DVCon Banner 2020 SemiWiki
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Webinar on Concurrent Electro-Thermal Analysis for PowerMOS Devices to Improve Performance and Reliability

Webinar on Concurrent Electro-Thermal Analysis for PowerMOS Devices to Improve Performance and Reliability
by Tom Simon on 02-20-2020 at 10:00 am

PTM-ET Sidecut view

PowerMOS devices play a major role in a variety of power converter and control circuits. Some examples of their applications include PMICs, or boost and buck converters. Often these are used in mobile and IoT devices to convert battery voltages to circuit operating voltages.

Due to their size and internal complexity PowerMOS … Read More


Bridging the Gap Between Design and Analysis

Bridging the Gap Between Design and Analysis
by Mike Gianfagna on 02-20-2020 at 6:00 am

PCB design challenges

At the recent DesignCon 2020 in Santa Clara, Cadence introduced a new product, Sigrity Aurora. You won’t find a press release about this announcement. Rather, Brad Griffin, product management group director at Cadence, presented Sigrity Aurora in the theater at the Cadence booth. This one caught my eye and deserves some discussion.… Read More


IBIS-AMI Back-Channel System Optimization in Practice

IBIS-AMI Back-Channel System Optimization in Practice
by Mike Gianfagna on 02-18-2020 at 6:00 am

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I recently spent some time at DesignCon 2020 in Santa Clara. For those who haven’t attended this show in a while, you need to go. It’s no longer a small event focused on chip design. It has grown into a true system-level conference, with a broad ecosystem represented on the show floor and in the technical sessions. Ecosystem is an important… Read More


De-Risking High-Speed RF Designs from Electromagnetic Crosstalk Issue

De-Risking High-Speed RF Designs from Electromagnetic Crosstalk Issue
by Mike Gianfagna on 02-12-2020 at 6:00 am

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At DesignCon 2020, ANSYS sponsored a series of very high-quality presentations.  Some focused on advanced methods and new technology exploration and some provided head-on, practical and actionable capabilities to improve advanced designs. The presentation I will discuss here falls into the latter category. The topic was… Read More


AI Interposer Power Modeling and HBM Power Noise Prediction Studies

AI Interposer Power Modeling and HBM Power Noise Prediction Studies
by Mike Gianfagna on 02-07-2020 at 6:00 am

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I attended a session on 2.5D silicon interposer analysis at DesignCon 2020. Like many presentations at this show, ecosystem collaboration was a focus. In this session, Jinsong Hu (principal application engineer at Cadence) and Yongsong He (senior staff engineer at Enflame Tech) presented approaches for interposer power modeling… Read More


TSMC Unveils Details of 5nm CMOS Production Technology Platform Featuring EUV and High Mobility Channel FinFETs at IEDM2019

TSMC Unveils Details of 5nm CMOS Production Technology Platform Featuring EUV and High Mobility Channel FinFETs at IEDM2019
by Don Draper on 02-05-2020 at 10:00 am

Diagram of BEOL metallization comparing EUV vs. immersion photolithography

Back in April, 2019, TSMC announced that they were introducing their 5 nm technology in risk production and now at IEDM 2019 they brought forth a detailed description of the process which has passed 1000 hour HTOL and will be in high volume production in 1H 2020.  This 5nm technology is a full node scaling from 7nm using smart scaling… Read More


Signal Channel Design and Simulation for Silicon Interposer Packaging on High-Speed SerDes

Signal Channel Design and Simulation for Silicon Interposer Packaging on High-Speed SerDes
by Mike Gianfagna on 02-04-2020 at 10:00 am

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This year is the 25th anniversary for DesignCon.  The show has changed a lot over the years. Today, it’s a vibrant showcase of all aspects of advanced product design – from ICs to boards to systems. The show floor reflects the diverse ecosystem. If you missed it this year, definitely plan to go next year.

The DesignCon technical program… Read More


DVCon Is a Must Attend Event for Design and Verification Engineers

DVCon Is a Must Attend Event for Design and Verification Engineers
by Daniel Payne on 02-03-2020 at 10:00 am

dvcon 2020

Learning is a never-ending process for design and verification engineers, so outside of reading SemiWiki you likely want to attend at least a few events per year to keep updated, learn something new, attend a workshop, or even present something that has made your IC project work much better than before. Sure, DAC is always a great… Read More


CES 2020: still no flying cars

CES 2020: still no flying cars
by Bill Jewell on 01-10-2020 at 6:00 am

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CES 2020 is being held this week in Las Vegas with over 4,500 exhibiting companies and over 175,000 attendees. The show includes a broader industry than just electronics, which led to it being renamed CES (previously the Consumer Electronics Show) and the sponsoring organization changing its name from the Consumer Electronics… Read More


IEDM 2019 – Applied Materials panel EUV Recap

IEDM 2019 – Applied Materials panel EUV Recap
by Scotten Jones on 12-23-2019 at 10:00 am

On Tuesday night of IEDM, Applied Materials held a panel discussion “The Future of Logic: EUV is Here, Now What?”. The panelists were: Regina Freed, managing director at Applied Materials as the moderator, Geoffrey Yeap, senior director of advanced technology at TSMC, Bala Haran, director of silicon process research at IBM, … Read More