There is a revolution happening that is fueled by innovation in areas such as AI, IoT and autonomous driving. These new systems put incredible stress on next-generation semiconductor technology. Faster processing, higher density and lower latency must all be delivered with reduced power and thermal profiles. One technology… Read More
Ultra Ethernet and UALink IP solutions scale AI clusters
AI infrastructure requirements are booming. Larger AI models carry hefty training loads and inference latency requirements, driving an urgent need to scale AI acceleration clusters in data centers. Advanced GPUs and NPUs offer solutions for the computational load. However, insufficient bandwidth or latency between servers… Read More
Synopsys Brings Multi-Die Integration Closer with its 3DIO IP Solution and 3DIC Tools
There is ample evidence that technologies such as high-performance computing, next-generation servers, and AI accelerators are fueling unprecedented demands in data processing speed with massive data storage, lower latency, and lower power. Heterogeneous system integration, more commonly called 2.5 and 3D IC design, … Read More
Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)
As industries become more reliant on advanced technologies, the importance of ensuring the reliability and longevity of critical systems grows. Failures in components, whether in autonomous vehicles, high performance computing (HPC), healthcare devices, or industrial automation, can have far-reaching consequences.… Read More
SystemReady Certified: Ensuring Effortless Out-of-the-Box Arm Processor Deployments
When contemplating the Lego-like hardware and software structure of a leading system-on-chip (SoC) design, a mathematically inclined mind might marvel at the tantalizing array of combinatorial possibilities among its hardware and software components. In contrast, the engineering team tasked with its validation may have… Read More
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More
Linear pluggable optics target data center energy savings
Data center density continues growing, driving interconnect technology to meet new challenges. Two of the largest are signal integrity and power consumption. Optical interconnects can solve many signal integrity issues posed by copper cabling and offer support for higher frequencies and bandwidths. Still, through sheer… Read More
Synopsys IP Processor Summit 2024
Now that live events are filling up there are even more live events especially here in Silicon Valley. Synopsys, the #1 full IP provider, will host a processor summit here in Santa Clara next month. Given the popularity of anything RISC-V, I would expect this event to be very well attended so be sure and register in advance.
The networking… Read More
First third-party ISO/SAE 21434-certified IP product for automotive cybersecurity
Increased processing and connectivity in automobiles are cranking up the priority for advanced cybersecurity steps to keep roads safe. Electronic vehicle interfaces, including 5G/6G, Bluetooth, Wi-Fi, GPS, USB, CAN, and others, offer convenience features for drivers and passengers, but open numerous attack vectors for… Read More