WP_Term Object
(
    [term_id] => 24
    [name] => TSMC
    [slug] => tsmc
    [term_group] => 0
    [term_taxonomy_id] => 24
    [taxonomy] => category
    [description] => 
    [parent] => 158
    [count] => 575
    [filter] => raw
    [cat_ID] => 24
    [category_count] => 575
    [category_description] => 
    [cat_name] => TSMC
    [category_nicename] => tsmc
    [category_parent] => 158
    [is_post] => 
)
            
TSMC Banner 2023
WP_Term Object
(
    [term_id] => 24
    [name] => TSMC
    [slug] => tsmc
    [term_group] => 0
    [term_taxonomy_id] => 24
    [taxonomy] => category
    [description] => 
    [parent] => 158
    [count] => 575
    [filter] => raw
    [cat_ID] => 24
    [category_count] => 575
    [category_description] => 
    [cat_name] => TSMC
    [category_nicename] => tsmc
    [category_parent] => 158
    [is_post] => 
)

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


TSMC 16th OIP Ecosystem Forum First Thoughts

TSMC 16th OIP Ecosystem Forum First Thoughts
by Daniel Nenni on 09-26-2024 at 6:00 am

TSMC Advanced Technology Roadmap 2024

Even though this is the 16th OIP event please remember that TSMC has been working closely with EDA and IP companies for 20+ years with reference flows and other design enablement and silicon verification activities. The father of OIP officially is Dr. Morris Chang who named it the Grand Alliance. However, Dr. Cliff Hou is the one … Read More


TSMC OIP Ecosystem Forum Preview 2024

TSMC OIP Ecosystem Forum Preview 2024
by Daniel Nenni on 09-19-2024 at 10:00 am

TSMC OIP 2024

The 2024 live conferences have been well attended thus far and there are many more to come. The next big event in Silicon Valley is the TSMC Global OIP Ecosystem Forum on September 25th at the Santa Clara Convention Center. I expect a big crowd filled with both customers and partners.

This is the 16th year of OIP and it has been an honor… Read More


TSMC’s Business Update and Launch of a New Strategy

TSMC’s Business Update and Launch of a New Strategy
by Claus Aasholm on 07-30-2024 at 10:00 am

TSMC Fab Utilization 2024

What looks like a modest market expansion strategy is all but modest.

Insights into the Semiconductor Industry and the Semiconductor Supply Chain.

As usual, when TSMC reports, the Semiconductor industry gets a spray of insights that help understand what goes on in other areas of the industry. This time, TSMC gave more insight … Read More


TSMC Foundry 2.0 and Intel IDM 2.0

TSMC Foundry 2.0 and Intel IDM 2.0
by Daniel Nenni on 07-22-2024 at 10:00 am

TSMC 2Q2024 Investor Call

When Intel entered the foundry business with IDM 2.0 I was impressed. Yes, Intel had tried the foundry business before but this time they changed the face of the company with IDM 2.0 and went “all-in” so to speak. The progress has been impressive and today I think Intel is well positioned to capture the NOT TSMC business by providing… Read More


What if China doesn’t want TSMC’s factories but wants to take them out?

What if China doesn’t want TSMC’s factories but wants to take them out?
by Claus Aasholm on 07-02-2024 at 10:00 am

Foundry Numbers 2024

Insights into the Semiconductor Industry and the Semiconductor Supply Chain

I am not an expert in geopolitical issues, but lately, my research has begun to worry me. As I was preparing to be interviewed for Chinese media, I was in my “Chinese Zone”, adapting to what is palatable to a Chinese audience. Maybe my mode provoked the thought:… Read More


TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design

TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design
by Mike Gianfagna on 06-10-2024 at 6:00 am

TSMC Advanced Packaging Overcomes the Complexities of Multi Die Design

The TSMC Technology Symposium provides a worldwide stage for TSMC to showcase its advanced technology impact and the extensive ecosystem that is part of the company’s vast reach. These events occur around the world and the schedule is winding down. TSMC covers many topics at its Technology Symposium, including industry-leading… Read More


What’s all the Noise in the AI Basement?

What’s all the Noise in the AI Basement?
by Claus Aasholm on 06-05-2024 at 8:00 am

Nvidia is HUGE 2024

My dog yawns every time I say Semiconductor or Semiconductor Supply Chain. Most clients say, “Yawn…. Don’t pontificate – pick the Nasdaq winners for us!”

Will Nvidia be overtaken by the new AI players?

If you follow along with me, you might gain some insights into what is happening in AI hardware. I will leave others to do the… Read More


The Case for U.S. CHIPS Act 2

The Case for U.S. CHIPS Act 2
by Admin on 06-03-2024 at 8:00 am

America CHIPs ACT

Despite murky goals and moving targets, the recent CHIPS Act sets the stage for long term government incentives.

Authored by Jo Levy and Kaden Chaung

On April 25, 2024, the U.S. Department of Commerce announced the fourth, and most likely final, grant under the current U.S. CHIPS Act for leading-edge semiconductor manufacturing.… Read More


Real men have fabs!

Real men have fabs!
by Claus Aasholm on 04-24-2024 at 8:00 am

Semiconductor Ecosystem

“Real men have fabs” was an insult AMD founder Jerry Sanders hurled at his poor competitors who could not afford to build fabs. A few years later, AMD would be fabless, spinning off its manufacturing facilities as GlobalFoundries. This was the beginning of a transformative period for the industry.

Lisa Su could rightfully retort:

Read More