3DIC Design from Concept to Silicon 800X100
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TSMC Earnings – The Handoff from Mobile to HPC

TSMC Earnings – The Handoff from Mobile to HPC
by Doug O'Laughlin on 01-20-2022 at 10:00 am

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Hello! The most important semiconductor company in the world reported earnings last night. It’s been something of a tradition to post Taiwan Semiconductor Company (TSMC) earnings posts not behind my paywall, and I think that I’m going to continue that to kickoff each earnings season.

There are so many threads in the TSMC call that… Read More


Webinar: Investing in Semiconductor Startups

Webinar: Investing in Semiconductor Startups
by Mike Gianfagna on 01-14-2022 at 6:00 am

Webinar Investing in Semiconductor Startups

Investing in semiconductor startups is something Silicon Catalyst knows a lot about. During a time when venture funding for chip companies all but disappeared, this remarkable organization built a robust incubator, ecosystem, support infrastructure and funding source. Silicon Catalyst has assembled a top-notch management… Read More


CES is Back – Partially

CES is Back – Partially
by Bill Jewell on 01-13-2022 at 2:00 pm

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CES (formerly the Consumer Electronics Show) returned to Las Vegas, Nevada last week. In 2021, CES was remote due to the COVID-19 pandemic. On April 28, 2021, the Consumer Technology Association (CTA), the sponsor of CES, announced CES 2022 would be held in Las Vegas. On the date of the announcement new COVID cases in the U.S. were… Read More


DAC 2021 – What’s Up with Agnisys and Spec-driven IC Development

DAC 2021 – What’s Up with Agnisys and Spec-driven IC Development
by Daniel Payne on 01-11-2022 at 10:00 am

IDesignSpec min 1

Walking the exhibit floors at DAC in December I spotted the familiar face of Anupam  Bakshi, Founder and CEO of Agnisys, so I stopped by the booth to get an update on his EDA company. My first question for him was about the origin of the company name, Agnisys, and I found at that Agni means Fire in Sanskrit, one of the five elements.

The … Read More


IBM at IEDM

IBM at IEDM
by Scotten Jones on 01-10-2022 at 6:00 am

Vertical FET process

IBM transferred their semiconductor manufacturing to GLOBALFOUNDRIES several years ago but still maintains a multibillion-dollar research facility at Albany Nanotech. IBM is very active at conferences such as IEDM and appears to have a good public relations department because they get a lot of press.

At the Litho Workshop … Read More


CES 2022 and the Electrification of Cycling

CES 2022 and the Electrification of Cycling
by Daniel Payne on 01-05-2022 at 10:00 am

bosch min

With the Omicron variant of the COVID-19 virus in the news, there have been some big corporate names withdrawing from CES ( Peleton, Super73), however the cycling innovation companies assembled once again in Las Vegas this year for CES 2022. Data from statista show the strong growth in bicycle revenues in March 2020, when the pandemic… Read More


Self-Aligned Via Process Development for Beyond the 3nm Node

Self-Aligned Via Process Development for Beyond the 3nm Node
by Tom Dillinger on 01-05-2022 at 6:00 am

TEM DoD

The further scaling of interconnect and via lithography for advanced nodes is challenged by the requirement to provide a process window that supports post-patterning critical dimension variations and mask overlay tolerances.  At the recent international Electron Devices Meeting (IEDM) in San Francisco, TSMC presented … Read More


Technology Design Co-Optimization for STT-MRAM

Technology Design Co-Optimization for STT-MRAM
by Tom Dillinger on 01-04-2022 at 6:00 am

sense amplifier

Previous SemiWiki articles have described the evolution of embedded non-volatile memory (eNVM) IP from (charge-based) eFlash technology to alternative (resistive) bitcell devices.  (link, link)

The applications for eNVM are vast, and growing.  For example, microcontrollers (MCUs) integrate non-volatile memory for … Read More


Demand for High Speed Drives 200G Modulation Standards

Demand for High Speed Drives 200G Modulation Standards
by Tom Simon on 01-03-2022 at 10:00 am

200G Modulation

Right now, the most prevalent generation of Ethernet for data centers is 400 Gbps, with the shift to 800 Gbps coming rapidly. It is expected that by 2025 there will be 25 million units of 800 Gbps shipped. Line speeds of 100G are used predominantly for 400 Gbps Ethernet – requiring 4 lanes each. Initially 800 Gbps will simply … Read More


Advanced 2.5D/3D Packaging Roadmap

Advanced 2.5D/3D Packaging Roadmap
by Tom Dillinger on 01-03-2022 at 6:00 am

SoIC futures

Frequent SemiWiki readers are no doubt familiar with the advances in packaging technology introduced over the past decade.  At the recent International Electron Devices Meeting (IEDM) in San Francisco, TSMC gave an insightful presentation sharing their vision for packaging roadmap goals and challenges, to address the growing… Read More