions in other LOBs by offering integrated compute subsystems (CSS). Now they have delivered: their Zena… Read More
I last wrote about Secure IC back in 2023, a provider of embedded security technologies and services. Cadence announced at the beginning of 2025 their intention to acquire this company, which warrants a check-in again on what they have to offer. Secure-IC addresses multiple markets, from automotive, through defense/space and… Read More
Intel’s historical dominance in semiconductor process technology began to erode around 2018, as competitors started delivering higher performance at smaller nodes. In response, Intel is now doubling down on innovation across two fronts: advanced process nodes such as Intel 18A and 14A, and cutting-edge packaging technologies.… Read More
by, Tomi Rantakari CEO ChipFlow & Luca Testa COO Keysom
The automotive industry is undergoing a major transformation, driven by electrification, the rise of new market players, and the rapid adoption of emerging technologies such as AI. Among the most significant advancements is the growing adoption of RISC-V, an open-standard… Read More
The annual SNUG (Synopsys Users Group) conference, now in its 35th year, once again brought together key stakeholders to showcase accomplishments, discuss challenges, and explore opportunities within the semiconductor and electronics industry. With approximately 2,500 attendees, SNUG 2025 served as a dynamic hub for collaboration… Read More
How much perfectly good silicon is being discarded in the quest for reliability? During high-volume chip manufacturing, aggressive testing with strict thresholds may ensure quality but reduces yield, discarding marginal chips that could function flawlessly. On the other hand, prioritizing yield risks allowing defective… Read More
Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More
Dan is joined by Sebastien Clamagirand, Global Senior Vice President of Automotive System Engineering and Marketing at NXP Semiconductors. Sebastien focuses on system solutions for vehicle architectures that support the shift to software-defined vehicles. Under his leadership, NXP delivers pre-integrated, scalable … Read More
The semiconductor industry continues to evolve rapidly to meet the escalating demands for speed, power efficiency, and miniaturization. As traditional silicon-based technologies reach their physical and performance limits, engineered substrates and advanced material innovation have emerged as pivotal drivers of the… Read More
The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More
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Facing the Quantum Nature of EUV Lithography