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All-Embracing Multiphysics Analysis for Chiplet-Based Systems

All-Embracing Multiphysics Analysis for Chiplet-Based Systems
by Bernard Murphy on 06-24-2026 at 6:00 am

Revised multiphysics graphic

What systems can accomplish by combining semiconductors, AI, and software seems at times boundless. Chiplet-based semiconductors deliver this promise, allowing a myriad of complex digital, memory, analog and photonic functions to be condensed into a single semiconductor package for higher performance, lower power consumption… Read More


AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoption

AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoption
by raghu shankar on 06-22-2026 at 6:00 am

2026 Jun AI Native Virtual Chiplet ecosystem Shift Left Shift Up Shift Out

Systems-in-package (SIPs) with 2.5D and 3D heterogenous integration, consisting of multiple dies and chiplets deliver 10x more functionality than traditional monolithic chips. This capability enables innovative solutions for diverse needs in scientific computing, automotive, edge computing, and aerospace/defense.… Read More


Feed Forward Intelligence: Enabling Testability in the Chiplets Era

Feed Forward Intelligence: Enabling Testability in the Chiplets Era
by Kalar Rajendiran on 06-18-2026 at 6:00 am

Data Feed Forward Architecture

The semiconductor industry is entering a new era in which advanced packaging and chiplets-based architectures are becoming the primary drivers of system-level innovation. As traditional process-node scaling becomes increasingly complex and expensive, manufacturers are turning to heterogeneous integration, combining… Read More


Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions

Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions
by Daniel Nenni on 06-17-2026 at 2:00 pm

Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions

Synopsys has announced the availability of the first wave of its Multiphysics Fusion Solutions, extending its vision of a unified engineering environment that connects EDA, semiconductor physics, system simulation, and artificial intelligence-driven optimization. The announcement addresses one of the most significant… Read More


The Memory Sector Is Becoming One of the Main Beneficiaries of the AI Boom

The Memory Sector Is Becoming One of the Main Beneficiaries of the AI Boom
by Daniel Nenni on 06-11-2026 at 10:00 am

The Memory Sector Is Becoming One of the Main Beneficiaries of the AI Boom

The explosive growth of artificial intelligence is transforming the semiconductor industry, and nowhere is this more evident than in the memory sector. AI training and inference workloads are fundamentally memory-intensive, driving unprecedented demand for advanced DRAM architectures, High Bandwidth Memory (HBM), and… Read More


Technical Paper: FPGA Prototyping That Creates Useful PreSilicon Evidence

Technical Paper: FPGA Prototyping That Creates Useful PreSilicon Evidence
by Daniel Nenni on 06-11-2026 at 6:00 am

FPGA Prototyping Beyond RTL Fit Building Useful Pre Silicon Evidence

As semiconductor designs continue to grow in complexity, FPGA prototyping has become an essential component of modern pre-silicon validation strategies. While FPGA capacity and gate-count equivalence often dominate discussions around prototyping platforms, the true value of an FPGA prototype lies elsewhere: its ability… Read More


From Evidence to Authority: Bounded Gate Authority for Governed Semiconductor Realization

From Evidence to Authority: Bounded Gate Authority for Governed Semiconductor Realization
by Moh Kolb on 06-09-2026 at 6:00 am

Picture1 BGA JUne2

Advanced semiconductor systems are no longer limited by a single engineering domain. They are constrained by the convergence of many interdependent vectors: silicon nodes, advanced packaging architectures, substrate materials, platform PCBs, power-delivery networks, thermal behavior, manufacturing variation, firmware… Read More


Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools

Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools
by Daniel Nenni on 06-04-2026 at 6:00 am

synopsys intel linkedin update 1200x1200 v3

As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More


Convergence Evidence Maturity Hierarchy: From Raw Data to Convergence-Authoritative Evidence

Convergence Evidence Maturity Hierarchy: From Raw Data to Convergence-Authoritative Evidence
by Moh Kolb on 06-03-2026 at 8:00 am

Picture1 CEMH

The semiconductor industry is generating more engineering data than ever before.

This article follows the previously published GFL and TCG foundation pieces. GFL introduced the lifecycle-governance problem. TCG clarified why observable or interoperable data is not automatically trustworthy convergence evidence. CEMH… Read More


A Look at the High-Profile Speakers Presenting at #DAC2026

A Look at the High-Profile Speakers Presenting at #DAC2026
by Mike Gianfagna on 06-01-2026 at 10:00 am

A Look at the High Profile Speakers Presenting at #DAC2026

Many of us think of DAC as an important trade show for the Semiconductors and EDA industries. That is certainly part of the history of DAC, but the event is also a highly prestigious technical conference dating back to 1964. In fact, the exhibits at DAC began 20 years after the conference started. That long history as a premier technical… Read More