intel foundry SemiWiki 800x100 banner (2)

CEO Interview with Francisco Almada Lobo of Critical Manufacturing

CEO Interview with Francisco Almada Lobo of Critical Manufacturing
by Daniel Nenni on 10-18-2026 at 10:00 am

Industrial AI in semiconductor manufacturing

Francisco Almada Lobo is CEO and co-founder of Critical Manufacturing. He began his career at a CIM research institute and joined Siemens Semiconductors in 1997. In 2004 he led the migration of an MES in a running high-volume facility, and from 2005 to 2009 he managed the Porto Development Center for Infineon and Qimonda, responsible… Read More


Maskless EUV Lithography: An Alternative to E-Beam

Maskless EUV Lithography: An Alternative to E-Beam
by Admin on 10-18-2026 at 8:00 am

Maskless EUV Lithography An Alternative to E Beam

Semiconductor manufacturing depends on lithography: the process of transferring tiny circuit patterns onto a silicon wafer. Conventional extreme-ultraviolet (EUV) lithography projects light with a wavelength of 13.5 nanometers through a reflective optical system, using a custom photomask to define each layer. It can … Read More


CEO Interview with Dr. Raj Talluri of Kulicke & Soffa

CEO Interview with Dr. Raj Talluri of Kulicke & Soffa
by Daniel Nenni on 10-18-2026 at 6:00 am

Connecting the Future of Chips

Dr. Talluri joined K&S in August 2026 as a member of the Board and assumed the role of President and Chief Executive Officer of K&S in September 2026. Prior to joining K&S, Dr. Talluri served as President, Chief Executive Officer and a member of the Board of Directors at Enovix Corporation, a Nasdaq-listed advanced … Read More


Podcast EP374: How proteanTecs Tames Multi-Die Packaging Challenges with Nir Server

Podcast EP374: How proteanTecs Tames Multi-Die Packaging Challenges with Nir Server
by Daniel Nenni on 10-16-2026 at 10:00 am

Daniel is joined by Nir Sever, an industry veteran with over 30 years of technological and managerial experience in advanced VLSI engineering. Before joining proteanTecs, Nir served for 10 years as the COO of Tehuti Networks, a pioneer in the area of high-speed networking Semiconductors. Prior to that, he served for 9 years as … Read More


TSMC’s AI Expansion Signals a Broader Shift in Computing

TSMC’s AI Expansion Signals a Broader Shift in Computing
by Daniel Nenni on 10-16-2026 at 8:00 am

TSMC’s AI expansion

TSMC is describing an artificial intelligence boom that reaches beyond accelerator chips into the wider computing infrastructure needed to support increasingly capable AI systems. On the recent investor call, Chairman and CEO Dr. C.C. Wei presents strong demand, persistent supply constraints and an ambitious expansion … Read More


Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume

Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume
by Admin on 10-16-2026 at 6:00 am

Single Roof, Connected Silicon

By Shaurya Seth

Terafab is one of the most ambitious projects of the decade: $16.8 billion for phase one and up to $119 billion across four phases. A research fab in Austin iterates on process recipes, transistor designs, and packaging variants at a few thousand wafers per month. A volume fab in Grimes County targets 100,000 wafer… Read More


Design the Right Chip: Why Prototyping Has to Be Easy

Design the Right Chip: Why Prototyping Has to Be Easy
by Daniel Nenni on 10-15-2026 at 10:00 am

pic

Design the right chip. Design the chip right.

Every verification methodology in mainstream use answers the second half of that sentence and assumes the first. Simulation, emulation, formal, constrained-random testbenches, coverage closure — all of them take a specification as given and ask whether the implementation matches… Read More


Why Semiconductor AI Starts with Data, Not Algorithms

Why Semiconductor AI Starts with Data, Not Algorithms
by Admin on 10-15-2026 at 8:00 am

Fig1 context

The next gains from AI in semiconductors will come less from models and more from making fab and test data reliable, connected and tied to engineering decisions.

By Sriram Nithin Gopal Lanka

Every few months there is a new AI model that can do more and semiconductor manufacturers are under pressure to put them to work. But ask the engineers… Read More


Why AI Security Starts at the Chip Level

Why AI Security Starts at the Chip Level
by Daniel Nenni on 10-15-2026 at 6:00 am

Luminous Shield Over an AI Chip

Artificial intelligence is becoming part of the infrastructure that powers healthcare, transportation, finance, manufacturing, and everyday digital services. As these systems grow more capable, they also process more sensitive information and depend on increasingly complex hardware. The Synopsys white paper, “Securing… Read More


CTO Interview with Sirish Munipalli of Moores Lab AI

CTO Interview with Sirish Munipalli of Moores Lab AI
by Daniel Nenni on 10-14-2026 at 12:00 pm

Agentic AI for chip verification

Sirish Munipalli is Co-Founder and CTO of Moores Lab AI, where he leads the development of agentic AI for chip design verification, including SpecAgent(tm), the company’s specification and modeling platform. He has spent about 15 years designing and verifying complex silicon: FPGA prototyping at Intel, post-silicon validation… Read More