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“Kandou it”

“Kandou it”
by Lauro Rizzatti on 06-15-2021 at 10:00 am

Kandou KB8001 Block Diagram

In another departure from my chip design verification “beat,” I took a look at Kandou and like what I learned.

Kandou from Lausanne, Switzerland, boasts “Kandou It” as its tagline and as it should be if Kandou’s USB-C multi-protocol retimer solution with USB4 support is inside next-gen laptops, notebooks, desktops, tablets and… Read More


Highlights of the TSMC Technology Symposium 2021 – Automotive

Highlights of the TSMC Technology Symposium 2021 – Automotive
by Tom Dillinger on 06-15-2021 at 6:00 am

automotive market growth v2

At the recent TSMC Technology Symposium, TSMC provided a detailed discussion of their development roadmaps.  Previous articles have reviewed the highlights of silicon process and packaging technologies.  The automotive platform received considerable emphasis at the Symposium – this article specifically focuses on the… Read More


Keynote from Google at CadenceLIVE Americas 2021

Keynote from Google at CadenceLIVE Americas 2021
by Kalar Rajendiran on 06-14-2021 at 10:00 am

CDNLive Americas 2021

Last week, Cadence hosted its annual CadenceLIVE Americas 2021 conference. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.

One of the keynotes was from Partha Ranganathan, VP and Engineering Fellow from Google. His talk was titled,… Read More


Highlights of the TSMC Technology Symposium 2021 – Packaging

Highlights of the TSMC Technology Symposium 2021 – Packaging
by Tom Dillinger on 06-14-2021 at 6:00 am

3D Fabric

The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings.

General

3DFabricTM

Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric.

2.5D package technology – CoWoS

The 2.5D packaging options are divided into the CoWoS… Read More


Highlights of the TSMC Technology Symposium 2021 – Silicon Technology

Highlights of the TSMC Technology Symposium 2021 – Silicon Technology
by Tom Dillinger on 06-13-2021 at 6:00 am

logic technology roadmap

Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap.  This article will review the highlights of the silicon process developments and future release plans.

Subsequent articles will describe the packaging offerings and delve into technology … Read More


Podcast EP24: ASIC Design at the Leading Edge

Podcast EP24: ASIC Design at the Leading Edge
by Daniel Nenni on 06-11-2021 at 10:00 am

Dan and Mike are joined by Graham Curren, founder and CEO of ASIC specialist Sondrel. Graham discusses the challenges of designing ASICs at the leading edge from a technology, design team and customer perspective. He explores where the real challenges are in building these types of chips and how Sondrel meets those challenges.… Read More


CEO Interview: Deepak Shankar of Mirabilis Design

CEO Interview: Deepak Shankar of Mirabilis Design
by Daniel Nenni on 06-11-2021 at 6:00 am

Deepak Shankar Mirabilis

The founder of Mirabilis Design, Mr. Shankar has over two decades of experience in management and marketing of system level design tools. Prior to establishing Mirabilis Design, he held the reins as Vice President, Business Development at MemCall, a fabless semiconductor company and SpinCircuit, a joint venture of industry… Read More


Data Orchestration Hardware Unlocks the Full Potential of AI

Data Orchestration Hardware Unlocks the Full Potential of AI
by Mike Gianfagna on 06-10-2021 at 10:00 am

Data Orchestration Hardware Unlocks the Full Potential of AI

We all know that artificial intelligence (AI) and machine learning (ML) are fundamentally changing the world. From the smart devices that gather data to the hyperscale data centers that analyze it, the impact of AI/ML can be felt almost everywhere. It is also well-known that hardware accelerators have opened the door to real-time… Read More


WEBINAR: 5 Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC

WEBINAR: 5 Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC
by Mike Gianfagna on 06-10-2021 at 6:00 am

WEBINAR 5 Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC

If you are involved in designing systems that process data, you’re going to want to attend this webinar. Practically speaking, this should include a large percentage of the SemiWiki readership. Since data is the new oil there are a lot of applications drawn to data and information processing. Before we explore this webinar, let’s… Read More


TSMC and the FinFET Era!

TSMC and the FinFET Era!
by Daniel Nenni on 06-09-2021 at 6:00 am

Intel 22nm wafer

While there is a lot of excitement around the semiconductor shortage narrative and the fabs all being full, both 200mm and 300mm, there is one big plot hole and that is the FinFET era.

Intel ushered in the FinFET era only to lose FinFET dominance to the foundries shortly thereafter. In 2009 Intel brought out a 22nm FinFET wafer at the… Read More