Dan is joined by Christopher Vick, the Vice President of Engineering at Lemurian Labs, bringing over three decades of experience from top tech companies such as Qualcomm, Oracle, and Sun Microsystems. Throughout his distinguished career, Christopher has played a key role in developing technologies used by billions.
Notably,… Read More
Tobias began his journey with a strong academic foundation in electronic design automation, studying at a leading university in Germany that specialized in formal verification. After graduating, Tobias gained hands-on experience in the semiconductor industry, where he quickly recognized the challenges and inefficiencies… Read More
Artificial intelligence (AI) is driving a transformation in data center infrastructure, necessitating cutting-edge technologies to meet the growing demands of AI workloads. As AI systems scale up and out, next-gen compute servers, switches, optical-electrical links, and flexible, redundant networking solutions are … Read More
If the thought of a silicon respin keeps you awake at night, you’re not alone. Re-fabricating a chip can cost tens of millions of dollars. An unplanned respin also risks a delay in getting a product to market, which adds tremendous costs in terms of lost business.
Undoubtedly, adding to your sleep loss is the recent rise in respins.… Read More
Many of you are already familiar with Silicon Catalyst and the value it brings to semiconductor startups, the industry and the electronics industry at large. Silicon Catalyst is an organization that supports early-stage semiconductor startups with an ecosystem that provides tools and resources needed to design, create, and… Read More
Silicon Carbide (SiC) is the superhero EV converters need, boosting efficiency, shrinking component sizes, and letting your car charge faster while handling heat like a pro. Even Tesla’s like, “Yep, we’re using it,” because who doesn’t want more range and less sweating under the hood?
By Jerome Fohet
Get ready for… Read More
At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More
– SPIE Photomask -all about High NA and bigger masks
– High NA will ramp very fast & is ramping fast – two already at Intel
– Doubling size of photomask will offset High NA exposure size problem
– Assembling litho tools at customer saves time/money- “Scanner Kits”
Christophe Fouquet
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Dan is joined by Dr. Walden Rhines. Wally is a lot of things, CEO of Cornami, board member, advisor to many and friend to all. Today he is the Executive Sponsor of the SEMI Electronic Design Market Data Report.
Wally reviews the latest report with Dan. Overall growth was strong at 18.2% vs. Q2 2023. Employment for the sector was also … Read More
Dan is joined by Jakob Engblom this year’s vice chair and keynote chair for DVCon Europe. He’s been in the virtual platforms field since 2002, most recently as director of simulation technology ecosystem at Intel. His interests include simulation technologies, software and hardware testing and validation, programming… Read More
SPIE Monterey- ASML, INTC – High NA Readiness- Bigger Masks/Smaller Features