WP_Term Object
(
[term_id] => 14
[name] => Synopsys
[slug] => synopsys
[term_group] => 0
[term_taxonomy_id] => 14
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 528
[filter] => raw
[cat_ID] => 14
[category_count] => 528
[category_description] =>
[cat_name] => Synopsys
[category_nicename] => synopsys
[category_parent] => 157
[is_post] =>
)
WP_Term Object
(
[term_id] => 14
[name] => Synopsys
[slug] => synopsys
[term_group] => 0
[term_taxonomy_id] => 14
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 528
[filter] => raw
[cat_ID] => 14
[category_count] => 528
[category_description] =>
[cat_name] => Synopsys
[category_nicename] => synopsys
[category_parent] => 157
[is_post] =>
)
Anyone who frequents SemiWiki will likely know Moore’s Law. The prediction made by Gordon Moore over 50 years ago regarding the relentless increase in transistor density and reduction in cost has tracked well for a very, very long time. In recent years, there has been spirited discussion about the end of Moore’s Law. This is a discussion… Read More
The most obvious question here is “why do I need netlist CDC?” A lot of what you’re looking for in CDC analysis is really complex behaviors, like handshakes between different clock domains, correct gray coding in synchronizing FIFOs, eliminating quasi-static signals and the like. