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The Latest in Dielectrics for Advanced Process Nodes

The Latest in Dielectrics for Advanced Process Nodes
by Tom Dillinger on 01-12-2021 at 6:00 am

new ILDs v2

Of the three types of materials used in microelectronics – i.e., semiconductors, metals, and dielectrics – the first two often get the most attention.  Yet, there is a pressing need for a rich variety of dielectric materials in device fabrication and interconnect isolation to satisfy the performance, power, and reliability … Read More


Optimization for pFET Nanosheet Devices

Optimization for pFET Nanosheet Devices
by Tom Dillinger on 01-04-2021 at 6:00 am

Intel flow TEM

The next transition from current FinFET devices at advanced process nodes is the “nanosheet” device, as depicted in the figure below. [1]

The FinFET provides improved gate-to-channel electrostatic control compared to a planar device, where the gate traverses three sides of the fin.  The “gate-all-around” characteristics… Read More


How Intel Stumbled: A Perspective from the Trenches

How Intel Stumbled: A Perspective from the Trenches
by Daniel Nenni on 12-07-2020 at 6:00 am

Stacy and Bob Intel SemiWiki

Bloomberg did an interview with my favorite semiconductor analyst Stacy Rasgon on “How the Number One U.S. Semiconductor Company Stumbled” that I found interesting. Coupled with the Q&A Bob Swan did at the Credit Suisse Annual Technology Conference I thought it would be good content for a viral blog.

Stacy RasgonRead More


No Intel and Samsung are not passing TSMC

No Intel and Samsung are not passing TSMC
by Scotten Jones on 12-02-2020 at 6:00 am

Slide1

Seeking Alpha just published an article about Intel and Samsung passing TSMC for process leadership. The Intel part seems to be a theme with them, they have talked in the past about how Intel does bigger density improvements with each generation than the foundries but forget that the foundries are doing 5 nodes in the time it takes… Read More


Are TSMC and Intel Partnering in Arizona?

Are TSMC and Intel Partnering in Arizona?
by Daniel Nenni on 11-01-2020 at 10:00 am

TSMC Career Opporunitites

After months of back and forth TSMC finally announced plans to build a fab in Arizona. The announcement was not made in the press or on the most recent investor call but on LinkedIn. A sign of the times I guess but since they need to hire a bunch of semiconductor people it was more than appropriate.

“We’re delighted to catch up with you … Read More


Intel TSMC Update!

Intel TSMC Update!
by Daniel Nenni on 10-23-2020 at 10:00 am

Intel Bob Swan TSMC SemiWiki 1

Based on the Intel investor call yesterday here are some interesting comments Bob Swan made related to Intel outsourcing manufacturing and 7nm progress. Let’s start with the prepared statement:

Bob Swan: Over the last couple of years, we have been focused on three critical priorities; improving our execution to strengthen … Read More


Three Things You Have Wrong About Intel!

Three Things You Have Wrong About Intel!
by Daniel Nenni on 10-09-2020 at 10:00 am

Three Things You Have Wrong About Intel

First let me tell you that I have nothing but respect for Intel. I grew up with them in Silicon Valley and have experienced firsthand their brilliance and the many contributions they have made to the semiconductor industry. In fact, I can easily say the semiconductor ecosystem would not be what it is today without Intel.

But no company… Read More


A “Super” Technology Mid-life Kicker for Intel

A “Super” Technology Mid-life Kicker for Intel
by Tom Dillinger on 08-17-2020 at 10:00 am

TigerLake WillowCove

Summary
At the recent Intel Architecture Day 2020 symposium, a number of technology enhancements to the Intel 10nm process node were introduced.  The cumulative effect of these enhancements would provide designs with a performance boost (at iso-power) approaching 20% – a significant intra-node enhancement, to be sure.  The… Read More


Intel 10nm SuperFin Technology!

Intel 10nm SuperFin Technology!
by Daniel Nenni on 08-17-2020 at 6:00 am

Refining FinFet Intel SuperFin

I made it through the Virtual Intel Architecture Day last week and much to my surprise it was very well done. Virtual events have been hit and miss but this one was definitely a hit. Great content, approachable experts, a glitch-free experience. The mainstream media has been redundantly covering it so let me add my many years of experience,… Read More


Intel 7NM Slip Causes Reassessment of Fab Model

Intel 7NM Slip Causes Reassessment of Fab Model
by Robert Maire on 07-23-2020 at 5:00 pm

Intel vs TSMC

Waving white surrender flag as TSMC dominates-
The quarter was a success but the patient is dying-
Packaging now critical as Moore progress stumbles-
Intel reported a great quarter but weak H2 guidance-
But 7NM slip and “fab lite” talk sends shockwaves-

Intel reported a great quarter beating numbers all around with… Read More