Linley Spring Conference Banner SemiWiki
WP_Term Object
(
    [term_id] => 50
    [name] => Events
    [slug] => events
    [term_group] => 0
    [term_taxonomy_id] => 50
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 717
    [filter] => raw
    [cat_ID] => 50
    [category_count] => 717
    [category_description] => 
    [cat_name] => Events
    [category_nicename] => events
    [category_parent] => 0
    [is_post] => 
)

Chip-to-Chip Communication for Enterprise and Cloud

Chip-to-Chip Communication for Enterprise and Cloud
by Mike Gianfagna on 04-01-2020 at 6:00 am

Screen Shot 2020 03 14 at 4.35.20 PM

I recently had the opportunity to attend a SemiWiki webinar entitled “Chip-to-Chip Communication for Enterprise and Cloud”.  The webinar was presented by SiFive and explored chip-to-chip communication strategies for a variety of applications.  In the first part of the webinar, Ketan Mehta, director of SoC IP product marketing… Read More


Webinar on eNVM Choices at 28nm and below by Globalfoundries

Webinar on eNVM Choices at 28nm and below by Globalfoundries
by Tom Simon on 03-31-2020 at 10:00 am

eFLASH Replacement MRAM

Embedded non-volatile memory (eNVM) plays an essential role in most systems and SoCs. eFLASH has found its way into a wide range of devices, including automotive, industrial, IoT and those in a mixture of other markets. NAND Flash has proven to be a workhorse in all of these areas. For instance, MCUs use them for code and data storage… Read More


Prevent and Eliminate IR Drop and Power Integrity Issues Using RedHawk Analysis Fusion

Prevent and Eliminate IR Drop and Power Integrity Issues Using RedHawk Analysis Fusion
by Mike Gianfagna on 03-24-2020 at 10:00 am

Screen Shot 2020 03 14 at 5.36.37 PM

I had the opportunity to preview an upcoming SemiWiki webinar on IR drop and power integrity. These topics, all by themselves, have real stopping power. Almost everyone I speak with has a story to tell about these issues in a recent chip design project. When you combine hot topics like this with a presentation that details the collaboration… Read More


A Conversation with Wally Rhines: Predicting Semiconductor Business Trends After Moore’s Law

A Conversation with Wally Rhines: Predicting Semiconductor Business Trends After Moore’s Law
by Daniel Nenni on 03-22-2020 at 10:00 am

Cover Predicting Trends

Wally Rhines is one of the most prolific speakers the semiconductor industry has ever experienced. Wally is also one of the most read bloggers on SemiWiki.com, sharing his life’s story which is captured in his first book: From Wild West to Modern Life the Semiconductor Evolution.

On April 2nd at 10am PDT we will host Wally on a live… Read More


Webinar on Tools and Solutions for Analog IP Migration

Webinar on Tools and Solutions for Analog IP Migration
by Tom Simon on 03-17-2020 at 10:00 am

MunEDA flow for analog design porting

The commonly advanced reason for IP reuse is lower cost and shorter development time. However, IP reuse presents its own challenges, especially for analog designs. In the case of digital designs, once a new standard cell library is available, it is usually not too hard to resynthesize RTL to create new working silicon. For analog… Read More


SPIE 2020 – Applied Materials Material-Enabled Patterning

SPIE 2020 – Applied Materials Material-Enabled Patterning
by Scotten Jones on 03-13-2020 at 10:00 am

2020 SPIE Media Briefing Full Slides for Scott Jones Page 16

I wasn’t able to attend the SPIE Advanced Lithography Conference this year for personal reasons, but Applied Materials was kind enough to set up a phone briefing for me with Regina Freed to discuss their Materials-Enabled Patterning announcement.

At IEDM Applied Materials (AMAT) tried to put together a panel across the entire… Read More


Achieving Design Robustness in Signoff for Advanced Node Digital Designs

Achieving Design Robustness in Signoff for Advanced Node Digital Designs
by Mike Gianfagna on 03-09-2020 at 10:00 am

Synopsys SemiWiki STARRC Webinar 1

I had the opportunity to preview an upcoming webinar on SemiWiki that deals with design robustness for signoff regarding advanced node digital designs (think single-digit nanometers). “Design robustness” is a key term – it refers to high quality, high yielding SoCs that come up quickly and reliably in the target system. We all… Read More


Six Automated Steps to Design Partitioning for Multi-FPGA Prototyping Boards

Six Automated Steps to Design Partitioning for Multi-FPGA Prototyping Boards
by Daniel Nenni on 03-09-2020 at 6:00 am

Aldec Webinar SemiWiki

Before starting your next FPGA Prototyping Project you should catch the next SemiWiki webinar – “Six Automated Steps to Design Partitioning for Multi-FPGA Prototyping Boards”, in partnership with Aldec.

A significant portion of my  30+ years in the EDA industry has revolved around design verification with some form of FPGA … Read More


TSMC’s 5nm 0.021um2 SRAM Cell Using EUV and High Mobility Channel with Write Assist at ISSCC2020

TSMC’s 5nm 0.021um2 SRAM Cell Using EUV and High Mobility Channel with Write Assist at ISSCC2020
by Don Draper on 03-06-2020 at 6:00 am

Fig. 1 Semiconductor Technology Application Evolution

Technological leadership has long been key to TSMC’s success and they are following up their leadership development of 5nm with the world’s smallest SRAM cell at 0.021um 2 with circuit design details of their write assist techniques necessary to achieve the full potential of this revolutionary technology. In addition to their… Read More


Designing Next Generation Memory Interfaces: Modeling, Analysis, and Tips

Designing Next Generation Memory Interfaces: Modeling, Analysis, and Tips
by Mike Gianfagna on 03-04-2020 at 10:00 am

IBIS AMI vs. Transient

At DesignCon 2020, there was a presentation by Micron, Socionext and Cadence that discussed design challenges and strategies for using the new low-power DDR specification (LPDDR5). As is the case with many presentations at DesignCon, ecosystem collaboration was emphasized. Justin Butterfield (senior engineer at Micron)… Read More