Intel’s next big opportunity could come from something that sounds spectacularly unglamorous: connecting tiny pieces of silicon. Advanced packaging rarely attracts the attention lavished on powerful processors or artificial intelligence models. Yet it increasingly determines how effectively those technologies perform.… Read More
How AI is Reshaping Semiconductor Design and Manufacturing
While AI is transforming nearly every industry, some of its most significant advances are happening inside the semiconductor factories building the chips that power it. If you design AI systems, those manufacturing advances directly influence your performance, efficiency, and path to market.
From Metrology to Autonomy: Why Intel Foundry’s Manufacturing Roadmap Matters
Semiconductor manufacturing has always depended on precise measurement. As devices become more complex and packaging integrates more components, however, measuring individual process steps is no longer enough. Manufacturers need to understand how decisions across fabrication, assembly, and test affect the finished … Read More
Why America’s Semiconductor Manufacturing Capacity Matters
America’s semiconductor future will be shaped by its ability to turn scientific discoveries into chips manufactured at scale. That is why the investments outlined in Intel Foundry’s recent editorial matter beyond the company’s own business. They address a fundamental question: whether the United States can sustain the research,… Read More
Intel’s Open Software Blueprint: Why Production AI Needs More Than GPUs
Intel’s strategic argument about enterprise AI is that the value of a model depends on the system that surrounds it. In an article by executives Bill Pearson and Anil Nanduri, the company positions open software as the connective tissue linking CPUs, GPUs, data, and business applications. The message is straightforward: accelerator… Read More
Data Center Energy Trends Force a Rethink of Chip Power Delivery
Intel Foundry published a two article series on chip power delivery that are worth reading. Here is a quick summary:
Artificial intelligence is changing the requirements for semiconductor innovation. Faster transistors and denser packaging remain essential, but their benefits increasingly depend on another engineering… Read More
Intel Foundry: AI performance now depends on the whole system
For decades, chipmakers improved computing performance largely by putting more capable circuitry on a piece of silicon. That remains important, but AI is exposing its limits. Large models demand enormous amounts of data movement, sustained power and effective cooling. A fast processor cannot deliver its full benefit if memory… Read More
ASML Has High-NA and Chipmakers Can’t Say No
ASML’s grip on the most advanced corner of chip manufacturing is tightening. The Dutch company, already the sole supplier of extreme ultraviolet lithography systems, is winning broader industry support for High Numerical Aperture EUV, or High NA, its next-generation technology for printing smaller and denser circuitry.… Read More
High-NA EUV Moves From Experiment to Manufacturing
Intel Foundry and ASML say high-numerical-aperture extreme-ultraviolet lithography has crossed an important boundary: it is no longer only a development tool, but a production technology. At the SPIE Photomask Technology and Extreme Ultraviolet Lithography conference, the companies reported that Intel has processed … Read More
Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry
Advanced semiconductor packaging has become essential to improving computing performance as conventional transistor scaling grows more difficult and expensive. Instead of manufacturing an entire processor as one large monolithic die, chipmakers can divide it into smaller chiplets and combine logic, memory, input/output… Read More

