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Electronic Design Automation
Image RemovedThe symbol for a PowerMOS device in a converter circuit schematic looks simple enough. However, it belies a great deal of hidden complexity. A single device is actually a huge array of parallel intrinsic devices connected together to act as a single high power device. While their gate lengths are small, as with many… Read More
In order to beat Moore’s Law NAND Flash memories have moved from a planar topology to 3D construction. This allows for increased memory sized in much the same way a multistory building provides more building square footage on the same size building lot. Just like in building construction, adding a third dimension to the mix increases… Read More
Three years ago my youngest son purchased a $17 smart watch on eBay, but then my oldest son read an article warning about how that watch would sync with your phone, then send all of your contact info to an address in China. My youngest son then wisely turned the watch off, and never used it again. Hackers have been able to spoof and hide … Read More
Autonomous vehicle progress is in the daily news, so it’s quite exciting to watch it develop with the help of SoC design, sensors, actuators and software from engineering teams spanning the entire globe. Tesla vehicles have reached Level 2 autonomy, Audi e-tron is at Level 3, and Waymo nearly at Level 5 with robot taxis being… Read More
I mentioned a while back that I’m really getting into the role that sensors play in our new hyper-connected world – in the IoT, intelligent cars, homes, cities, industry, utilities, medicine, agriculture, etc, etc. If we can think of a way to sense it and connect it, someone is probably already doing it. But there’s more to … Read More
Innovations in packaging have played an important role in improving system performance and area utilization. Advances like 2.5D interposers and fan-out wafer-level packaging (FOWLP) have allowed mixed dies to be used in a single package and have dramatically reduced the number of connections that need to go all the way to the… Read More
Image RemovedAs a professional semiconductor event attendee I can pretty much tell if an event will be successful by looking at the agenda. What I look for is simple, customer presentations. Not company presentations or partner presentations but actual customer case studies presented by name brand companies. For this event … Read More
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ClioSoft has been working with the leading cloud computing providers running experiments on various EDA cloud architectures for a while now. One example of that was a project with Google I previously wrote a blog about, For EDA Users: The Cloud Should Not Be Just a Compute Farm. Since then, ClioSoft has also teamed … Read More
Modern cars have about as much in common with their predecessors as modern cell phones have in common with dial up land-line phones. Cars now are loaded with a bevy of electronics, some of which serve the convenience of the driver and others are essential for vehicle operation and occupant safety. With the introduction of sophisticated… Read More
The 50th International Test Conference was just held in Washington DC, where papers, sessions, workshops and announcements addressing the increasing complexity and expanding use of semiconductors showed that innovations in test are crucial to design and product success. Test methodologies and even the scope of test have … Read More
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Prototyping with Intel's New 80M Gate FPGA and S2C!
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REPLAY: Avoiding CDM (Charged Device Model) ESD Failures
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Why is Intel still short on chips?