CAST Compression IP Webinar 800x100 (2)
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Insider Opinions on AI in EDA. Accellera Panel at DAC

Insider Opinions on AI in EDA. Accellera Panel at DAC
by Bernard Murphy on 07-09-2025 at 6:00 am

Accellera Panel on AI in EDA min

In AI it is easy to be distracted by hype and miss the real advances in technology and adoption that are making a difference today. Accellera hosted a panel at DAC on just this topic, moderated by Dan Nenni (Mr. SemiWiki). Panelists were: Chuck Alpert, Cadence’s AI Fellow driving cross-functional Agentic AI solutions throughout… Read More


Arteris Simplifies Design Reuse with Magillem Packaging

Arteris Simplifies Design Reuse with Magillem Packaging
by Mike Gianfagna on 07-08-2025 at 6:00 am

Arteris Simplifies Design Reuse with Magillem Packaging

Many know Arteris as the “network-on-chip”, or NoC, company. Through acquisitions and forward-looking development, the footprint for Arteris has grown beyond smart interconnect IP. At DAC this year, Arteris highlighted its latest expansion with a new SoC integration automation product called Magillem Packaging. The announcement… Read More


Caspia Focuses Security Requirements at DAC

Caspia Focuses Security Requirements at DAC
by Mike Gianfagna on 07-07-2025 at 6:00 am

Caspia Highlights Security Requirements at DAC

As expected, security was a big topic at DAC this year. The growth of AI has demanded complex, purpose-built semiconductors to run ever-increasing workloads. AI has helped to design those complex chips more efficiently and with less power demands. There was a lot of discussion on these topics. But there is another part of this trend.… Read More


WEBINAR: Edge AI Optimization: How to Design Future-Proof Architectures for Next-Gen Intelligent Devices

WEBINAR: Edge AI Optimization: How to Design Future-Proof Architectures for Next-Gen Intelligent Devices
by Daniel Nenni on 07-03-2025 at 10:00 am

Ceva webinar AI Arch SEMI 400X400 250625

Edge AI is rapidly transforming how intelligent solutions are designed, from smart home devices to autonomous vehicles, healthcare gadgets, and industrial IoT. Yet, architects, chip designers, and product managers frequently grapple with a common and daunting challenge: creating efficient, high-performance AI solutions… Read More


WEBINAR Unpacking System Performance: Supercharge Your Systems with Lossless Compression IPs

WEBINAR Unpacking System Performance: Supercharge Your Systems with Lossless Compression IPs
by Daniel Nenni on 07-03-2025 at 6:00 am

CAST Compression IP Webinar 400x400

In today’s data-driven systems—from cloud storage and AI accelerators to automotive logging and edge computing—every byte counts. The exponential growth in data volumes, real-time processing demands, and constrained bandwidth has made efficient, lossless data compression a mission-critical requirement. Software-based… Read More


ChipAgents Tackles Debug. This is Important

ChipAgents Tackles Debug. This is Important
by Bernard Murphy on 07-02-2025 at 6:00 am

ChipAgents concept min

Innovation is never ending in verification, for performance, coverage, connection to verification plans and other aspects of DV. But debug, accounting for 40% of the verification cycle, has remained stubbornly resistant to significant automation. Debug IDEs help to visualize but don’t address the core problem: given a failure,… Read More


Webinar – Power is the New Performance: Scaling Power & Performance for Next Generation SoCs

Webinar – Power is the New Performance: Scaling Power & Performance for Next Generation SoCs
by Mike Gianfagna on 06-26-2025 at 10:00 am

Webinar Scaling Power Performance for Next Generation SoCs

What if you could reduce power and extend chip lifetime, without compromising performance? We all know the importance of power optimization for advanced SoCs. Thanks to the massive build out of AI workloads, power consumption has gone from a cost or cooling headache to an existential threat to the planet, if current power consumptions… Read More


DAC News – A New Era of Electronic Design Begins with Siemens EDA AI

DAC News – A New Era of Electronic Design Begins with Siemens EDA AI
by Mike Gianfagna on 06-23-2025 at 10:00 am

DAC News – A New Era of Electronic Design Begins with Siemens EDA AI

AI is the centerpiece of DAC this year. How to design chips to bring AI algorithms to life, how to prevent AI from hacking those chips, and of course how to use AI to design AI chips. In this latter category, there were many presentations, product announcements and demonstrations. I was impressed by many of them. But an important observation… Read More


Arteris at the 2025 Design Automation Conference #62DAC

Arteris at the 2025 Design Automation Conference #62DAC
by Daniel Nenni on 06-22-2025 at 8:00 am

62nd DAC SemiWiki

Key Takeaways:

  • Expanded Multi-Die Solution: Arteris showcases its foundational technology for rapid chiplet-based innovation. Check out the multi-die highlights video.
  • Ecosystem compatibility: Supported through integration with products from major EDA and foundry partners, including Cadence, Synopsys, and global
Read More