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Intel Direct Connect Event

Intel Direct Connect Event
by Scotten Jones on 02-23-2024 at 12:00 pm

Figure 1

On Wednesday, February 21st Intel held their first Foundry Direct Connect event. The event had both public and NDA sessions, and I was in both. In this article I will summarize what I learned (that is not covered by NDA) about Intel’s business, process, and wafer fab plans (my focus is process technology and wafer fabs).

Business
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ISS 2024 – Logic 2034 – Technology, Economics, and Sustainability

ISS 2024 – Logic 2034 – Technology, Economics, and Sustainability
by Scotten Jones on 02-19-2024 at 8:00 am

Slide4

For the 2024 SEMI International Strategy Symposium I was challenged by members of the organizing committee to look at where logic will be in ten years from a technology, economics, and sustainability perspective. The following is a discussion of my presentation.

To understand logic, I believe it is useful to understand what makes… Read More


Intel should be the Free World’s Plan A Not Plan B, and we need the US Government to step in

Intel should be the Free World’s Plan A Not Plan B, and we need the US Government to step in
by Chris Krueger on 02-19-2024 at 6:00 am

TSMC Intel

There are trillions of dollars at stake with AI and huge geopolitical consequences. However, the weak foundation to American technological power is their dependence on Taiwan and TSMC, which is where most advanced silicon is manufactured. America has also been taking China to the ropes lately in their economic/technology proxy… Read More


How Disruptive will Chiplets be for Intel and TSMC?

How Disruptive will Chiplets be for Intel and TSMC?
by Daniel Nenni on 01-15-2024 at 10:00 am

UCIe Consortium

Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More


IEDM: What Comes After Silicon?

IEDM: What Comes After Silicon?
by Paul McLellan on 01-09-2024 at 10:00 am

Screen Shot 2024 01 05 at 8.50.58 AM

The annual International Electron Devices Meeting (IEDM) took place last month. One of the presentations on the short course was by Matthew Metz of Intel titled New Materials Systems for Moore’s Law Continuation. In essence this was a look at some of the possibilities for what comes after silicon runs out of steam.

Matthew started… Read More


2024 Big Race is TSMC N2 and Intel 18A

2024 Big Race is TSMC N2 and Intel 18A
by Daniel Nenni on 01-01-2024 at 6:00 am

Intel PowerVia backside power delivery

There is a lot being said about Intel getting the lead back from TSMC with their 18A process. Like anything else in the semiconductor industry there is much more here than meets the eye, absolutely.

From the surface, TSMC has a massive ecosystem and is in the lead as far as process technologies and foundry design starts but Intel is … Read More


IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation

IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation
by Mike Gianfagna on 12-10-2023 at 2:00 pm

IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation

For more than 65 years, the IEEE International Electron Devices Meeting (IEDM) has been the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. As I post this, the conference is underway in San Francisco… Read More


Intel Ushers a New Era of Advanced Packaging with Glass Substrates

Intel Ushers a New Era of Advanced Packaging with Glass Substrates
by Mike Gianfagna on 09-18-2023 at 10:00 am

Intel Ushers a New Era of Advanced Packaging with Glass Substrates


Intel recently issued a press announcement that has significant implications for the future of semiconductors.  The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rulesRead More


How Intel, Samsung and TSMC are Changing the World

How Intel, Samsung and TSMC are Changing the World
by Mike Gianfagna on 08-21-2023 at 10:00 am

How Intel, Samsung and TSMC are Changing the World

Given the changes in the music business, the term “Rock Star” doesn’t really have any relevance to music or its performers anymore.  Instead, we use the term to describe leaders, innovators and generally people or organizations of great significance. In the world of semiconductors, the designers of advanced chips were the rock… Read More


Intel Enables the Multi-Die Revolution with Packaging Innovation

Intel Enables the Multi-Die Revolution with Packaging Innovation
by Mike Gianfagna on 07-24-2023 at 6:00 am

Intel Enables the Multi Die Revolution with Packaging Innovation

The trend is undeniable. Highly integrated monolithic chips can no longer handle the demands of next-generation systems. The reasons for this significant shift in design are many. Much has been written on the topic; you can get a good overview of the forces at play in multi-die design here. These changes represent the next chapter… Read More