WP_Term Object
(
[term_id] => 14
[name] => Synopsys
[slug] => synopsys
[term_group] => 0
[term_taxonomy_id] => 14
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 528
[filter] => raw
[cat_ID] => 14
[category_count] => 528
[category_description] =>
[cat_name] => Synopsys
[category_nicename] => synopsys
[category_parent] => 157
[is_post] =>
)
WP_Term Object
(
[term_id] => 14
[name] => Synopsys
[slug] => synopsys
[term_group] => 0
[term_taxonomy_id] => 14
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 528
[filter] => raw
[cat_ID] => 14
[category_count] => 528
[category_description] =>
[cat_name] => Synopsys
[category_nicename] => synopsys
[category_parent] => 157
[is_post] =>
)
MIPI may have started out as a standard for mobile phones, but it has become very important for connecting cameras and displays in a wide range of other things such as cameras, computers, drones, VR glasses, IoT devices and cars. Along the way it has matured by adding important features to support new applications. Now when we talk… Read More
When USB initially came out it revolutionized how peripherals connect to host systems. We all remember when Apple did away with many separate connections for mouse, keyboard, audio and more with their first computers supporting USB. USB has continued to develop more flexibility and more throughput. In 2015 Apple again introduced… Read More
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The presentation covered here from Synopsys focuses on the… Read More
Synopsys has released a Technical Bulletin entitled “Parallel-Based PHY IP for Die-to-Die Connectivity”. The piece is authored by Manuel Mota, senior product marketing manager, staff at Synopsys. Manuel has worked at Synopsys for 11 years in the IP area. Prior to that, he worked at MIPS Technologies, Chipidea (acquired… Read More
Looking at a typical SoC design today it’s likely to contain a massive amount of memory IP, like: RAM, ROM, register files. Keeping memory close to the CPU makes sense for the lowest latency and highest performance metrics, but what about process variations affecting the memory operation? At the recent DAC conference held… Read More
The ARC Processor has a rich history. Originally named the Argonaut RISC Processor, it was designed for the Nintendo Game Systems in the 1990s. Argonaut Technologies Limited later became ARC International. My first intimate exposure to ARC was in 2009 when Virage Logic acquired ARC. A year later Virage was acquired by Synopsys… Read More
High-speed communication is a critical component for many applications, most notably in the data center. The serializer/deserializer physical interface, or SerDes PHY is the backbone of many different forms of high-speed communication for this application. Use cases include on chip, between chips, between boards and racks… Read More
Semiconductor IP is one of the most talked about topics on SemiWiki. Always has been, always will be. Synopsys is also one of the most talked about topics on SemiWiki and IP is a very big part of that, absolutely.
After reading Eric Esteve’s latest IP Report I Googled around and found some interesting things. First, I found a Brief History… Read More
Synopsys announced an addition to its popular DesignWare IP portfolio recently that has some significant ramifications. The company announced the industry’s first complete USB4 IP solution. Before we get into the details of the announcement, let’s take a quick look at the USB standard and why it’s important.
Standards… Read More
About 90 days ago, Synopsys completed the acquisition of certain IP assets from eSilicon. The remaining entirety of eSilicon was acquired by Inphi Corporation. I was the VP of marketing at eSilicon during that acquisition so it’s very interesting to me to find out how things are going with those certain IP assets. I got an opportunity… Read More
Array
(
[0] => tribe-events-list-widget-5
[1] => search-2
[2] => media_image-13
[3] => better_recent_comments-2
[4] => media_image-12
)
WP_Term Object
(
[term_id] => 14
[name] => Synopsys
[slug] => synopsys
[term_group] => 0
[term_taxonomy_id] => 14
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 528
[filter] => raw
[cat_ID] => 14
[category_count] => 528
[category_description] =>
[cat_name] => Synopsys
[category_nicename] => synopsys
[category_parent] => 157
[is_post] =>
)
Tribe__Events__List_Widget Instance: 5Array
(
[title] => Upcoming Events
[limit] => 5
[no_upcoming_events] =>
[featured_events_only] =>
[jsonld_enable] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] => 1
)
Array
(
[title] => Upcoming Events
[limit] => 5
[no_upcoming_events] =>
[featured_events_only] =>
[jsonld_enable] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] => 1
)
WP_Widget_Search Instance: 2Array
(
[display_widget_title] => on
[title] => Search Semiwiki
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] => 1
[rw_opt_exclude] => Array
(
)
)
Array
(
[display_widget_title] => on
[title] => Search Semiwiki
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] => 1
[rw_opt_exclude] => Array
(
)
)
WP_Widget_Media_Image Instance: 13Array
(
[display_widget_title] => on
[size] => full
[width] => 400
[height] => 400
[caption] =>
[alt] => Webinar 2
[link_type] => custom
[link_url] => https://attendee.gotowebinar.com/register/9157755792430558219?source=SemiWiki
[image_classes] =>
[link_classes] =>
[link_rel] =>
[link_target_blank] =>
[image_title] =>
[attachment_id] => 292409
[url] => https://semiwiki.com/wp-content/uploads/2020/10/Webinar-2.jpg
[title] =>
[display_widget_mobile] =>
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
)
Barn2\Plugin\Better_Recent_Comments\Widget Instance: 2Array
(
[title] => Recent Article Comments
[number] => 8
[avatar] =>
[date] => 1
[comment] => 1
[link] => 1
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
