WIth packaging being one of the top sources of traffic on SemiWiki, I am expecting a big crowd at this event. A semiconductor substrate is a foundational material used in the fabrication of semiconductor devices. Substrates are a critical part of the manufacturing process and directly affect the performance, reliability, and… Read More
Get Ready for a Shakeout in Edge NPUs
When the potential for AI at the edge first fired our imagination, semiconductor designers recognized that performance (and low power) required an accelerator and many decided to build their own. Requirements weren’t too complicated, commercial alternatives were limited and who wanted to add another royalty to further reduce… Read More
The Immensity of Software Development and the Challenges of Debugging Series (Part 4 of 4)
The Impact of AI on Software and Hardware Development
Part 4 of this series analyzes how AI algorithmic processing is transforming software structures and significantly modifying processing hardware. It explores the marginalization of the traditional CPU architecture and demonstrates how software is increasingly dominating… Read More
Alchip is Paving the Way to Future 3D Design Innovation
At the recent TSMC OIP Ecosystem Forum in Santa Clara, there was an important presentation that laid the groundwork for a great deal of future innovation. Alchip and its IP and EDA partner Synopsys presented Efficient 3D Chiplet Stacking Using TSMC SoIC. The concept of 3D, chiplet-based design certainly isn’t new. SemiWiki maintains… Read More
Handling Objections in UVM Code
You begin writing some UVM code and there are parts of the code that aren’t done yet, so you begin to use uvm_objection, guarding that code. Rich Edelman, a product engineer at Siemens doing verification debug and analysis, wrote a paper on this topic, which I just read. This blog covers the topic of objections and provides some different… Read More
GaN HEMT modeling with ANN parameters targets extensibility
Designers choosing gallium nitride (GaN) transistors may face a surprising challenge when putting the devices in their context. While the Advanced SPICE Model for GaN HEMTs (ASM-HEMT) model captures many behaviors like thermal and trapping effects, it grapples with accuracy over a wide range of bias conditions. Foundries … Read More
AMAT has OK Qtr but Mixed Outlook Means Weaker 2025 – China & Delays & CHIPS Act?
– AMAT has OK QTR but outlook below expectations as 2025 weakens
– Strength in AI cannot offset weakness in the rest of the market
– Increasing headwinds going into 2025 dampen overall outlook
– Weakness combined with regulatory uncertainty reduce valuations
Quarter and year are just OK but outlook is
… Read MorePodcast EP261: An Overview of the Upcoming 70th IEDM with Dr. Gaudenzio Meneghesso
Dan is joined by Dr. Gaudenzio Meneghesso, IEDM 2024 Publicity Co-Chair, and Head of the Department of Information Engineering at the University of Padua in Italy.
Dan explores the program for the upcoming IEDM event with Gaudenzio. This conference covers a wide range of innovations that have significant impact on the semiconductor… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay
– CHIPS Act more likely to be maimed & cut than outright killed
– Will Legislators reverse flow of equipment to Reshore from Offshore?
– Recent order cuts, Fab Delay & SMIC comments are all negative
– News flow for semi equipment all bad in front of AMAT
CHIPS Act Chops likely to occur under new administration
… Read MoreCEO Interview: Dr. Sakyasingha Dasgupta of EdgeCortix
Sakya is the founder and Chief Executive officer of EdgeCortix. He is an artificial intelligence (AI) and machine learning technologist, entrepreneur, and engineer with over a decade of experience in taking cutting edge AI research from ideation stage to scalable products, across different industry verticals. He has lead… Read More
Next Generation of Systems Design at Siemens