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TSMC and the FinFET Era!

TSMC and the FinFET Era!
by Daniel Nenni on 06-09-2021 at 6:00 am

Intel 22nm wafer

While there is a lot of excitement around the semiconductor shortage narrative and the fabs all being full, both 200mm and 300mm, there is one big plot hole and that is the FinFET era.

Intel ushered in the FinFET era only to lose FinFET dominance to the foundries shortly thereafter. In 2009 Intel brought out a 22nm FinFET wafer at the… Read More


Extending Moore’s Law with 3D Heterogeneous Materials Integration

Extending Moore’s Law with 3D Heterogeneous Materials Integration
by Tom Dillinger on 05-18-2021 at 10:00 am

nFET Si pFET Ge

A great deal has been written of late about the demise of Moore’s Law.  The increase in field-effect transistor density with successive process nodes has slowed from the 2X every 2 1/2 years pace of earlier generations.  The economic nature of Moore’s comments 50 years ago has also been scrutinized – the reduction in cost per transistorRead More


Intel’s EMIB Packaging Technology – A Deep Dive

Intel’s EMIB Packaging Technology – A Deep Dive
by Tom Dillinger on 05-03-2021 at 6:00 am

EMIB configurations

The evolution of low-cost heterogeneous multi-chip packaging (MCP) has led to significant system-level product innovations.  Three classes of MCP offerings have emerged:

  • wafer-level fan-out redistribution, using reconstituted wafer substrates of molding compound as the surface for interconnections between die (2D)
Read More

Foundry Fantasy- Deja Vu or IDM 2?

Foundry Fantasy- Deja Vu or IDM 2?
by Robert Maire on 03-26-2021 at 8:00 am

Foundry Profit 2020

– Intel announced 2 new fabs & New Foundry Services
– Not only do they want to catch TSMC they want to beat them
– It’s a very, very tall order for a company that hasn’t executed
– It will require more than a makeover to get to IDM 2.0

Intel not only wants to catch TSMC but beat them at their own Read More


Intel Takes Another Shot at the Enticing Foundry Market

Intel Takes Another Shot at the Enticing Foundry Market
by Terry Daly on 03-26-2021 at 6:00 am

Intel IDM 2.0

Intel made a big splash on March 23, 2021 by doubling down on manufacturing with the creation of Intel Foundry Services (IFS). The big announcement was supported by potential customers such as Qualcomm, Cisco, Ericsson, Google, Amazon, Microsoft, and IBM. With an accompanying $20B investment, the EDA and equipment industries,… Read More


Intel’s IDM 2.0

Intel’s IDM 2.0
by Scotten Jones on 03-24-2021 at 4:00 am

Slide1 1

In January I presented at the ISS conference a comparison of Intel’s, Samsung’s and TSMC’s leading edge offerings. You can read a write-up of my presentation here.

With the problems going on at Intel, that article generated a lot of interest in the investment community, and I have been holding a lot of calls with analysts who are trying… Read More


Intel Will Again Compete With TSMC

Intel Will Again Compete With TSMC
by Daniel Nenni on 03-23-2021 at 2:00 pm

TSMC Intel SemiWiki

New Intel CEO Pat Gelsinger is not wasting any time in changing the course of the largest semiconductor company the world has ever seen. Today he announced the IDM 2.0 strategy which will better leverage Intel’s manufacturing abilities. There is a lot to talk about here but let’s focus on the new Intel Foundry Services because the… Read More


A Review of Clock Generation and Distribution for Off-Chip Interfacing

A Review of Clock Generation and Distribution for Off-Chip Interfacing
by Tom Dillinger on 03-09-2021 at 6:00 am

clocking

At the recent ISSCC conference, Mozhgan Mansuri from Intel gave an enlightening (extended) short course presentation on all thing related to clocking, for both wireline and wireless interface design. [1]  The presentation was extremely thorough, ranging from a review of basic clocking principles to unique circuit design … Read More


Expert Advice for the New Intel CEO

Expert Advice for the New Intel CEO
by Daniel Nenni on 02-15-2021 at 10:00 am

Pat Gelsinger Intel CEO

Intel is a semiconductor legend. Founded on July 18, 1968, the name Intel is short for Integrated Electronics. After leading Silicon Valley, the United Sates, and the world into the era of semiconductors through technical excellence, Intel has hit some challenging times. There has been quite a bit of CEO drama that we will look … Read More


The Latest in Dielectrics for Advanced Process Nodes

The Latest in Dielectrics for Advanced Process Nodes
by Tom Dillinger on 01-12-2021 at 6:00 am

new ILDs v2

Of the three types of materials used in microelectronics – i.e., semiconductors, metals, and dielectrics – the first two often get the most attention.  Yet, there is a pressing need for a rich variety of dielectric materials in device fabrication and interconnect isolation to satisfy the performance, power, and reliability … Read More