)
Array
(
[title] => Recent Article Comments
[number] => 8
[avatar] =>
[date] => 1
[comment] => 1
[link] => 1
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
)
WP_Widget_Media_Image Instance: 12Array
(
[display_widget_title] => on
[size] => full
[width] => 400
[height] => 400
[caption] =>
[alt] => WIKI White Paper HDL Simulation Acceleration for Microchip FPGA Designs
[link_type] => custom
[link_url] => https://bit.ly/31zAnwy
[image_classes] =>
[link_classes] =>
[link_rel] =>
[link_target_blank] =>
[image_title] =>
[attachment_id] => 292410
[url] => https://semiwiki.com/wp-content/uploads/2020/10/WIKI_White-Paper_HDL-Simulation-Acceleration-for-Microchip-FPGA-Designs.jpg
[title] =>
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] =>
)
Array
(
[0] => rpwe_widget-9
[1] => gtranslate-3
[2] => media_image-8
[3] => xfrp_widget-2
[4] => media_image-9
)
WP_Term Object
(
[term_id] => 14
[name] => Synopsys
[slug] => synopsys
[term_group] => 0
[term_taxonomy_id] => 14
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 528
[filter] => raw
[cat_ID] => 14
[category_count] => 528
[category_description] =>
[cat_name] => Synopsys
[category_nicename] => synopsys
[category_parent] => 157
[is_post] =>
)
Recent_Posts_Widget_Extended Instance: 9Array
(
[title] => Trending Now
[title_url] =>
[ignore_sticky] => 1
[exclude_current] => 1
[limit] => 5
[offset] => 10
[order] => DESC
[orderby] => date
[post_type] => Array
(
[0] => post
)
[post_status] => publish
[cat] => Array
(
)
[tag] => Array
(
)
[taxonomy] =>
[excerpt] =>
[length] => 10
[date] =>
[date_relative] =>
[date_modified] =>
[readmore] =>
[readmore_text] => Read More
[comment_count] =>
[thumb] =>
[thumb_height] => 55
[thumb_width] => 55
[thumb_default] =>
[thumb_align] => rpwe-alignleft
[styles_default] => 1
[cssID] =>
[css_class] =>
[css] => .rpwe-block ul{
list-style: none !important;
margin-left: 0 !important;
padding-left: 0 !important;
}
.rpwe-block li{
border-bottom: 1px solid #eee;
margin-bottom: 10px;
padding-bottom: 10px;
list-style-type: none;
}
.rpwe-block a{
display: inline !important;
text-decoration: none;
}
.rpwe-block h3{
background: none !important;
clear: none;
margin-bottom: 0 !important;
margin-top: 0 !important;
font-weight: 400;
font-size: 12px !important;
line-height: 1.5em;
}
.rpwe-thumb{
border: 1px solid #eee !important;
box-shadow: none !important;
margin: 2px 10px 2px 0;
padding: 3px !important;
}
.rpwe-summary{
font-size: 12px;
}
.rpwe-time{
color: #bbb;
font-size: 11px;
}
.rpwe-comment{
color: #bbb;
font-size: 11px;
padding-left: 5px;
}
.rpwe-alignleft{
display: inline;
float: left;
}
.rpwe-alignright{
display: inline;
float: right;
}
.rpwe-aligncenter{
display: block;
margin-left: auto;
margin-right: auto;
}
.rpwe-clearfix:before,
.rpwe-clearfix:after{
content: "";
display: table !important;
}
.rpwe-clearfix:after{
clear: both;
}
.rpwe-clearfix{
zoom: 1;
}
[before] =>
[after] =>
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] =>
)
GTranslateWidget Instance: 3Array
(
[title] => Google Translate
[rw_opt] => Array
(
[pageid_281769] => 1
[pageid_281772] => 1
[widget_select] => 1
)
[display_widget_mobile] =>
)
WP_Widget_Media_Image Instance: 8Array
(
[display_widget_title] => on
[attachment_id] => 291446
[url] => https://semiwiki.com/wp-content/uploads/2020/10/YieldHUB-SemiWiki-Webinar-300x300.jpg
[title] =>
[size] => medium
[width] => 2560
[height] => 2560
[caption] =>
[alt] => YieldHUB SemiWiki Webinar
[link_type] => custom
[link_url] => https://attendee.gotowebinar.com/register/6445215525925579788?source=SemiWiki.com
[image_classes] =>
[link_classes] =>
[link_rel] =>
[link_target_blank] =>
[image_title] =>
[display_widget_mobile] =>
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
)
XF2_Latest_Posts_Widget Instance: 2Array
(
[title] => Recent Forum Threads
[title_url] =>
[ignore_sticky] => 0
[exclude_current] => 0
[limit] => 10
[offset] => 0
[order] =>
[orderby] => ID
[post_type] => Array
(
[0] => post
)
[post_status] =>
[cat] => Array
(
)
[tag] => Array
(
)
[taxonomy] =>
[excerpt] =>
[length] => 0
[date] =>
[date_relative] =>
[date_modified] =>
[readmore] =>
[readmore_text] =>
[comment_count] =>
[thumb] =>
[thumb_height] => 0
[thumb_width] => 0
[thumb_default] =>
[thumb_align] =>
[styles_default] =>
[cssID] =>
[css_class] =>
[css] =>
[before] =>
[after] =>
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[sluglist] => ["jobs-dashboard"]
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
)
Array
(
[title] => Recent Forum Threads
[title_url] =>
[ignore_sticky] => 0
[exclude_current] => 0
[limit] => 10
[offset] => 0
[order] =>
[orderby] => ID
[post_type] => Array
(
[0] => post
)
[post_status] =>
[cat] => Array
(
)
[tag] => Array
(
)
[taxonomy] =>
[excerpt] =>
[length] => 0
[date] =>
[date_relative] =>
[date_modified] =>
[readmore] =>
[readmore_text] =>
[comment_count] =>
[thumb] =>
[thumb_height] => 0
[thumb_width] => 0
[thumb_default] =>
[thumb_align] =>
[styles_default] =>
[cssID] =>
[css_class] =>
[css] =>
[before] =>
[after] =>
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[sluglist] => ["jobs-dashboard"]
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
)
Array
a
Array
(
[title] => Recent Forum Threads
[title_url] =>
[ignore_sticky] => 0
[exclude_current] => 0
[limit] => 10
[offset] => 0
[order] =>
[orderby] => ID
[post_type] => Array
(
[0] => post
)
[post_status] =>
[cat] => Array
(
)
[tag] => Array
(
)
[taxonomy] =>
[excerpt] =>
[length] => 0
[date] =>
[date_relative] =>
[date_modified] =>
[readmore] =>
[readmore_text] =>
[comment_count] =>
[thumb] =>
[thumb_height] => 0
[thumb_width] => 0
[thumb_default] =>
[thumb_align] =>
[styles_default] =>
[cssID] =>
[css_class] =>
[css] =>
[before] =>
[after] =>
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[sluglist] => ["jobs-dashboard"]
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
