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SEMICON West- Jubilant huge crowds- HBM & AI everywhere – CHIPS Act & IMEC

SEMICON West- Jubilant huge crowds- HBM & AI everywhere – CHIPS Act & IMEC
by Robert Maire on 07-12-2024 at 6:00 am

Semicon West SF

– We just finished the most happy SEMICON West in a long time
– IMEC stole the show- HBM has more impact than size dictates
– Has Samsung lost its memory mojo? Is SK the new leader?
– AI brings new tech issues with it – TSMC is still industry King

Report from SEMICON West

The crowds at Semicon West were both… Read More


Who Are the Next Anchor Tenants at DAC? #61DAC

Who Are the Next Anchor Tenants at DAC? #61DAC
by Mike Gianfagna on 07-11-2024 at 10:00 am

DAC Roundup – Who Are the Next Anchor Tenants at DAC?

#61DAC is evolving. The big get bigger and ultimately focus on other venues for customer outreach and branding. This is a normal evolution in any industry. For EDA, it was noticed by many that Cadence and Synopsys have downsized their booths at DAC. Everyone knows CDNLive and SNUG are very successful events for these companies and… Read More


Production AI is Taking Off But Not Where You Think

Production AI is Taking Off But Not Where You Think
by Bernard Murphy on 07-10-2024 at 6:00 am

TinyML

AI for revolutionary business applications grabs all the headlines but real near-term growth is already happening, in consumer devices and in IoT. For good reason. These applications may be less eye-catching but are eminently practical: background noise cancellation in earbuds and hearing aids, keyword and command ID in voice… Read More


Insights into Automotive AI in China

Insights into Automotive AI in China
by Bernard Murphy on 07-03-2024 at 6:00 am

Automotive AI in China min

Now that claims and counter claims about advances in foundational AI seem to be dying down, it becomes more interesting to look at the next wave – AI applications in key markets. Figuring out what is really happening here presents its own problems. Marketing and analyst literature still projects unbounded promise (now dialed back… Read More


Siemens Provides a Complete 3D IC Solution with Innovator3D IC

Siemens Provides a Complete 3D IC Solution with Innovator3D IC
by Mike Gianfagna on 06-27-2024 at 6:00 am

Siemens Provides a Complete 3D IC Solution with Innovator3D IC

Heterogeneous multi-die integration is gaining more momentum all the time. The limited roadmap offered by Moore’s Law monolithic, single-die integration has opened the door to a new era of more-than-Moore heterogeneous integration. The prospects offered by this new design paradigm are exciting and the entire ecosystem is… Read More


Novelty-Based Methods for Random Test Selection. Innovation in Verification

Novelty-Based Methods for Random Test Selection. Innovation in Verification
by Bernard Murphy on 06-26-2024 at 6:00 am

Innovation New

Coverage improvement effectiveness through randomized testing declines as total coverage improves. Attacking stubborn holes in coverage could be augmented through learned novel test guidance to random test selection. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former… Read More


Synopsys’ Strategic Advancement with PCIe 7.0: Early Access and Complete Solution for AI and Data Center Infrastructure

Synopsys’ Strategic Advancement with PCIe 7.0: Early Access and Complete Solution for AI and Data Center Infrastructure
by Kalar Rajendiran on 06-25-2024 at 6:00 am

(From NewsRelease)Synopsys PCIe 7.0 IP Solution Infographic

In the rapidly evolving world of high-performance computing (HPC) and artificial intelligence (AI), technological advancements must keep pace with increasing demands for speed, efficiency, and security. Synopsys recently announced the industry’s first complete PCIe 7.0 IP solution. This groundbreaking initiative addresses… Read More


Mirabilis Design at the 2024 Design Automation Conference

Mirabilis Design at the 2024 Design Automation Conference
by Deepak Shankar on 06-18-2024 at 10:00 am

DAC 2024 Banner

This is the first time in 28 years of my visits to DAC that I have seen so many different technologies arrive at DAC in the same year.  Earlier we would have one or possibly two innovative breakthroughs in semiconductors and embedded systems that emerged at DAC. This year I expect six or may be seven to arrive, and I am not including the… Read More


PrimisAI at the 2024 Design Automation Conference

PrimisAI at the 2024 Design Automation Conference
by Daniel Nenni on 06-18-2024 at 8:00 am

DAC 2024 Banner

PrimisAI is the premier destination for cutting-edge hardware design automation, offering engineers the ultimate companion with advanced Language-to-Code and Language-to-Verification capabilities. Our interactive AI assistant swiftly addresses complex hardware challenges across the entire design stack, from concept… Read More


Synopsys-AMD Webinar: Advancing 3DIC Design Through Next-Generation Solutions

Synopsys-AMD Webinar: Advancing 3DIC Design Through Next-Generation Solutions
by Kalar Rajendiran on 06-13-2024 at 10:00 am

The Synopsys Multi Die Solution

Introduction of 2.5D and 3D multi-die based products are helping extend the boundaries of Moore’s Law, overcoming limitations in speed and capacity for high-end computational tasks. In spite of its critical function within the 3DIC paradigm, the interposer die’s role and related challenges are often neither fully comprehended… Read More