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Daniel Nenni at the 2024 Design Automation Conference

Daniel Nenni at the 2024 Design Automation Conference
by Daniel Nenni on 06-21-2024 at 4:00 pm

DAC 2024 Banner

This year’s live semiconductor ecosystem conferences have been well attend and I expect the same for #61DAC next week. I will be at the conference from Sunday afternoon to Wednesday evening, if you would like to meet let me know. Networking is an important part of the semiconductor ecosystem so let’s make it happen.… Read More


Mirabilis Design at the 2024 Design Automation Conference

Mirabilis Design at the 2024 Design Automation Conference
by Deepak Shankar on 06-18-2024 at 10:00 am

DAC 2024 Banner

This is the first time in 28 years of my visits to DAC that I have seen so many different technologies arrive at DAC in the same year.  Earlier we would have one or possibly two innovative breakthroughs in semiconductors and embedded systems that emerged at DAC. This year I expect six or may be seven to arrive, and I am not including the… Read More


Synopsys-AMD Webinar: Advancing 3DIC Design Through Next-Generation Solutions

Synopsys-AMD Webinar: Advancing 3DIC Design Through Next-Generation Solutions
by Kalar Rajendiran on 06-13-2024 at 10:00 am

The Synopsys Multi Die Solution

Introduction of 2.5D and 3D multi-die based products are helping extend the boundaries of Moore’s Law, overcoming limitations in speed and capacity for high-end computational tasks. In spite of its critical function within the 3DIC paradigm, the interposer die’s role and related challenges are often neither fully comprehended… Read More


3DIC Verification Methodologies for Advanced Semiconductor ICs

3DIC Verification Methodologies for Advanced Semiconductor ICs
by Kalar Rajendiran on 06-06-2024 at 10:00 am

3DIC Flow Challenges

At the recent User2user conference, Amit Kumar, Principal Hardware Engineer, Microsoft, shared the company’s experience from building a 3DIC SoC and highlighted Siemens EDA tools that were used. The following is a synthesis of core aspects of that talk.

3DIC Challenges

Despite the numerous advantages of 3DIC technology, its… Read More


Silicon Creations is Enabling the Chiplet Revolution

Silicon Creations is Enabling the Chiplet Revolution
by Mike Gianfagna on 06-04-2024 at 6:00 am

Silicon Creations is Enabling the Chiplet Revolution

The multi-die chiplet-based revolution is upon us. The ecosystem will need to develop various standards and enabling IP to make the “mix and max” concept a reality. UCIe, or Universal Chip Interconnect express is an open, multi-protocol on-package die-to-die interconnect and protocol standard that promises to pave the way … Read More


Anirudh Fireside Chats with Jensen and Cristiano

Anirudh Fireside Chats with Jensen and Cristiano
by Bernard Murphy on 05-14-2024 at 6:00 am

Fireside chat min

At CadenceLIVE 2024 Anirudh Devgan (President and CEO of Cadence) hosted two fireside chats, one with Jensen Huang (President and CEO of NVIDIA) and one with Cristiano Amon (President and CEO of Qualcomm). As you would expect both discussions were engaging and enlightening. What follows are my takeaways from those chats.

Anirudh

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Anirudh Keynote at CadenceLIVE 2024. Big Advances, Big Goals

Anirudh Keynote at CadenceLIVE 2024. Big Advances, Big Goals
by Bernard Murphy on 05-01-2024 at 6:00 am

Anirudh keynote at CadenceLive 2024

The great things about CEO keynotes, at least from larger companies, is that you not only learn about recent advances but you also get a sense of the underlying algorithm for growth. Particularly reinforced when followed by discussions with high profile partner CEOs on their directions and areas of common interest. I saw this recently… Read More


Enabling Imagination: Siemens’ Integrated Approach to System Design

Enabling Imagination: Siemens’ Integrated Approach to System Design
by Kalar Rajendiran on 04-30-2024 at 6:00 am

Siemens EDA Important to Siemens

In today’s rapidly advancing technological landscape, semiconductors are at the heart of innovation across diverse industries such as automotive, healthcare, telecommunications, and consumer electronics. As a leader in technology and engineering, Siemens plays a pivotal role in empowering the next generation … Read More


Alphawave Semi Bridges from Theory to Reality in Chiplet-Based AI

Alphawave Semi Bridges from Theory to Reality in Chiplet-Based AI
by Bernard Murphy on 04-25-2024 at 10:00 am

Alphawave Semi min

GenAI, the most talked-about manifestation of AI these days, imposes two tough constraints on a hardware platform. First, it demands massive memory to serve large language model with billions of parameters. Feasible in principle for a processor plus big DRAM off-chip and perhaps for some inference applications but too slow … Read More


The Data Crisis is Unfolding – Are We Ready?

The Data Crisis is Unfolding – Are We Ready?
by Kalar Rajendiran on 04-09-2024 at 6:00 am

Global Data Sphere for Healthcare Data

The rapid advancement of technology, including generative AI, IoT, and autonomous vehicles, is revolutionizing industries and enhancing efficiency. At the same time, such advances also generate huge amounts of data to be transmitted and processed to make sense and provide value to consumers and society as a whole. In essence,… Read More