[node_name] => Synopsys
[node_id] => Array
(
[0] => 2
)
)
XF\Mvc\Entity\ArrayCollection Object
(
[entities:protected] => Array
(
[371] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)
XF\Mvc\Entity\ArrayCollection Object
(
[entities:protected] => Array
(
[13176] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 49
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13176
[node_id] => 371
[title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[reply_count] => 0
[view_count] => 75
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1603382801
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44258
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1603382801
[last_post_id] => 44258
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13172] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 50
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13172
[node_id] => 371
[title] => Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade
[reply_count] => 0
[view_count] => 68
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1603291475
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44250
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1603291475
[last_post_id] => 44250
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13168] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 51
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13168
[node_id] => 371
[title] => TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
[reply_count] => 0
[view_count] => 93
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1603228025
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44245
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1603228025
[last_post_id] => 44245
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13164] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 52
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13164
[node_id] => 371
[title] => Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence
[reply_count] => 0
[view_count] => 56
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1603200838
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44241
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1603200838
[last_post_id] => 44241
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13158] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 53
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13158
[node_id] => 371
[title] => Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution
[reply_count] => 0
[view_count] => 84
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1603122925
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44231
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1603122925
[last_post_id] => 44231
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13149] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 54
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13149
[node_id] => 371
[title] => Synopsys and SiMa.ai Collaborate to Bring MachSynopsys and SiMa.ai Collaborate to Bring Machine Leine Learning Inference at Scale to the Embedded Edge
[reply_count] => 0
[view_count] => 185
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602685075
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44209
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602685075
[last_post_id] => 44209
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13148] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 55
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13148
[node_id] => 371
[title] => Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications
[reply_count] => 0
[view_count] => 146
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602684996
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44208
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602684996
[last_post_id] => 44208
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13141] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 56
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13141
[node_id] => 371
[title] => Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon Scalable Processor
[reply_count] => 0
[view_count] => 129
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602595486
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44198
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602595486
[last_post_id] => 44198
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13140] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 57
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13140
[node_id] => 371
[title] => Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon Lifecycle Management Platform
[reply_count] => 0
[view_count] => 155
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602534866
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44194
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602534866
[last_post_id] => 44194
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13139] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 58
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13139
[node_id] => 371
[title] => Synopsys Names Shankar Krishnamoorthy General Manager of the Digital Design Group
[reply_count] => 0
[view_count] => 121
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602534707
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44193
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602534707
[last_post_id] => 44193
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13137] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 59
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13137
[node_id] => 371
[title] => Synopsys IC Compiler II Delivers First-Pass Silicon Success for Graphcore's Multi-Billion Gate AI Processor
[reply_count] => 0
[view_count] => 128
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602513036
