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Package Reliability Issues Cost Money

Package Reliability Issues Cost Money
by Tom Dillinger on 11-13-2019 at 6:00 am

Advanced packaging technology is enabling “More Than Moore” scaling of heterogeneous technology die.  At the recent EDPS Symposium in Milpitas, Craig Hillman, Director of Product Development, DfR Solutions, at ANSYS gave a compelling presentation, “Reliability Challenges in Advanced Packaging”.  The key takeaway messages… Read More


5G Deployments – The Analysis Requirements are Ginormous

5G Deployments – The Analysis Requirements are Ginormous
by Tom Dillinger on 10-07-2019 at 10:00 am

The introduction of 5G communications support offers tremendous potential across a broad spectrum of applications (no pun intended).  5G is indeed quite encompassing, across a wide range of frequencies – the figure below illustrates the common terminology used, from low-band, mid-band (“sub 6G”), and high-band (“mmWave… Read More


Xilinx on ANSYS Elastic Compute for Timing and EM/IR

Xilinx on ANSYS Elastic Compute for Timing and EM/IR
by Bernard Murphy on 08-20-2019 at 5:00 am

I’m a fan of getting customer reality checks on advanced design technologies. This is not so much because vendors put the best possible spin on their product capabilities; of course they do (within reason), as does every other company aiming to stay in business. But application by customers on real designs often shows lower performance,… Read More


Getting to EMC Compliance by Design

Getting to EMC Compliance by Design
by Bernard Murphy on 05-15-2019 at 7:00 am

At the risk of highlighting my abundant lack of expertise in the domain, I had always viewed EMC (electromagnetic compatibility) compliance and testing as one of those back-end exercises that can only be done on the real device and depends on a combination of expertise and brute-force in chip/package/module/system design (decaps,… Read More


Achieving a Predictable SignOff in 7nm

Achieving a Predictable SignOff in 7nm
by Alex Tan on 05-14-2019 at 12:00 pm

Image RemovedDesigning with advanced-nodes FinFETs such as 7nm node involves a more complex process than prior nodes. As secondary physical effects are no longer negligible, the traditional margin-based approach applied at various design abstraction levels is considered ineffective. Coupled with the increase of device… Read More


Webinar: Addressing Multiphysics Challenges in 7nm FinFET Designs

Webinar: Addressing Multiphysics Challenges in 7nm FinFET Designs
by Daniel Nenni on 03-12-2019 at 7:00 am

Image RemovedEDA is big on growth through acquisition, being acquired many times throughout my career I know this by experience. In fact, we have a wiki that tracks EDA Mergers and Acquisitions and it is the most viewed wiki on SemiWiki.com with 101,918 views thus far.

In March of 2017 ANSYS acquired CLK Design Automation which did… Read More


Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design

Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design
by Camille Kokozaki on 02-14-2019 at 7:00 am

In an ANSYS seminar held at DesignCon 2019, Dr. Larry Williams, ANSYS Director of Technology, outlined how 5G design innovation can be accelerated through simulation. He posited that 5G will become a general-purpose technology that affects an entire economy, drastically alter societies and unleash a cascade of complementary… Read More


Accelerating 5G Design Innovation Through Simulation Workshop

Accelerating 5G Design Innovation Through Simulation Workshop
by Daniel Nenni on 01-22-2019 at 12:00 pm

Image RemovedDesignCon is coming up, kicking off the first of many industry conferences for the year. It’s at the Santa Clara Convention Center which is the best venue in Northern California. Not only is this a semiconductor crowd, it’s also a systems crowd covering chips, boards, and systems. More than 175 companies participate… Read More


Big Data Analytics in Early Power Planning

Big Data Analytics in Early Power Planning
by Bernard Murphy on 12-13-2018 at 7:00 am

ANSYS recently hosted a webinar talking about how they used the big-data analytics available in RedHawk-SC to do early power grid planning with static analytics, providing better coverage than would have been possible through pure simulation-based approaches. The paradox here is that late-stage analysis of voltage drops … Read More


Webinar: NVIDIA Talks High Quality Metrics in Power Integrity Signoff

Webinar: NVIDIA Talks High Quality Metrics in Power Integrity Signoff
by Bernard Murphy on 11-09-2018 at 12:00 pm

There’s a familiar saying that you can’t improve what you can’t measure. Taking that one step further, the more improvement you want, the more accurately you have to measure. This become pretty important when you’re building huge designs in advanced technologies. Margins are a lot tighter all round and use-cases are massively… Read More