A classic networking problem is securing connections with encrypted data, but implementing strong encryption algorithms at wire speeds can limit performance. However, introducing blazing-fast connectivity without an encryption strategy leaves systems vulnerable. The architects in the UALink Consortium, including … Read More
Verification Analytics: The New Paradigm with Cogita-PRO at DVCON 2026Cogita-PRO, developed by Vtool, introduces a transformative approach…Read More
Breker Hosts an Energetic Panel on Spec-Driven VerificationI was fortunate to be asked to moderate…Read MoreGTC 2026: Agentic AI for Semiconductor Design and Manufacturing
Trust in Verification with AI
These are stressful times in functional verification. We are being pushed to more aggressively embrace AI-based automation, knowing we will continue to be held accountable for quality of results. Verification misses could upend careers, maybe enterprises. It is tempting to believe that sanity will prevail and we will ultimately… Read More
Scaling Multi-Die Connectivity: Automated Routing for High-Speed Interfaces
This article concludes the three-part series examining key methodologies required for successful multi-die design. The first article Reducing Risk Early: Multi-Die Design Feasibility Exploration focused on feasibility exploration and early architectural validation, while the second article Building the Interconnect… Read More
Beyond Moore’s Law: High NA EUV Lithography Redefines Advanced Chip Manufacturing
The imec installation of the ASML EXE:5200 High Numerical Aperture (High NA) extreme ultraviolet (EUV) lithography system at imec represents a pivotal advancement in semiconductor manufacturing and research. This system, installed in imec’s 300 mm cleanroom in Leuven, Belgium, introduces unprecedented lithographic resolution… Read More
Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet Summit
At the recent Chiplet Summit, presentations, discussions and general participation could be broken down into a few broad categories. There were presentations of actual chiplet designs, either as building blocks or end products. There were presentations regarding design tools and methodologies to support and accelerate … Read More
CEO Interview with Moti Margalit of SonicEdge
Moti Margalit is the CEO and co-founder of SonicEdge, a deep-tech pioneer reinventing sound through ultrasonic modulation – unlocking smaller, vibration-free speakers with studio-quality audio.
With a background in lasers and electro-optics, Moti transitioned from technologist to inventor. His career spans 150+ patents… Read More
Podcast EP336: How Quadric is Enabling Dramatic Improvements in Edge AI with Veer Kheterpal
Daniel is joined by Dr. Veer Kheterpal. Veer has founded three technology companies and possesses full-stack expertise spanning software to silicon across edge and datacenter applications. Currently, he is the CEO & co-founder of Quadric, a semiconductor IP licensing company that delivers the blueprints for efficient,… Read More
Captain America: Can Elon Musk Save America’s Chip Manufacturing Industry?
Intel has posted three consecutive years of falling revenue and an $18.76 billion loss in 2024 alone—and the U.S. government has handed it tens of billions of dollars to fix the problem. The government money isn’t fixing the real issue, which isn’t technical. It’s cultural. Intel got slow, political, and risk-averse—the… Read More
WEBINAR: Reclaiming Clock Margin at 3nm and Below
At 3nm and below, clock networks have quietly become the dominant limiter of SoC power, performance, and yield. Yet most advanced-node designs still rely on abstraction-based signoff methodologies developed when voltage headroom was generous and interconnect effects were secondary.
That assumption no longer holds
As supply… Read More




Captain America: Can Elon Musk Save America’s Chip Manufacturing Industry?