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44191
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602513036
[last_post_id] => 44191
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13129] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 60
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13129
[node_id] => 371
[title] => Synopsys' Digital Design Technology Symposium to Showcase Latest Innovations for AI, Automotive, HPC and 5G Chip Design
[reply_count] => 0
[view_count] => 143
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602170146
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44174
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602170146
[last_post_id] => 44174
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13128] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 61
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13128
[node_id] => 371
[title] => Synopsys DesignWare CXL IP Supports AMBA CXS Protocol Targeting High-Performance Computing SoCs
[reply_count] => 0
[view_count] => 110
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602170121
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44173
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602170121
[last_post_id] => 44173
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13090] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 62
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13090
[node_id] => 371
[title] => Synopsys Delivers Industry's First Processor IP Certified for Full ISO 26262 ASIL D Compliance
[reply_count] => 0
[view_count] => 200
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1601472112
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44101
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1601472112
[last_post_id] => 44101
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13074] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 63
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13074
[node_id] => 371
[title] => Synopsys to Host Panel on AI for Chip Design at AI Hardware Summit 2020
[reply_count] => 0
[view_count] => 163
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1601309152
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44084
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1601309152
[last_post_id] => 44084
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13062] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 64
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13062
[node_id] => 371
[title] => Synopsys and GLOBALFOUNDRIES Collaborate to Expand Fusion Compiler Benefits for Latest Platforms
[reply_count] => 0
[view_count] => 176
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1600953230
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44063
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1600953230
[last_post_id] => 44063
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13061] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 65
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13061
[node_id] => 371
[title] => Synopsys and GLOBALFOUNDRIES Collaborate to Develop Broad Portfolio of DesignWare IP for 12LP+ FinFET Solution
[reply_count] => 0
[view_count] => 154
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1600952877
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44062
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1600952877
[last_post_id] => 44062
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13038] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 66
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13038
[node_id] => 371
[title] => NSITEXE Successfully Develops Multiple Custom Processors for Automotive Applications in Half the Time with Synopsys ASIP Designer Tool
[reply_count] => 0
[view_count] => 203
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1600299989
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 43997
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1600299989
[last_post_id] => 43997
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13025] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 67
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13025
[node_id] => 371
[title] => Synopsys Publishes BSIMM11 Study Highlighting Fundamental Shifts in Software Security Initiatives in Response to DevOps and Digital Transformation
[reply_count] => 0
[view_count] => 208
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1600177326
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 43978
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1600177326
[last_post_id] => 43978
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[12998] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 68
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 12998
[node_id] => 371
[title] => DSP Group Selects Synopsys' ARC EM Processor IP for Adaptive Processing Smart Codecs
[reply_count] => 0
[view_count] => 238
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1599743429
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 43918
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1599743429
[last_post_id] => 43918
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)
WP_Widget_Media_Image Instance: 9Array
(
[display_widget_title] => on
[size] => full
[width] => 400
[height] => 400
[caption] =>
[alt] => SemiWiKi Ad 11
[link_type] => custom
[link_url] => https://secure.thresholdsystems.com/Training/AdvancedCMOSTechnology.aspx
[image_classes] =>
[link_classes] =>
[link_rel] =>
[link_target_blank] =>
[image_title] =>
[attachment_id] => 290133
[url] => https://semiwiki.com/wp-content/uploads/2020/08/SemiWiKi-Ad-11.jpg
[title] =>
[display_widget_mobile] =>
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
)
CEO Interview: Andreas Kuehlmann of Tortuga Logic