Arm is expanding its computing platform for an era in which artificial intelligence does more than respond to individual prompts. The company expects AI agents to operate continuously across phones, data centers, vehicles, robots and other physical systems—perceiving their surroundings, reasoning about objectives and … Read More
PDF Solutions CONNECT 2026: Where Semiconductor Data Meets AIThe semiconductor industry is entering a period in…Read More
Webinar – ChipAgents Shows You How to Break the Timing Closure Bottleneck with AIWe all know timing closure is one of…Read More
Jalapeño Hot Chip, Cool Power Bill: OpenAI Turns Up the Heat on AI InferenceOpenAI’s Jalapeño is a custom accelerator designed specifically…Read More
2026 Ceva Edge Symposium: Building Intelligence Beyond the CloudThe 2026 Ceva Edge Symposium will bring together…Read MoreRethinking AI Chips: How VSORA Redesigned the Hardware That Runs AI
Instead of tweaking existing designs, VSORA built an AI chip from scratch to fix the real bottleneck: moving data fast enough to keep the math circuits busy.
There’s a version of the AI hardware story that everyone in the chip industry has heard a hundred times. A startup raises money on a clever chip design, promises to topple… Read More
A Study of Photoresist Bake Influence on Stochastics for DUV Immersion Lithography
Deep-ultraviolet (DUV) immersion lithography remains a critical patterning technology for advanced semiconductor manufacturing. Using a 193 nm ArF exposure system with water between the projection lens and wafer, immersion lithography increases numerical aperture and enables smaller features than dry exposure. However,… Read More
UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips
Ceva and LG Electronics have joined forces to remove one of the biggest obstacles to ultra-wideband adoption: integrating a complete radio, baseband and software stack into a production system-on-chip. Their joint platform combines Ceva-Waves UWB baseband intellectual property and software with an RF front end developed… Read More
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
By Tim Messegee, Senior Director of Solutions Marketing at Rambus
PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs… Read More
CAST Moves the Full TCP/IP Stack into Hardware at 100 Gbps
CAST has introduced TCPIP-100G, a synthesizable intellectual-property core that implements a complete TCP/IP stack in hardware for ASICs and FPGAs. The core is designed to transmit and receive at up to 100 Gbps without depending on a host processor. That distinction is important: this is not simply a checksum engine or a network-interface… Read More
Semiconductor Engineering Has a State-Continuity Problem
Product realization depends not only on reaching the next engineering state, but on preserving the relationships between states from intent through qualification, release, and lifecycle learning.
Semiconductor development is usually described as a sequence of activities: architecture, design, fabrication, packaging,… Read More
Samtec Puts AI’s Interconnect Bottleneck on Display at ECOC and AI Infra Summit
Samtec is using two major 2026 industry events to make a clear engineering argument: faster accelerators alone will not determine the performance of next-generation artificial-intelligence infrastructure. The copper and optical links connecting chips, packages, boards, racks and data centers must scale in bandwidth, … Read More
Nvidia Sees AGI While OpenAI Sees Danger
Jensen Huang’s declaration that “AGI has arrived” is less a scientific verdict than a compressed statement about infrastructure, economics and momentum. His evidence is OpenAI’s GPT-6 Astra, reportedly trained on more than 100,000 Nvidia Grace Blackwell NVL72 systems, followed by a promise that another 400,000 GPUs are coming… Read More
Samsung Might Be the Most Unusual Company on Earth
Samsung might be the most unusual company on earth because it is difficult to decide what kind of company it actually is. To most consumers, Samsung means smartphones, televisions, refrigerators. Yet the name also appears on apartment towers, cargo ships, hospital equipment, insurance policies, construction projects, and… Read More



A Study of Photoresist Bake Influence on Stochastics for DUV Immersion Lithography