Ceva webinar AI Arch SEMI 800X100 250625
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CEO Interview with Dr. Naveen Verma of EnCharge AI

CEO Interview with Dr. Naveen Verma of EnCharge AI
by Daniel Nenni on 07-04-2025 at 6:00 am

Naveen Verma Headshot

Naveen Verma, Ph.D., is the CEO and Co-founder of EnCharge AI, the only company to have developed robust and scalable analog in-memory computing technology essential for advanced AI deployments, from edge to cloud. Dr. Verma co-founded EnCharge AI in 2022, building on six years of research and five generations of prototypes … Read More


ChipAgents Tackles Debug. This is Important

ChipAgents Tackles Debug. This is Important
by Bernard Murphy on 07-02-2025 at 6:00 am

ChipAgents concept min

Innovation is never ending in verification, for performance, coverage, connection to verification plans and other aspects of DV. But debug, accounting for 40% of the verification cycle, has remained stubbornly resistant to significant automation. Debug IDEs help to visualize but don’t address the core problem: given a failure,… Read More


Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis

Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis
by Kalar Rajendiran on 07-01-2025 at 10:00 am

Innovator3D IC Solution Suite

In a major announcement at the 2025 Design Automation Conference (DAC), Siemens EDA introduced a significant expansion to its electronic design automation (EDA) portfolio, aimed at transforming how engineers design, validate, and manage the complexity of next-generation three-dimensional integrated circuits (3D ICs).… Read More


CEO Interview with Faraj Aalaei of Cognichip

CEO Interview with Faraj Aalaei of Cognichip
by Daniel Nenni on 07-01-2025 at 8:00 am

Faraj (1)

Faraj Aalaei is a successful visionary entrepreneur with over 40 years of distinguished experience in communications and networking technologies. As a leading entrepreneur in Silicon Valley, Faraj was responsible for building and leading two semiconductor companies through IPOs as a founder and CEO.

Post acquisition of … Read More


Rethink Scoreboards to Supercharge AI-Era CPUs

Rethink Scoreboards to Supercharge AI-Era CPUs
by Admin on 07-01-2025 at 6:00 am

Register (1)

By Dr. Thang Minh Tran, CEO/CTO Simplex Micro

Today’s AI accelerators—whether built for massive data centers or low-power edge devices—face a common set of challenges: deep pipelines, complex data dependencies, and the high cost of speculative execution. These same concerns have long been familiar in high-frequency microprocessor… Read More


Reachability in Analog and AMS. Innovation in Verification

Reachability in Analog and AMS. Innovation in Verification
by Bernard Murphy on 06-26-2025 at 6:00 am

Innovation New

Can a combination of learning-based surrogate models plus reachability analysis provide first pass insight into extrema in circuit behavior more quickly than would be practical through Monte-Carlo analysis? Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys… Read More


Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot

Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot
by Jonah McLeod on 06-24-2025 at 10:00 am

Table 1

In 2003, legendary computer architect Michael J. Flynn issued a warning that most of the industry wasn’t ready to hear. The relentless march toward more complex CPUs—with speculative execution, deep pipelines, and bloated instruction handling—was becoming unsustainable. In a paper titled “Computer Architecture … Read More


DAC News – A New Era of Electronic Design Begins with Siemens EDA AI

DAC News – A New Era of Electronic Design Begins with Siemens EDA AI
by Mike Gianfagna on 06-23-2025 at 10:00 am

DAC News – A New Era of Electronic Design Begins with Siemens EDA AI

AI is the centerpiece of DAC this year. How to design chips to bring AI algorithms to life, how to prevent AI from hacking those chips, and of course how to use AI to design AI chips. In this latter category, there were many presentations, product announcements and demonstrations. I was impressed by many of them. But an important observation… Read More


Arteris Expands Their Multi-Die Support

Arteris Expands Their Multi-Die Support
by Bernard Murphy on 06-18-2025 at 6:00 am

multi die use cases min

I am tracking the shift to multi-die design, so it’s good to see Arteris extend their NoC expertise, connecting chiplets across an interposer. After all, network connectivity needs don’t stop at the boundaries of chiplets. A multi-die package is at a logical level just a scaled-up SoC for which you still need traffic routing and… Read More


Caspia Technologies at the 2025 Design Automation Conference #62DAC

Caspia Technologies at the 2025 Design Automation Conference #62DAC
by Mike Gianfagna on 06-12-2025 at 10:00 am

Caspia Technologies at the 2025 Design Automation Conference

Security will be an important topic at DAC this year. The hardware root of trust is the foundation of all security for complex systems implementing AI workloads. Thanks to new and sophisticated techniques the hardware root of trust is now vulnerable and must be protected. But adding deep security verification to existing design… Read More