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Engineering the Next Era of Semiconductor Innovation

Engineering the Next Era of Semiconductor Innovation
by Kalar Rajendiran on 05-27-2026 at 8:00 am

Da Yang U2UNA2026 77

The semiconductor industry is entering a transformative new phase, driven by the convergence of artificial intelligence, cloud computing, and increasingly complex chip architectures. That message took center stage during the keynote talks at the Siemens EDA User2User 2026 North America conference. Executives from Siemens,… Read More


Trusted Convergence Governance: Preserving Admissibility Integrity Across Heterogeneous Semiconductor Systems

Trusted Convergence Governance: Preserving Admissibility Integrity Across Heterogeneous Semiconductor Systems
by Moh Kolb on 05-26-2026 at 8:00 am

Picture1 TCG (1)

As semiconductor systems evolve toward heterogeneous integration, chiplets, 2.5D and 3D packaging, distributed observability, runtime adaptation, Fleet Learning, and lifecycle convergence governance, the industry is entering a fundamentally new operational reality.

Convergence decisions are no longer driven only… Read More


CEO Interview with Vivek Raghunathan of Xscape Photonics

CEO Interview with Vivek Raghunathan of Xscape Photonics
by Daniel Nenni on 05-24-2026 at 4:00 pm

Vivek Raghunathan Xscape Photonics

Vivek Raghunathan has over 18 years of experience in silicon photonics. He was a Sr. Principal Engineer, Product Architect and Program Leader for Integrated Silicon Photonics at Broadcom driving key core technology development required to co-package optics with switches and demonstrated industry’s first 25.6T Ethernet … Read More


What Winemakers and Chip Designers Have in Common

What Winemakers and Chip Designers Have in Common
by Daniel Nenni on 05-22-2026 at 6:00 am

What Winemakers and Chip Designers Have in Common

Consider this a standout presentation at the Silicon Catalyst Spring Portfolio Update Meeting held yesterday at the Computer History Museum. Mahesh Tirupattur, CEO of Analog Bits, is a modern-day, multidimensional semiconductor hero and one of my trusted few. Analog Bits is a premier member of the semiconductor ecosystem,… Read More


Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC

Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC
by Daniel Nenni on 05-20-2026 at 10:00 am

SIemens EDA TSMC Teshnical Symposium 2026

At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More


imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling

imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling
by Daniel Nenni on 05-19-2026 at 6:00 am

TSMC 3DFabric Alliance Expansion Signals New Era of System Level Scaling

imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More


CEO Interview with Dr. Jekaterina Viktorova of Syenta

CEO Interview with Dr. Jekaterina Viktorova of Syenta
by Daniel Nenni on 05-13-2026 at 8:00 am

Headshot Jeka

Dr. Jekaterina (Jeka) Viktorova is the CEO and Co-Founder of Syenta, an Australian deep-tech company developing breakthrough additive manufacturing technology for the semiconductor industry. With a background in chemistry, electrochemistry, and advanced manufacturing, she is the inventor of the core Syenta technology… Read More


Beyond Tool Interoperability: The Emerging Governed Convergence Problem in Semiconductor Design

Beyond Tool Interoperability: The Emerging Governed Convergence Problem in Semiconductor Design
by Moh Kolb on 05-12-2026 at 10:00 am

Beyond Tool Interoperability The Emerging Governed Convergence Problem in Semiconductor Design

The semiconductor industry has spent decades optimizing tools. Today, however, the central challenge is no longer whether individual tools are powerful enough. The real question is whether increasingly specialized tools, domains, models, and organizations can still converge coherently into a manufacturable, reliable,… Read More


#DAC2026 Marks Another Pivotal Moment for the Semiconductor Industry

#DAC2026 Marks Another Pivotal Moment for the Semiconductor Industry
by Daniel Nenni on 05-12-2026 at 8:00 am

#DAC2026 SemiWiki

The 2026 Design Automation Conference (DAC 2026) marks another pivotal moment for the semiconductor and electronic systems industry as artificial intelligence, chiplets, heterogeneous integration, and system-level optimization redefine the future of design automation. Held July 26–29, 2026, at the Long Beach Convention… Read More


Panel Discission: Beyond Moore’s Law and the Future of Semiconductor Manufacturing

Panel Discission: Beyond Moore’s Law and the Future of Semiconductor Manufacturing
by Daniel Nenni on 05-11-2026 at 6:00 am

Beyond Moore's Law Future of Manufacturing

The semiconductor industry is entering a post-Moore’s Law era in which scaling transistor density alone is no longer sufficient to sustain historical performance growth. As discussed in the panel Beyond Moore’s Law: The Future of Semiconductor Manufacturing, the industry is increasingly dependent on advanced manufacturing… Read More