image mdx semiwiki 800x100 1

Time is of the Essence for High-Frequency Traders

Time is of the Essence for High-Frequency Traders
by Dave Bursky on 06-27-2022 at 10:00 am

Figure Simplified block diagram of Multiprotocol PMA from Silicon Creations

In the world of financial trading, nanoseconds count. The faster a trade can be accomplished, the more money a trader can make. Getting a trade in before a competitor also results in improved profits. What does this have to do with the partnership deal recently inked between Silicon Creations and Achronix? Plenty. The two companies… Read More


TSMC 2022 Technology Symposium Review – Advanced Packaging Development

TSMC 2022 Technology Symposium Review – Advanced Packaging Development
by Tom Dillinger on 06-27-2022 at 6:00 am

3D blox

TSMC recently held their annual Technology Symposium in Santa Clara, CA.  The presentations provide a comprehensive overview of their technology status and upcoming roadmap, covering all facets of the process technology and advanced packaging development.  This article will summarize the highlights of the advanced packaging… Read More


Multiphysics, Multivariate Analysis: An Imperative for Today’s 3D-IC Designs

Multiphysics, Multivariate Analysis: An Imperative for Today’s 3D-IC Designs
by Daniel Nenni on 06-26-2022 at 6:00 am

Ansys Heat Map

Semiconductor manufacturers are under constantly increasing and intense pressure to accelerate innovative new chip designs to market faster than ever in smaller package sizes while assuring signal integrity and reducing power consumption. Three-dimensional integrated circuits (3D-ICs) promise to answer all these demands… Read More


The Evolution of Taiwan’s Silicon Shield

The Evolution of Taiwan’s Silicon Shield
by Craig Addison on 06-25-2022 at 6:00 am

Silicon Shield 2025 Poster A4 size

The original Silicon Shield theory, as described in my 2001 book, stated that Taiwan’s role as producer of 90 per cent of the world’s IT products (at that time) protected it from an attack by China because the United States, acting in its own self interest, would come to the island’s defense. A similar scenario – involving oil,… Read More


Podcast EP90: A Tour of Cadence’s Cloud Solutions with Mahesh Turaga

Podcast EP90: A Tour of Cadence’s Cloud Solutions with Mahesh Turaga
by Daniel Nenni on 06-24-2022 at 10:00 am

Dan is joined by Mahesh Turaga, VP of Cloud Business Development at Cadence Design Systems. Mahesh brings extensive customer-facing experience to Cadence in business development, strategy, pre-sales, and consulting. He provides an overview of the cloud solutions provided by Cadence. The various business models, technical… Read More


ASML EUV Update at SPIE

ASML EUV Update at SPIE
by Scotten Jones on 06-24-2022 at 6:00 am

12051 4 SPIE2022 Smeets 0.33 NA EUV systems for High Volume Manufacturing Page 07

At the 2022 SPIE Advanced Lithography Conference, ASML presented an update on EUV. I recently had a chance to go over the presentations with Mike Lercel of ASML. The following is a summary of our discussions.

0.33 NA

The 0.33 NA EUV systems are the production workhorse systems for leading edge lithography today. 0.33 NA systems are… Read More


Using STA with Aging Analysis for Robust IC Designs

Using STA with Aging Analysis for Robust IC Designs
by Daniel Payne on 06-23-2022 at 10:00 am

Gate Level Aging min

Our laptops and desktop computers have billions of transistors in their application processor chips, yet I often don’t consider the reliability effects of aging that the transistors experience in the chips. At the recent Synopsys User Group (aka SNUG), there was a technical presentation on this topic from Srinivas Bodapati,… Read More


Scaling Safety Analysis. Reusability for FMEDA

Scaling Safety Analysis. Reusability for FMEDA
by Bernard Murphy on 06-23-2022 at 6:00 am

FMEDA generation

It is common when a new type of analysis is introduced in almost any domain that it works well enough for a while. Until it begins to struggle with growing problem size, prompting refinements to the methodology to allow continued scaling. We see this routinely in analytics for SoC design, so it should not be a big surprise that safety… Read More


Podcast EP89: An Overview of NXP’s MCX MCU Products with CK Phua

Podcast EP89: An Overview of NXP’s MCX MCU Products with CK Phua
by Daniel Nenni on 06-22-2022 at 10:00 am

Dan is joined by CK Phua of NXP. CK joined Philips Semiconductors in 1993 and worked in various roles including quality, applications engineering, product engineering and technical marketing. After Philips, CK joined Freescale in 2012 and rejoined NXP through the Freescale merger. CK is now a Product Manager for Microcontrollers… Read More


TSMC 2022 Technology Symposium Review – Process Technology Development

TSMC 2022 Technology Symposium Review – Process Technology Development
by Tom Dillinger on 06-22-2022 at 5:00 am

finFLEX

TSMC recently held their annual Technology Symposium in Santa Clara, CA.  The presentations provided a comprehensive overview of their status and upcoming roadmap, covering all facets of process technology and advanced packaging development.  This article will summarize the highlights of the process technology updates… Read More