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TSMC CoWoS versus Intel EMIB Semiconductor Packaging

TSMC CoWoS versus Intel EMIB Semiconductor Packaging
by Daniel Nenni on 07-17-2026 at 8:00 am

TSMC CoWoS verus Intel EMIB

There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:

Jeff Su: I guess very simply put, EMIB-T, in his view, isRead More


Foundation IP for Intel 18A: Technical Overview and Why It Matters

Foundation IP for Intel 18A: Technical Overview and Why It Matters
by Daniel Nenni on 07-03-2026 at 6:00 am

Intel 18A Foundation IP Synopsys

Synopsys Foundation IP for Intel 18A is a portfolio of semiconductor building blocks designed to help system-on-chip developers build advanced chips with better power, performance, and area, often called PPA. The offering includes embedded memory compilers, standard-cell logic libraries, and input/output libraries for… Read More


Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?

Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?
by Daniel Nenni on 06-26-2026 at 6:00 am

Inel 18A vs Intel 18A P

Intel’s 18A process technology has become one of the most scrutinized semiconductor manufacturing nodes in the industry. It represents Intel’s introduction of two major innovations: RibbonFET gate-all-around (GAA) transistors and PowerVia backside power delivery (BSPD). These technologies are intended to improve transistor… Read More


The Yield Partnership: Intel and PDF Solutions Tackle Advanced Nodes

The Yield Partnership: Intel and PDF Solutions Tackle Advanced Nodes
by Daniel Nenni on 06-19-2026 at 6:00 am

Intel and PDF Solutions Tackle Advanced Nodes

One of the most difficult things to do in life is ask for help. This is inherently a big problem in the semiconductor industry dating back to the IDM days where silos of secrecy were established. As a result Intel has struggled with yield since the 14nm FinFET process nodes.

On the outside PDF Solutions is a publicly traded semiconductor… Read More


Intel Foundry Expands the 18A Platform with 18A-P and Demonstrates Long-Term Technology Leadership at VLSI 2026

Intel Foundry Expands the 18A Platform with 18A-P and Demonstrates Long-Term Technology Leadership at VLSI 2026
by Daniel Nenni on 06-16-2026 at 2:00 pm

Intel Foundry Trust 2026

At the 2026 VLSI Symposium, Intel Foundry provided a detailed update on its process technology roadmap, highlighting the continued maturation of Intel 18A, the introduction of Intel 18A-P, and several advanced research initiatives that extend beyond current gate-all-around (GAA) transistor architectures. The presentation… Read More


Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools

Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools
by Daniel Nenni on 06-04-2026 at 6:00 am

synopsys intel linkedin update 1200x1200 v3

As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More


Re-Spins Get You Fired, Says Intel CEO Lip-Bu Tan

Re-Spins Get You Fired, Says Intel CEO Lip-Bu Tan
by Daniel Nenni on 05-29-2026 at 6:00 am

Re Spins Get You Fired, Says Intel CEO Lip Bu Tan

Intel CEO Lip-Bu Tan’s statement that “re-spins get you fired” reflects the enormous pressure facing semiconductor companies as chip complexity, manufacturing costs, and competitive demands continue to rise. In the semiconductor industry, a “re-spin” occurs when a chip design must be revised and manufactured again because… Read More


ASML High-NA EUV is Not Ready for High-Volume Production

ASML High-NA EUV is Not Ready for High-Volume Production
by Daniel Nenni on 05-22-2026 at 8:00 am

ASML Elephant High NA EUV

Contrary to the popular press, ASML High-NA EUV is not ready for logic production yet—and it may never be, at least not in the form originally envisioned. If you remember how long it took conventional EUV to become production-worthy—arguably 5–10 years—this should not come as a surprise. More importantly, this is no longer just… Read More


Elon Musk Needs to Put His Fab Money Where his Mouth is!

Elon Musk Needs to Put His Fab Money Where his Mouth is!
by Daniel Nenni on 04-24-2026 at 6:00 am

Terafab Elon Musk Lip Bu Tan Intel

To me this is going to be one of the bigger Chicken Little moments in the history of semiconductors. Mostly because we are now a click driven society and the media is plagued by so called influencers that live and die by clicks. In my 40+ years as a semiconductor professional I have witnessed many of these Chicken Little moments with … Read More


Is Intel About to Take Flight?

Is Intel About to Take Flight?
by Jonah McLeod on 04-21-2026 at 10:00 am

Chip to Austin

The Pan Am–Boeing playbook and what Musk’s Terafab order could mean for Intel Foundry

“We either build the Terafab or we don’t have the chips.” That’s Elon Musk, speaking to Reuters, stating a supply constraint as plainly as anyone has stated one. TSMC is sold out. Samsung is committed. The existing supply chain can’t expand fast… Read More