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Innovation in Verification

Innovation in Verification
by Bernard Murphy on 01-09-2020 at 6:00 am

Innovation

I’m kicking off a blog series which should appeal to many of us in functional verification. Paul Cunningham (GM of the Verification Group at Cadence), Jim Hogan (angel investor and board member extraordinaire) and I (sometime blogger) like to noodle from time to time on papers and other verification articles which inspire us.… Read More


Saving Time in Physical Verification by Reusing Metadata

Saving Time in Physical Verification by Reusing Metadata
by Daniel Payne on 01-08-2020 at 10:00 am

voltage propagation cross reference data min

Physical verification is an important and necessary step in the process to tapeout an IC design, and the foundries define sign-off qualification steps for:

  • Physical validation
  • Circuit validation
  • Reliability verification

This sounds quite reasonable until you actually go through the steps only to discover that some of the … Read More


PAVE360 is Fully Armed!

PAVE360 is Fully Armed!
by Daniel Nenni on 01-06-2020 at 12:00 pm

PAve360 and Arm IP accelerates innovation

Image Removed

Siemens today announced a partnership with Arm to “accelerate the future of mobility by redefining design capabilities for complex electronic systems”. I spent time with David Fritz to understand what this really means. You may remember David from our webinar PAVE360: Of SoCs, Digital Twins, and Validating AutonomousRead More


Photonics Come into Focus: 2020 Predictions

Photonics Come into Focus: 2020 Predictions
by Rich Goldman on 01-02-2020 at 10:00 am

Photonics 2020 Predictions

In the past, I’ve focused my annual predictions on electronics – ICs and EDA – but recently I’ve turned my focus to photonics, so my 2020 predictions are primarily in this area.

Historically, photonics has been the Gallium Arsenide of technologies; it was, is and always will be the technology of the future. Analysts have forever … Read More


ANSYS, TSMC Document Thermal Reliability Guidelines

ANSYS, TSMC Document Thermal Reliability Guidelines
by Bernard Murphy on 01-01-2020 at 6:00 am

Automotive Reliability Guide min

Advanced IC technologies, 5nm and 7nm FinFET design and stacked packaging, are enabling massive levels of integration of super-fast circuits. These in turn enable much of the exciting new technology we hear so much about: mobile gaming and ultra-high definition mobile video through enhanced mobile broadband in 5G, which requires… Read More


Computing with Light

Computing with Light
by Daniel Nenni on 12-27-2019 at 6:00 am

Evolution of programmable photonics

I recently wrote about this year’s Cadence Photonics Summit. As I mentioned in that post, it was a fascinating event with several companies providing useful and informative presentations. You can access some of the presentations on the event site. One presentation, given by Jose Capmany of iPronics, was especially interesting… Read More


Avoiding Fines for Semiconductor IP Leakage

Avoiding Fines for Semiconductor IP Leakage
by Daniel Payne on 12-24-2019 at 10:00 am

Percipient IPLM

In my semiconductor and EDA travels I’ve enjoyed visiting engineers across the USA, Canada, Europe, Japan, Taiwan and South Korea. I’ll never forget on one trip to South Korea where I was visiting a semiconductor company and upon reaching the lobby a security officer asked me to take out my laptop computer, because he wanted me to… Read More


Debugging Hardware Designs Using Software Capabilities

Debugging Hardware Designs Using Software Capabilities
by Daniel Nenni on 12-20-2019 at 6:00 am

Every few months, I touch base with Cristian Amitroaie, CEO of AMIQ EDA, to learn more about how AMIQ is helping hardware design and verification engineers be more productive. Quite often, his answers surprise me. When he started describing their Design and Verification Tools (DVT) Eclipse Integrated Development Environment… Read More


Full Solution for eMRAM Coming in 2020

Full Solution for eMRAM Coming in 2020
by Tom Simon on 12-19-2019 at 6:00 am

Trimming for eMRAM in Tessent

It’s amazing to think that Apollo moon mission used computers that were based on magnetic core memories. Of course, CMOS memories superseded them rapidly. However, over the decades since, memory technologies have advanced significantly, in terms of density, power and new types of technologies, e.g NAND Flash. Ever since the… Read More


Ultra-Short Reach PHY IP Optimized for Advanced Packaging Technology

Ultra-Short Reach PHY IP Optimized for Advanced Packaging Technology
by Tom Dillinger on 12-18-2019 at 10:00 am

Frequent Semiwiki readers are no doubt familiar with the rapid advances in 2.5D heterogeneous multi-die packaging technology.  A relatively well-established product sector utilizing this technology is the 2.5D integration of logic die with a high-bandwidth memory (HBM) DRAM die stack on a silicon interposer;  the interposer… Read More