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IEDM: What Comes After Silicon?

IEDM: What Comes After Silicon?
by Paul McLellan on 01-09-2024 at 10:00 am

Screen Shot 2024 01 05 at 8.50.58 AM

The annual International Electron Devices Meeting (IEDM) took place last month. One of the presentations on the short course was by Matthew Metz of Intel titled New Materials Systems for Moore’s Law Continuation. In essence this was a look at some of the possibilities for what comes after silicon runs out of steam.

Matthew started… Read More


No Intel and Samsung are not passing TSMC

No Intel and Samsung are not passing TSMC
by Scotten Jones on 12-02-2020 at 6:00 am

Slide1

Seeking Alpha just published an article about Intel and Samsung passing TSMC for process leadership. The Intel part seems to be a theme with them, they have talked in the past about how Intel does bigger density improvements with each generation than the foundries but forget that the foundries are doing 5 nodes in the time it takes… Read More


EDA Tool Support for GAA Process Designs

EDA Tool Support for GAA Process Designs
by Daniel Nenni on 11-23-2020 at 6:00 am

GAA FinFET

With the announcement of early PDK availability for the 3nm GAA process node, designers are extremely interested in the characteristics of the new “gate-all-around” transistor structure and how it compares to the existing FinFET device.  The GAA transistor has been denoted as a (horizontal) nanowire or nanosheet.

I will talk… Read More