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TSMC OIP Overview and Agenda!

TSMC OIP Overview and Agenda!
by Daniel Nenni on 09-05-2019 at 6:00 am

The TSMC Symposium and OIP Ecosystem Fourm are the most coveted events of the year for the fabless semiconductor ecosystem, absolutely. In my 35 years of semiconductor experience never has there been a more exciting time in the ecosystem and that is clear by the overview and agenda for this year’s event. I hope to see you there:… Read More


TSMC in the Cloud Update #56thDAC 2019

TSMC in the Cloud Update #56thDAC 2019
by Daniel Nenni on 06-13-2019 at 10:00 am

During my Taiwan visit, prior to Las Vegas, I was fortunate to spend time with Willy Chen and Vivian Jiang to prepare for the cloud panel I moderated at #56thDAC. Willy and Vivian are part of the ever-important Design Infrastructure Marketing Division of TSMC, which includes the internal and external cloud efforts. TSMC first announced… Read More


#56DAC – What’s New with Custom Design Platform

#56DAC – What’s New with Custom Design Platform
by Daniel Payne on 06-12-2019 at 10:00 am

TSMC attends DAC every year and they do something very savvy, it’s a theatre where they invite all of their EDA and IP partners to present something of interest, followed by a drawing for a prize. At the end of the day they even have a nice prize, like a MacBook Air, which I didn’t win. On Wednesday I watched Dave Reed of SynopsysRead More


In Their Own Words: TSMC and Open Innovation Platform

In Their Own Words: TSMC and Open Innovation Platform
by Daniel Nenni on 06-01-2019 at 8:00 am

TSMC, the largest and most influential pure-play foundry, has many fascinating stories to tell. In this section, TSMC covers some of their basic history, and explains how creating an ecosystem of partners has been key to their success, and to the growth of the semiconductor industry.

The history of TSMC and its Open Innovation … Read More


400G Ethernet test chip tapes-out at 7nm from eSilicon

400G Ethernet test chip tapes-out at 7nm from eSilicon
by Tom Simon on 05-24-2019 at 10:00 am

Since the beginning of May eSilicon has announced the tape-out of three TSMC 7nm test chips. The first of these, a 7nm 400G Ethernet Gearbox/Retimer design, caught my eye and I followed up with Hugh Durdan, their vice president of strategy and products, to learn more about it. Rather than just respin their 56G SerDes, they decided… Read More


An evolution in FPGAs

An evolution in FPGAs
by Tom Simon on 05-24-2019 at 5:00 am

Why does it seem like current FPGA devices work very much like the original telephone systems with exchanges where workers connected calls using cords and plugs? Achronix thinks it is now time to jettison Switch Blocks and adopt a new approach. Their motivation is to improve the suitability of FPGAs to machine learning applications,… Read More


Learning on the Edge Investment Thesis

Learning on the Edge Investment Thesis
by Jim Hogan on 05-20-2019 at 5:00 am

It is said that it will cost as much as $600M to develop a 5nm chip. At that price, only a few companies can afford to play, and with that amount of cash in, innovation is severely limited.

At the same time, there is a stampede in the artificial intelligence (AI) market where around 60 startups have appeared, many of which have already … Read More


Re Energizing Silicon Innovation

Re Energizing Silicon Innovation
by Bernard Murphy on 05-13-2019 at 12:00 pm

Hardware is roaring back into prominence in technology innovation, from advanced cars to robots, smart homes and smart cities, 5G communication and the burgeoning electronification of industry, medicine and utilities. While software continues to play a role, all of these capabilities depend fundamentally on advances in … Read More


TSMC and Samsung 5nm Comparison

TSMC and Samsung 5nm Comparison
by Scotten Jones on 05-03-2019 at 7:00 am

Samsung and TSMC have both made recent disclosures about their 5nm process and I though it would be a good time to look at what we know about them and compare the two processes.

A lot of what has been announced about 5nm is in comparison to 7nm so we will first review 7nm.

7nm
Figure 1 compares Samsung’s 7LPP process to TSMC’s 7FF and 7FFP… Read More


TSMC Technology Symposium Review Part II

TSMC Technology Symposium Review Part II
by Tom Dillinger on 04-30-2019 at 10:00 am

TSMC recently held their annual Technology Symposium in Santa Clara. Part 1 of this article focused on the semiconductor process highlights. This part reviews the advanced packaging technologies presented at the symposium.

TSMC has clearly made a transition from a “pure” wafer-level foundry to a supplier of complex integrated… Read More