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Intel’s historical dominance in semiconductor process technology began to erode around 2018, as competitors started delivering higher performance at smaller nodes. In response, Intel is now doubling down on innovation across two fronts: advanced process nodes such as Intel 18A and 14A, and cutting-edge packaging technologies.… Read More
Intel, long a leader in semiconductor manufacturing, is on a determined journey to reclaim its technological leadership in the industry. After facing significant challenges in recent years, the company is making a concerted effort to adapt and innovate, with a clear focus on AI-driven technologies, advanced packaging solutions,… Read More
At the recent IPSoC Conference in Silicon Valley, Aparna Tarde gave a talk on the importance of Next-Gen Interconnects to scale AI infrastructure. Aparna is a Sr. Technical Product Manager at Synopsys. A synthesis of the salient points from her talk follows.
The rapid advancement of artificial intelligence (AI) is fundamentally… Read More
Every spring, the ESD Alliance, a SEMI Technology Community, organizes a get together where industry executives and experts gather to network and talk about trends in the electronic design automation industry.
The theme of this year’s event, once again co-hosted by Keysight, is “How Multi-Physics is Reshaping Chip Design and… Read More
In today’s rapidly evolving digital landscape, the security of electronic systems is of the highest priority. This importance is underscored by technological advancements and increasing regulatory demands. Multi-die designs which integrate multiple dies (also called chiplets) into a single package, introduce … Read More
The annual SNUG (Synopsys Users Group) conference, now in its 35th year, once again brought together key stakeholders to showcase accomplishments, discuss challenges, and explore opportunities within the semiconductor and electronics industry. With approximately 2,500 attendees, SNUG 2025 served as a dynamic hub for collaboration… Read More
Automotive electronics is a fast-moving space, especially around sensing and distilling intelligence from that sensing. This serves three main pillars: autonomy, electrification and advances in the car cockpit. Autonomy at multiple levels remains an important goal and continues to advance, technically and geographically.… Read More
Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More
Tell us a little bit about yourself and your company.
I am Rui Tang, co-founder and VP of MSquare Technology. With a Ph.D. in Computer Engineering from Northeastern University and a master’s degree in management science and engineering from Stanford University, I bring over 23 years of experience in the IC industry. Prior to MSquare,… Read More
Last week, Synopsys announced an expansion of their Hardware-Assisted Verification (HAV) portfolio to accelerate semiconductor design innovations. These advancements are designed to meet the increasing demands of semiconductor complexity, enabling faster and more efficient verification across software and hardware… Read More
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Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot