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TSMC SemiWiki Banner
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Intel 7NM Slip Causes Reassessment of Fab Model

Intel 7NM Slip Causes Reassessment of Fab Model
by Robert Maire on 07-23-2020 at 5:00 pm

Intel vs TSMC

Waving white surrender flag as TSMC dominates-
The quarter was a success but the patient is dying-
Packaging now critical as Moore progress stumbles-
Intel reported a great quarter but weak H2 guidance-
But 7NM slip and “fab lite” talk sends shockwaves-

Intel reported a great quarter beating numbers all around with… Read More


In-Memory Computing for Low-Power Neural Network Inference

In-Memory Computing for Low-Power Neural Network Inference
by Tom Dillinger on 07-17-2020 at 10:00 am

von Neumann bottleneck

“AI is the new electricity.”, according to Andrew Ng, Professor at Stanford University.  The potential applications for machine learning classification are vast.  Yet, current ML inference techniques are limited by the high power dissipation associated with traditional architectures.  The figure below highlights the … Read More


A Compelling Application for AI in Semiconductor Manufacturing

A Compelling Application for AI in Semiconductor Manufacturing
by Tom Dillinger on 07-06-2020 at 6:00 am

AI opportunities

There have been a multitude of announcements recently relative to the incorporation of machine learning (ML) methods into EDA tool algorithms, mostly in the physical implementation flows.  For example, deterministic ML-based decision algorithms applied to cell placement and signal interconnect routing promise to expedite… Read More


Optimizing Chiplet-to-Chiplet Communications

Optimizing Chiplet-to-Chiplet Communications
by Tom Dillinger on 06-29-2020 at 6:00 am

bump dimensions

Summary
The growing significance of ultra-short reach (USR) interfaces on 2.5D packaging technology has led to a variety of electrical definitions and circuit implementations.  TSMC recently presented the approach adopted by their IP development team, for a parallel-bus, clock-forwarded USR interface to optimize power/performance/area… Read More


Multi-Vt Device Offerings for Advanced Process Nodes

Multi-Vt Device Offerings for Advanced Process Nodes
by Tom Dillinger on 06-26-2020 at 6:00 am

Ion Ioff

Summary
As a result of extensive focus on the development of workfunction metal (WFM) deposition, lithography, and removal, both FinFET and gate-all-around (GAA) devices will offer a wide range of Vt levels for advanced process nodes below 7nm.

Introduction
Cell library and IP designers rely on the availability of nFET and pFET… Read More


TSMC’s Advanced IC Packaging Solutions

TSMC’s Advanced IC Packaging Solutions
by Herb Reiter on 05-01-2020 at 10:00 am

Fig 3 TSMC Adv Pkg blog

TSMC as Pure Play Wafer Foundry
TSMC started its wafer foundry business more than 30 years ago. Visionary management and creative engineering teams developed leading-edge process technologies and their reputation as trusted source for high-volume production. TSMC also recognized very early the importance of building an … Read More


Can TSMC Maintain Their Process Technology Lead

Can TSMC Maintain Their Process Technology Lead
by Scotten Jones on 04-29-2020 at 10:00 am

TSMC Process Lead Slides 20200427 Page 1

Recently Seeking Alpha published an article “Taiwan Semiconductor Manufacturing Company Losing Its Process Leadership To Intel” and Dan Nenni (SemiWiki founder) asked me to take a look at the article and do my own analysis. This is a subject I have followed and published on for many years.

Before I dig into specific process density… Read More


Tracing Technology’s Evolution with Patents

Tracing Technology’s Evolution with Patents
by Arabinda Das on 04-23-2020 at 10:00 am

Figure 1

We live in an age of abundant information. There is a tremendous exchange of ideas crisscrossing the world enabling new innovative type of products to pop up daily. Therefore, in this era there is a greater need to understand competitive intelligence. Corporate companies today are interested in what other competitors are brewing… Read More


TSMC COVID-19 and Double Digit Growth in 2020

TSMC COVID-19 and Double Digit Growth in 2020
by Daniel Nenni on 04-17-2020 at 10:00 am

Mark Liu CC Wei TSMC


TSMC has had an incredible run since its founding in 1987 which spans most of my 36 year semiconductor career. Even in these troubled times TSMC is a shining bellwether with double digit growth expectations while the semiconductor industry will be flat or slightly down. Let’s take a close look at the TSMC Q1 2020 conference call and… Read More


TSMC 32Mb Embedded STT-MRAM at ISSCC2020

TSMC 32Mb Embedded STT-MRAM at ISSCC2020
by Don Draper on 03-20-2020 at 6:00 am

Fig. 1. Cross section of the STT MRAM bit cell in BEOL metallization layers between M1 and M5.

32Mb Embedded STT-MRAM in ULL 22nm CMOS Achieves 10ns Read Speed, 1M Cycle Write Endurance, 10 Years Retention at 150C and High Immunity to Magnetic Field Interference presented at ISSCC2020

1.  Motivation for STT-MRAM in Ultra-Low-Leakage 22nm Process

TSMC’s embedded Spin-Torque Transfer Magnetic Random Access Memory (STT-MRAM)… Read More