The rapid rise of artificial intelligence is fundamentally reshaping computing architectures. As AI models scale toward trillions of parameters, traditional approaches to performance improvement are no longer sufficient. Instead, the industry is entering a new era where system-level innovation, advanced packaging, … Read More
The Shift to System-Level AI Drives Next-Generation Silicon
At its 2026 Technology Symposium, TSMC delivered a clear message: the AI era has entered a new phase. The primary constraint is no longer model capability, but the systems required to run those models at scale. Addressing this shift will demand significant advances in semiconductor technology, spanning compute, memory, interconnects,… Read More
Closing the Reality Gap: A New Architecture for 1.8-Tb/s Chiplet Governance
Dr. Moh Kolbehdari is a Senior Lead Architect at Socionext, where he specializes in the industrialization of high-performance AI chiplets and 1.8-Tb/s interconnects. With over two decades of experience in SI/PI, electromagnetic field theory, and system-level architecture, he has been a pivotal force in bridging the gap between… Read More
Alchip’s Leadership in ASIC Innovation: Advancing Toward 2nm Semiconductor Technology
Alchip Technologies has recently reported significant progress in the development of advanced 2nm ASICs, positioning itself as a leader in next-generation semiconductor design for AI and HPC. The announcement highlights Alchip’s efforts to commercialize cutting-edge chip technologies and deliver highly customized … Read More
Synopsys Advances Hardware Assisted Verification for the AI Era
At the 2026 Synopsys Converge Event, Synopsys announced a broad set of new products and platform upgrades, with its hardware-assisted verification (HAV) announcement emerging as a key highlight within that lineup. A key aspect of this announcement was moving beyond a hardware centric model to a more scalable, programmable … Read More
Scaling Multi-Die Connectivity: Automated Routing for High-Speed Interfaces
This article concludes the three-part series examining key methodologies required for successful multi-die design. The first article Reducing Risk Early: Multi-Die Design Feasibility Exploration focused on feasibility exploration and early architectural validation, while the second article Building the Interconnect… Read More
Podcast EP335: The Far Reaching Impact of UCIe with Dr. Debendra Das Sharma
Daniel is joined by Dr. Debendra Das Sharma, a Senior Fellow and Chief I/O architect in the Data Platforms and Artificial Intelligence Group at Intel. He is a member of the National Academy of Engineering (NAE), Fellow of IEEE, and Fellow of International Academy of AI Sciences. He is a leading expert on I/O subsystem and interface… Read More
Qnity and Silicon Catalyst Light a Path to Success at the Chiplet Summit
The Chiplet Summit recently concluded. Multi-die heterogeneous design is a hot topic these days and chiplets are a key enabler for this trend. The conference was noticeably larger this year. There were many presentations and exhibits that focused on areas such as how to design chiplets, what standards are important, how to integrate… Read More
Why Your LLM-Generated Testbench Compiles But Doesn’t Verify: The Verification Gap Problem
By Vikash Kumar, Senior Verification Architect | Arm | IEEE Senior Member.
The Problem Every Verification Engineer Recognizes
You ask an LLM to generate a UVM testbench. It produces 25 files. Everything compiles. You run the simulation — and nothing happens. The scoreboard reports zero checks. The slave driver stops after 10… Read More
Keynote: On-Package Chiplet Innovations with UCIe
In the rapidly evolving landscape of semiconductor technology, the Universal Chiplet Interconnect Express (UCIe) emerges as a groundbreaking open standard designed to revolutionize on-package chiplet integrations. Presented by Dr. Debendra Das Sharma, Chair of the UCIe Consortium and Intel Senior Fellow, at the Chiplet… Read More


ASML High-NA EUV is Not Ready for High-Volume Production