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Methods for Current Density and Point-to-point Resistance Calculations

Methods for Current Density and Point-to-point Resistance Calculations
by Daniel Payne on 05-26-2022 at 10:00 am

ESD path min

IC reliability is an issue that circuit design engineers and reliability engineers are concerned about, because physical effects like high Current Density (CD) in interconnect layers, or high point-to-point (P2P) resistance on device interconnect can impact reliability, timing or Electrostatic Discharge (ESD) robustness.… Read More


Very Short Reach (VSR) Connectivity for Optical Modules

Very Short Reach (VSR) Connectivity for Optical Modules
by Kalar Rajendiran on 05-26-2022 at 6:00 am

Synopsys 112G Ethernet PHY IP for VSR

Bandwidth, latency, power and reach are always the key points of focus when it comes to connectivity. As the demand for more data and higher bandwidth connectivity continue, power management is gaining a lot of attention. There is renewed interest in pursuing silicon photonics to address many of these challenges. There are many… Read More


Refined Fault Localization through Learning. Innovation in Verification

Refined Fault Localization through Learning. Innovation in Verification
by Bernard Murphy on 05-25-2022 at 6:00 am

Innovation New

This is another look at refining the accuracy of fault localization. Once a bug has been detected, such techniques aim to pin down the most likely code locations for a root cause. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue… Read More


3D IC Update from User2User

3D IC Update from User2User
by Daniel Payne on 05-24-2022 at 10:00 am

FO WLP min

Our smart phones, tablets, laptops and desktops are the most common consumer products with advanced 2.5D and 3D IC packaging techniques. I love seeing the product tear down articles to learn how advanced packaging techniques are being used, so at the User2User conference in Santa Clara I attended a presentation from Tarek Ramadan,… Read More


Unlocking PA design with predictive DPD

Unlocking PA design with predictive DPD
by Don Dingee on 05-23-2022 at 10:00 am

Predictive DPD virtual test bench

Next up in this series on modulated signals is an example of multi-dimensional EM design challenges: RF power amplifiers (PAs). Digital pre-distortion (DPD) is a favorite technique for linearizing PA performance. Static effects are easy to model and correct, but PAs are notorious for interrelated dynamic effects spoiling … Read More


Protecting High-Speed Interfaces in Data Centers with Security IP

Protecting High-Speed Interfaces in Data Centers with Security IP
by Kalar Rajendiran on 05-23-2022 at 6:00 am

SoCs Have Many Interfaces That Require Security

The never ending appetite for higher bandwidths, faster data interfaces and lower latencies are bringing about changes in how data is processed at data centers. The expansion of cloud to the network edge has introduced broad use of artificial intelligence (AI) techniques for extracting meaning from data. Cloud supercomputing… Read More


Take a Leap of Certainty at DAC 2022

Take a Leap of Certainty at DAC 2022
by Daniel Nenni on 05-22-2022 at 6:00 am

Ansys DAC 2022

The live events I have attended thus far this year have been very good. As much as I liked the virtual events, attending in the comfort of my home or sailboat, it is great to be live and networking inside the semiconductor ecosystem, absolutely.

Ansys has been a great supporter of the Design Automation Conference but this year they … Read More


Joseph Sawicki of Siemens EDA at User2User

Joseph Sawicki of Siemens EDA at User2User
by Daniel Payne on 05-19-2022 at 10:00 am

Joseph Sawicki

I attended the annual user group meeting called User2User in Santa Clara this year, hosted by Siemens EDA, with 51 presentations by customers in 11 tracks, and keynotes during each lunch hour from semiconductor executives. Joseph Sawicki, Executive VP, IC Segment, at Siemens EDA presented on a Tuesday, along with Prashant Varshney,… Read More


224G Serial Links are Next

224G Serial Links are Next
by Daniel Nenni on 05-17-2022 at 6:00 am

link designs

The tremendous increase in global data traffic over the past decade shows no sign of abating.  Indeed, the applications for all facets of data communications are expanding, from 5G (and soon, 6G) wireless communications to metropolitan area networks serving autonomous vehicles to broader deployment of machine learning algorithms. … Read More


Cybersecurity Threat Detection and Mitigation

Cybersecurity Threat Detection and Mitigation
by Daniel Payne on 05-16-2022 at 10:00 am

Embedded Analytics min

Every week in the technology trade press I am reading about cybersecurity attacks against web sites, apps, IoT devices, vehicles and even ICs. At the recent IP SoC Silicon Valley 2022 event in April I watched a cybersecurity  presentation from Robert Rand, Solution Architect for Tessent Embedded Analytics at Siemens EDA. Common… Read More