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Whatever Happened to the Big 5G Airport Controversy? Plus A Look To The Future

Whatever Happened to the Big 5G Airport Controversy? Plus A Look To The Future
by Josh Salant on 09-28-2022 at 10:00 am

Figure1 2

In December 2021, just weeks before Verizon and AT&T were set to enable their new radio access networks in the 5G mid-band spectrum (also known as C-Band), the Federal Aviation Administration (FAA) released a Special Airworthiness Information Bulletin (SAIB) and a statement notifying operators of potential 5G interference… Read More


Ansys’ Emergence as a Tier 1 EDA Player— and What That Means for 3D-IC

Ansys’ Emergence as a Tier 1 EDA Player— and What That Means for 3D-IC
by Daniel Nenni on 09-20-2022 at 10:00 am

Ansys chip package board

Over its 40+ year history, electronic design automation (EDA) has seen many companies rise, fall, and merge. In the beginning, in the 1980s, the industry was dominated by what came to be known as the big three — Daisy Systems, Mentor Graphics, and Valid Logic (the infamous “DMV”). The Big 3 has morphed over the years, eventually settling… Read More


WEBINAR: Design and Verify State-of-the-Art RFICs using Synopsys / Ansys Custom Design Flow

WEBINAR: Design and Verify State-of-the-Art RFICs using Synopsys / Ansys Custom Design Flow
by Synopsys on 08-11-2022 at 8:00 am

Synopsys Ansys RF Flow Webinar

The design and characterization of RF circuits is a complex process that requires an RF designer to overcome a variety of challenges. Not only do they face the complexities posed by advanced semiconductor processes and the need to meet the demanding requirements of modern wireless standards, designers must also account for electromagnetic… Read More


What Quantum Means for Electronic Design Automation

What Quantum Means for Electronic Design Automation
by Kelly Damalou and Kostas Nikellis on 07-06-2022 at 10:00 am

Ansys quantum blog Image1

In 1982, Richard Feynman, a theoretical physicist and Nobel Prize winner, proposed the initial quantum computer; Feynman’s quantum computer would have the capacity to facilitate traditional algorithms and quantum circuits with the goal of simulating quantum behavior as it would have occurred in nature. The systems Feynman… Read More


The Lines Are Blurring Between System and Silicon. You’re Not Ready.

The Lines Are Blurring Between System and Silicon. You’re Not Ready.
by Daniel Nenni on 07-01-2022 at 8:00 am

3D Memory HBM Ansys

3D-ICs bring together multiple silicon dies into a single package that’s significantly larger and complex than traditional systems on a chip (SoCs). There’s no doubt these innovative designs are revolutionizing the semiconductor industry.

3D-ICs offer a variety of performance advantages over traditional SoCs. Because … Read More


Multiphysics, Multivariate Analysis: An Imperative for Today’s 3D-IC Designs

Multiphysics, Multivariate Analysis: An Imperative for Today’s 3D-IC Designs
by Daniel Nenni on 06-26-2022 at 6:00 am

Ansys Heat Map

Semiconductor manufacturers are under constantly increasing and intense pressure to accelerate innovative new chip designs to market faster than ever in smaller package sizes while assuring signal integrity and reducing power consumption. Three-dimensional integrated circuits (3D-ICs) promise to answer all these demands… Read More


A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today

A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today
by John Lee on 06-14-2022 at 6:00 am

RedHawk SC uses Ansys SeaScape Big Data Platform Designed for EDA Applications

For the past few decades, System-on-Chip (SoC) has been the gold standard for optimizing the performance and cost of electronic systems. Pulling together practically all of a smartphone’s digital and analog capabilities into a monolithic chip, the mobile application processor serves as a near-perfect example of an SoC. But… Read More


Unlock first-time-right complex photonic integrated circuits

Unlock first-time-right complex photonic integrated circuits
by Raha Vafaei on 06-01-2022 at 10:00 am

EPDA overview

The capacity and energy efficiency challenges from the growing appetite for high-speed data along with advanced applications such as LIDAR and quantum computing are driving demand for increasingly large-scale photonic integrated circuits (PIC). With an ever-increasing number of components on a single photonic chip, manual… Read More


Take a Leap of Certainty at DAC 2022

Take a Leap of Certainty at DAC 2022
by Daniel Nenni on 05-22-2022 at 6:00 am

Ansys DAC 2022

The live events I have attended thus far this year have been very good. As much as I liked the virtual events, attending in the comfort of my home or sailboat, it is great to be live and networking inside the semiconductor ecosystem, absolutely.

Ansys has been a great supporter of the Design Automation Conference but this year they … Read More


Bespoke Silicon is Coming, Absolutely!

Bespoke Silicon is Coming, Absolutely!
by Daniel Nenni on 04-18-2022 at 6:00 am

IMG 9977

It was nice to be at a live conference again. DesignCon was held at the Santa Clara Convention Center, my favorite location, which to me there was a back to normal crowd. The sessions I attended were full and the show floor was busy. Masks and vaccinations were not required, maybe that was it. Or there was a pent-up demand to get back engaged… Read More