IMGTC Webinar SemiWIki
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Hot Chips 2026: Architectures for the Agentic Computing Era

Hot Chips 2026: Architectures for the Agentic Computing Era
by Daniel Nenni on 08-19-2026 at 2:00 pm

Hot Chips 2026 Agentrys Quadric SemiWiki

Hot Chips 2026, formally the thirty-eighth Symposium on High Performance Chips, arrives at Stanford’s Memorial Auditorium from August 23 through 25 with a program that captures a decisive shift in computer architecture. Peak arithmetic throughput remains important, but the conference is increasingly about system balance:… Read More


Comparing Intel EMIB and Intel Foveros

Comparing Intel EMIB and Intel Foveros
by Daniel Nenni on 08-12-2026 at 10:00 am

Comparing Intel EMIB and Intel Foveros SemiWiki

Intel EMIB and Intel Foveros are advanced semiconductor-packaging technologies designed to combine multiple silicon dies, or chiplets, within one processor package. Both support heterogeneous integration: manufacturers can build different functions using the process technology best suited to each one, then connect … Read More


Imec Unlocks System-Level III-V Chiplet Integration on Si-CMOS with Advanced 300mm RF Silicon Interposer Platform

Imec Unlocks System-Level III-V Chiplet Integration on Si-CMOS with Advanced 300mm RF Silicon Interposer Platform
by Daniel Nenni on 08-05-2026 at 6:00 am

Imec Unlocks System Level III V Chiplet Integration on Si CMOS

As wireless communication systems evolve toward 6G, satellite connectivity, advanced radar, and high-performance sensing applications, the integration of heterogeneous semiconductor technologies has become a critical challenge. Silicon CMOS remains the dominant platform for digital processing and system control,… Read More


Executive Interview with James Huang of AlChip

Executive Interview with James Huang of AlChip
by Daniel Nenni on 08-03-2026 at 2:00 pm

James Huang

I had a chance sit down with James Huang, Director of Engineering at Alchip Technologies, to discuss the company’s recent multi-die packaging achievements and learn about Alchip’s next steps in pushing the boundaries of innovation for next generation AI ASIC.

James is acknowledged as a leading light in advanced node ASICs, based… Read More


Synopsys Demonstrates Leadership in AI-Powered Engineering at 2026 DAC Chips to Systems Conference

Synopsys Demonstrates Leadership in AI-Powered Engineering at 2026 DAC Chips to Systems Conference
by Daniel Nenni on 08-03-2026 at 10:00 am

dac hero image snps nvd 16 9

Purple was in fashion at the 2026 Design Automation Conference, where Synopsys reinforced its position at the forefront of AI-powered engineering. Under the conference’s “Chips to Systems” theme, the company showcased intelligent, end-to-end technologies designed to help the semiconductor industry manage unprecedented… Read More


From Process Learning to Production Control: Characterization for the Era of Heterogeneous Systems

From Process Learning to Production Control: Characterization for the Era of Heterogeneous Systems
by Kalar Rajendiran on 07-27-2026 at 6:00 am

Chiplets Have Changed the Test Paradigm

Every generation of semiconductor innovation has relied on one fundamental principle: before a technology can be manufactured at scale, it must first be understood. That understanding comes through characterization.

For decades, characterization enabled process learning. It helped engineers understand transistor behavior,… Read More


TSMC CoPoS Versus Intel EMIB Semiconductor Packaging

TSMC CoPoS Versus Intel EMIB Semiconductor Packaging
by Daniel Nenni on 07-24-2026 at 10:00 am

TSMC CoPos Versus Intel EMIB 2026

TSMC’s CoPoS, generally described as Chip-on-Panel-on-Substrate, and Intel’s EMIB, or Embedded Multi-die Interconnect Bridge, address the same strategic problem: integrating increasingly large, heterogeneous chiplet systems. However, they attack different physical constraints. CoPoS is an emerging panel-level … Read More


The Architecture of Success: Why a Unified Semiconductor IP Strategy Is the Foundation of Modern SoC Design

The Architecture of Success: Why a Unified Semiconductor IP Strategy Is the Foundation of Modern SoC Design
by Kalar Rajendiran on 07-21-2026 at 10:00 am

Application Contexts That Span Markets

As architects push toward advanced nodes and increasingly demanding workloads, modern silicon design has entered an era of unprecedented complexity. A single design respin can cost millions of dollars and delay market entry. Against this backdrop, designs must be balanced for performance, bandwidth, power efficiency, security… Read More


CEO Interview with Mohit Gupta of TYLsemi

CEO Interview with Mohit Gupta of TYLsemi
by Daniel Nenni on 07-19-2026 at 4:00 pm

Mohit

Mohit Gupta founded TYLsemi to build chiplet-based intelligent power and connectivity solutions for AI infrastructure—an area where custom silicon has long been underserved. TYLsemi exists to provide the foundational chiplet platform that enables tailored custom silicon solutions for the evolving needs of AI infrastructure.… Read More


Arteris at DAC 2026 Connecting Innovation for Silicon Success

Arteris at DAC 2026 Connecting Innovation for Silicon Success
by Daniel Nenni on 07-15-2026 at 6:00 am

Arteris Company banner

The semiconductor industry has entered a new era as AI workloads, chiplets, heterogeneous computing, software-defined vehicles, and intelligent edge devices are transforming how chips are designed.

Silicon success is no longer determined by transistor counts alone, but by how efficiently data moves across increasingly… Read More