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2025 Outlook with Larry Zu of Sarcina Technology

2025 Outlook with Larry Zu of Sarcina Technology
by Daniel Nenni on 01-21-2025 at 10:00 am

Larry Zu

Tell us a little bit about yourself and your company. 

I’m Larry Zu, Founder and CEO of Sarcina Technology. I’ve grown Sarcina from just designing packages for a few small companies to handling the entire post-silicon ecosystem, including package design, assembly, testing, qualification and production services for the top … Read More


ML and Multiphysics Corral 3D and HBM

ML and Multiphysics Corral 3D and HBM
by Bernard Murphy on 01-07-2025 at 6:00 am

multidie and HBM stacks min

3D design with high-bandwidth memory stacks (HBM) has become essential for leading edge semiconductor systems in multiple applications. Hyperscalers depend on large AI accelerator cores supported by 100GB or more of in-package HBM to handle trillion parameter AI models. Autonomous Drive (AD) vehicles may handle smaller … Read More


TSMC Unveils the World’s Most Advanced Logic Technology at IEDM

TSMC Unveils the World’s Most Advanced Logic Technology at IEDM
by Mike Gianfagna on 12-19-2024 at 10:00 am

TSMC Unveils the World’s Most Advanced Logic Technology at IEDM

There was a lot of discussion at IEDM about the coming shift to gate-all-around (GAA) transistor structures. This new device brings many benefits to continue device scaling, both at the monolithic device level as well as for multi-die design. The path to GAA is not simple, there are new material, process and design considerations… Read More


An Invited Talk at IEDM: Intel’s Mr. Transistor Presents The Incredible Shrinking Transistor – Shattering Perceived Barriers and Forging Ahead

An Invited Talk at IEDM: Intel’s Mr. Transistor Presents The Incredible Shrinking Transistor – Shattering Perceived Barriers and Forging Ahead
by Mike Gianfagna on 12-16-2024 at 10:00 am

An Invited Talk at IDEM Intel’s Mr. Transistor Presents The Incredible Shrinking Transistor – Shattering Perceived Barriers and Forging Ahead

IEDM turned 70 last week. This was cause for much celebration in the form of special events. One such event was a special invited paper on Tuesday afternoon from Intel’s Tahir Ghani, or Mr. Transistor as he is known. Tahir has been driving innovation at Intel for a very long time. He is an eyewitness to the incredible impact of the Moore’s… Read More


IEDM Opens with a Big Picture Keynote from TSMC’s Yuh-Jier Mii

IEDM Opens with a Big Picture Keynote from TSMC’s Yuh-Jier Mii
by Mike Gianfagna on 12-12-2024 at 10:00 am

IEDM Opens with a Big Picture Keynote from TSMC’s Yuh Jier Mii

The main program for the 70th IEDM opened on Monday morning in San Francisco with an excellent keynote from Dr. Yuh-Jier Mii, Executive Vice President and Co-Chief Operating Officer at TSMC. Dr. Mii joined TSMC in 1994. Since then, he has contributed to the development and manufacturing of advanced CMOS technologies in both fab

Read More

CEO Interview: Mikko Utriainen of Chipmetrics

CEO Interview: Mikko Utriainen of Chipmetrics
by Daniel Nenni on 12-12-2024 at 6:00 am

Chipmetrics Founders

Tell us about your company?
Chipmetrics is a Finnish company specializing in metrology solutions for high aspect ratio 3D chips, especially 3D NAND and 3D DRAM with an eye on GAAFET and CFET structures. We are a young but mature company founded in 2019 with over 40 customers worldwide, and we’re looking to further scale up our international… Read More


Synopsys Brings Multi-Die Integration Closer with its 3DIO IP Solution and 3DIC Tools

Synopsys Brings Multi-Die Integration Closer with its 3DIO IP Solution and 3DIC Tools
by Mike Gianfagna on 12-10-2024 at 6:00 am

Synopsys Brings Multi Die Integration Closer with its 3DIO IP Solution and 3DIC Tools

There is ample evidence that technologies such as high-performance computing, next-generation servers, and AI accelerators are fueling unprecedented demands in data processing speed with massive data storage, lower latency, and lower power. Heterogeneous system integration, more commonly called 2.5 and 3D IC design, … Read More


A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design

A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design
by Mike Gianfagna on 12-04-2024 at 6:00 am

A Master Class with Ansys and Synopsys, The Latest Advances in Multi Die Design

2.5D and 3D multi-die design is rapidly moving into the mainstream for many applications. HPC, GPU, mobile, and AI/ML are application areas that have seen real benefits. The concept of “mix/match” for chips and chiplets to form a complex system sounds deceptively simple. In fact, the implementation and analysis techniques required… Read More


MZ Technologies is Breaking Down 3D-IC Design Barriers with GENIO

MZ Technologies is Breaking Down 3D-IC Design Barriers with GENIO
by Mike Gianfagna on 11-27-2024 at 10:00 am

MZ Technologies is Breaking Down 3D IC Design Barriers with GENIO

3D-IC design can be both exciting and frustrating. It’s exciting because it opens a new world of innovation possibilities – opportunities that aren’t constrained by the rules of monolithic chip scaling. It can be frustrating because of the large array of complex technical challenges that must be overcome to make this new paradigm… Read More


Silicon Creations is Fueling Next Generation Chips

Silicon Creations is Fueling Next Generation Chips
by Mike Gianfagna on 11-21-2024 at 6:00 am

Silicon Creations is Fueling Next Generation Chips

Next generation semiconductor design puts new stress on traditionally low-key parts of the design process. One example is packaging, which used to be the clean-up spot at the end of the design. Thanks to chiplet-based design, package engineers are now rock stars. Analog design is another one of those disciplines.

Not long ago,… Read More