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In my “The EUV Divide and Intel Foundry Services” article available here, I discussed the looming EUV shortage. Two days ago, Intel announced their first EUV tool installed at their new Fab 34 in Ireland is a tool they moved from Oregon. This is another indication of the scarcity of EUV tools.
I have been tracking EUV system production… Read More
At the ISS conference held from April 4th through 6th I presented on who I thought would have the leading logic technology in 2025. The following is a write up of that presentation.
ISS was a virtual conference in 2021 and I presented on who currently had logic leadership and declared TSMC the clear leader. Following that conference,… Read More
TSMC has established a leadership position among silicon foundries, based on three foundational principles:
- breadth of technology support
- innovation in technology development
- collaboration with customers
Frequent SemiWiki readers have seen how these concepts have been applied to the fabrication and packaging technology… Read More
The EUV Divide
I was recently updating an analysis I did last year that looked at EUV system supply and demand, while doing this I started thinking about Intel and their Fab portfolio.
If you look at Intel’s history as a microprocessor manufacturer, they are typically ramping up their newest process node (n), in volume production… Read More
The further scaling of interconnect and via lithography for advanced nodes is challenged by the requirement to provide a process window that supports post-patterning critical dimension variations and mask overlay tolerances. At the recent international Electron Devices Meeting (IEDM) in San Francisco, TSMC presented … Read More
Previous SemiWiki articles have described the evolution of embedded non-volatile memory (eNVM) IP from (charge-based) eFlash technology to alternative (resistive) bitcell devices. (link, link)
The applications for eNVM are vast, and growing. For example, microcontrollers (MCUs) integrate non-volatile memory for … Read More
Frequent SemiWiki readers are no doubt familiar with the advances in packaging technology introduced over the past decade. At the recent International Electron Devices Meeting (IEDM) in San Francisco, TSMC gave an insightful presentation sharing their vision for packaging roadmap goals and challenges, to address the growing… Read More
TSMC drew the ire of Chinese state media last week after it complied with the US Department of Commerce request to submit supply chain data by the November 8 deadline.
The Chinese reports, which called it an act of “surrender” to US hegemony, were careful in laying blame on Taipei for caving in to Washington, rather than pointing fingers… Read More
This is an interesting piece of TSMC history. From 1987 to 1988 James E. Dykes served as the first President and Chief Executive Officer of Taiwan Semiconductor Manufacturing Company Ltd.
Taiwan Semiconductor Outlook
by James E. Dykes
President & Chief Executive Officer
Taiwan Semiconductor Manufacturing Company
Given… Read More
TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum. An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).
Overview of 3D Fabric
The TSMC… Read More