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ASML- A Semiconductor Market Leader-Strong Demand Across all Products/Markets

ASML- A Semiconductor Market Leader-Strong Demand Across all Products/Markets
by Robert Maire on 07-25-2021 at 6:00 am

asml logo 20120410 1

– Strong demand across logic/memory & leading/trailing edge
– Customers want units fast-no time to test
– The main question is can ASML ramp to meet demand?

Revenue & Earnings low due to systems being rushed to customers
ASML reported Euro 4B in sales and Euro 1B in net income which while within guidance… Read More


Stochastic Origins of EUV Feature Edge Roughness

Stochastic Origins of EUV Feature Edge Roughness
by Fred Chen on 07-11-2021 at 10:00 am

Stochastic Origins of EUV Feature Edge Roughness

Due to the higher energy of EUV (13.3-13.7 nm wavelength) compared to ArF (193 nm wavelength) light, images produced by EUV are more susceptible to photon shot noise.

Figure 1. (Left) 40 nm dense (half-pitch) line image projected onto wafer at 35 mJ/cm2; (Right) 20 nm dense (half-pitch) line image projected onto wafer at 70 mJ/cm2.Read More


Contrast Reduction vs. Photon Noise in EUV Lithography

Contrast Reduction vs. Photon Noise in EUV Lithography
by Fred Chen on 05-30-2021 at 6:00 am

Contrast Reduction vs. Photon Noise in EUV Lithography

The stochastic behavior of images formed in EUV lithography has already been highlighted by a number of authors [1-3]. How serious it appears depends on the pixel size with which the photons are bunched. Generally, though, for features of around 20 nm or less, even 1 nm can have at least a +/- 15% gradient across it, which is still a

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KLAC- Great QTR & Guide- Foundry/logic focus driver- Confirms $75B capex in 2021

KLAC- Great QTR & Guide- Foundry/logic focus driver- Confirms $75B capex in 2021
by Robert Maire on 05-02-2021 at 10:00 am

KLAC Foundry Logic

– KLA put up an excellent quarter and Guide
– Rising above the increasing tide of orders
– Confirms $75B capex in 2021 with upside
– Foundry & Logic continue to be the sweet spot for KLA

Business is very very good and getting better

-Revenues came in at $1.8B with EPS of $3.85, all above the range
-Guidance… Read More


SALELE Double Patterning for 7nm and 5nm Nodes

SALELE Double Patterning for 7nm and 5nm Nodes
by Fred Chen on 03-28-2021 at 6:00 am

SALELE Double Patterning for 7nm and 5nm Nodes 4

In this article, we will explore the use of self-aligned litho-etch-litho-etch (SALELE) double patterning for BEOL metal layers in the 7nm node (40 nm minimum metal pitch [1]) with DUV, and 5nm node (28 nm minimum metal pitch [2]) with EUV. First, we mention the evidence that this technique is being used; Xilinx [3] disclosed the… Read More


SPIE 2021 – ASML DUV and EUV Updates

SPIE 2021 – ASML DUV and EUV Updates
by Scotten Jones on 03-17-2021 at 10:00 am

SPIE DUV 2021 ASML NXT4 DryWet Presentation final noWPD2 Page 42

At the SPIE Advanced Lithography Conference held in February, ASML presented the latest information on their Deep Ultraviolet (DUV) and Extreme Ultraviolet (EUV) exposure systems. I recently got to interview Mike Lercel of ASML to discuss the presentations.

DUV

Despite all the attention EUV is getting, most layers are still… Read More


Calculating the Maximum Density and Equivalent 2D Design Rule of 3D NAND Flash

Calculating the Maximum Density and Equivalent 2D Design Rule of 3D NAND Flash
by Fred Chen on 02-21-2021 at 10:00 am

3D NAND Flash unit cell

I recently posted an article [1] published in 2013 on the cost of 3D NAND Flash by Dr. Andrew Walker, which has since received over 10,000 views on LinkedIn. The highlight was the plot of cost vs. the number of layers showing a minimum cost for some layer number, dependent on the etch sidewall angle. In this article, the same underlying… Read More


ASML – Strong DUV Throwback While EUV Slows- Logic Dominates Memory

ASML – Strong DUV Throwback While EUV Slows- Logic Dominates Memory
by Robert Maire on 01-24-2021 at 6:00 am

ASML SMIC TSMC EUV DUV

ASML has good quarter driven by DUV & Logic (@72%)
– SMIC & other major customer slow EUV plans
– Logic (read that as TSMC) remains key demand led driver
– We are happy memory remains muted given cyclical potential

A very solid quarter with a continued road to growth
The quarter came in at Euro4,254B… Read More


The Complexities of the Resolution Limits of Advanced Lithography

The Complexities of the Resolution Limits of Advanced Lithography
by Fred Chen on 01-10-2021 at 6:00 am

The Complexities of the Resolution Limits of Advanced Lithography

For advanced lithography used to shrink semiconductor device features according to Moore’s Law, resolution limits are an obvious consideration. It is often perceived that the resolution limit is simply derived from a well-defined equation, but nothing can be further from the truth.

Optical Lithography: the fine print

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Advanced Process Development is Much More than just Litho

Advanced Process Development is Much More than just Litho
by Tom Dillinger on 12-16-2020 at 10:00 am

Vt distribution

The vast majority of the attention given to the introduction of each new advanced process node focuses on lithographic updates.  The common metrics quoted are the transistors per mm**2 or the (high-density) SRAM bit cell area.  Alternatively, detailed decomposition analysis may be applied using transmission electron microscopy… Read More