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Statistically speaking you probably care about On-chip Variation

Statistically speaking you probably care about On-chip Variation
by Tom Simon on 10-22-2019 at 10:00 am

There are some metaphorical similarities between reaching timing signoff and driving a car to your destination. Most of us get in the car, turn the key and push the gas pedal to make it go. While we might have a cursory understanding of what makes it go, there are actually a lot of “moving part” under the hood in each instance. For most… Read More


GLOBALFOUNDRIES and Arm Showcase Broad Range of Partnership

GLOBALFOUNDRIES and Arm Showcase Broad Range of Partnership
by Randy Smith on 10-21-2019 at 10:00 am

I previously blogged on the GLOBALFOUNDRIES (GF) Technology Conference (GTC) held in Santa Clara, CA. The main takeaway that I shared in that blog was that GF’s announced “pivot” to a specialty foundry announced over a year ago, including its decision not to pursue 7nm and smaller nodes, appears to be working and GF is gaining momentum.… Read More


My Top Three Reasons to Attend IEDM 2019

My Top Three Reasons to Attend IEDM 2019
by Scotten Jones on 10-11-2019 at 6:10 am

Image RemovedThe International Electron Devices Meeting is a premier event to learn about the latest in semiconductor process technology. Held every year in early December is San Francisco this years conference will be held  from Decembers 7th through December 11th. You can learn more about the conference at their web site hereRead More


WEBINAR: Generating and Measuring IP Security Threat Levels For Your SoCs

WEBINAR: Generating and Measuring IP Security Threat Levels For Your SoCs
by Daniel Nenni on 10-09-2019 at 6:00 am

IPs have an attack surface that indicates how they can be compromised in real world scenarios. Some portions of the attack surfaces are well known, others are discovered during analysis, testing or out in the field. SoCs that use large collections of IPs need a systematic and reliable way to determine the various security vulnerabilities… Read More


Webinar – AI/ML SoC Memory and Interconnect IP Perspectives

Webinar – AI/ML SoC Memory and Interconnect IP Perspectives
by Tom Simon on 10-08-2019 at 10:00 am

For decades development work on Artificial Intelligence (AI) and Machine Learning (ML) was done on traditional CPUs and memory configurations. Now that we are in the “hockey stick” upturn in deployment of AI and ML, the search is on for the most efficient types of processing architectures. The result is a wave of development for… Read More


A Future Vision for 3D Heterogeneous Packaging

A Future Vision for 3D Heterogeneous Packaging
by Daniel Nenni on 10-07-2019 at 6:00 am

At the recent Open Innovation Platform® Ecosystem Forum in Santa Clara, TSMC provided an enlightening look into the future of heterogeneous packaging technology.  Although the term chiplet packaging is often used to describe the integration of multiple silicon die of potentially widely-varying functionality, this article… Read More


A Review of TSMC’s OIP Ecosystem

A Review of TSMC’s OIP Ecosystem
by Daniel Nenni on 10-06-2019 at 10:00 am

Each year, TSMC conducts two events – the Technology symposium in the Spring and the Open Innovation Platform (OIP) ® Ecosystem Forum in the Fall.  Yet, what is the OIP ecosystem?  What does it encompass?  And, how does the program differentiate TSMC from other foundries?  At the recent OIP Forum in Santa Clara, Suk Lee, Senior Director,… Read More


The GF Pivot, Specialization Defined

The GF Pivot, Specialization Defined
by Randy Smith on 10-04-2019 at 6:00 am

On August 27, 2018, GLOBALFOUNDRIES (GF) announced that they were no longer going to compete in the race to the next smaller semiconductor node, at that time, the 7nm node. While surprising to some, on further analysis this move made sense. TSMC had announced its plan to invest around $25B in the 5nm technology node. GF revenue is … Read More


AI Hardware Summit, Report #3: Enabling On-Device Intelligence

AI Hardware Summit, Report #3: Enabling On-Device Intelligence
by Randy Smith on 10-03-2019 at 6:00 am

This is the third and final blog I have written about the recent AI Hardware Summit held at the Computer History Museum in Mountain View, CA. Day 1 of the conference was more about solutions in the data center, whereas Day 2 was primarily around solutions at the Edge. This presentation from Day 2 was given by Dr. Thomas Anderson, Head,… Read More


Debugging SoCs at the RTL, Gate and SPICE Netlist Levels

Debugging SoCs at the RTL, Gate and SPICE Netlist Levels
by Daniel Payne on 10-02-2019 at 10:00 am

Debugging an IC is never much fun because of all the file formats used, the levels of hierarchy and just the sheer design size, so when an EDA tool comes around that allows me to get my debugging done quicker, then I take notice and give it a look. I was already familiar with debugging SPICE netlists using a tool called SPICEVision Pro,… Read More