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TSMC presented two papers on 3nm at the 2022 IEDM; “Critical Process features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and Beyond” and “A 3nm CMOS FinFlexTM Platform Technology with Enhanced Power Efficiency and Performance for Mobile SOC and High Performance Computing Applications”.
When … Read More
The world of analog cell design and migration is quite different from digital, because the inputs and outputs to an analog cell often have a continuously variable voltage level over time, instead of just switching between 1 and 0. Kenny Hsieh of TSMC presented on the topic of analog cell migration at the recent North American OIP … Read More
After attending the TSMC and Samsung foundry conferences I wanted to share some quick opinions about the foundry business. Nothing earth shattering but interesting just the same. Both conferences were well attended. If we are not back to the pre pandemic numbers we are very close to it.
TSMC and Samsung both acknowledged that there… Read More
On November 10th I watched the presentation by L.C. Lu, TSMC Fellow & VP, as he talked about enabling system innovation with dozens of slides in just 26 minutes. TSMC is the number one semiconductor foundry in the world, and their Open Innovation Platform (OIP) events are popular and well attended as the process technology and… Read More
This was the 12th TSMC OIP and it did not disappoint. The attendance was back to pre pandemic levels, there was interesting news and great presentations. We will cover the presentations in more depth after the virtual event which is on November 10th. You can register HERE.
As I mentioned in my previous post, the Jim Keller Keynote … Read More
One of my favorite events is just around the corner and that is the TSMC OIP Ecosystem Forum and it’s at my favorite Silicon Valley venue the Santa Clara Convention Center. Nobody knows more about the inner workings of the ecosystem than TSMC so this is the premier semiconductor collaboration event, absolutely.
In my 40 years as a … Read More
-Micron slams on the brakes of capacity & capex-
-But memory market is already over the cliff without skid marks
-It will likely take at least a year to sop up excess capacity
-Collateral impact on Samsung & others even more important
Micron hitting the brakes after memory market already impacts
Micron capped off an otherwise… Read More
It has recently been revealed that the N5 node from TSMC has a minimum gate pitch of 51 nm [1,2] with a channel length as small as 6 nm . Such a tight channel length entails tight CD control in the patterning process, well under 0.5 nm. What are the possible lithography scenarios?
Blur Limitations for EUV Exposure
… Read More
The media has gone wild over a false report that Intel and TSMC are slowing down 3nm. It is all about sensationalism and getting clicks no matter what damage is done to the hardworking semiconductor people, companies and industry as a whole. And like lemmings jumping off a cliff, other less reputable media outlets perpetuated this… Read More
Pinpointing exactly when 450mm died is tricky. Intel’s pullback in 2014 has been cited as a pivotal moment because it was the main backer of the proposed transition, as it had been for the shift to 150mm (6-inch) wafers in the early 1980s.
However, the participation of global foundry leader TSMC was also seen as crucial if 450mm wafers… Read More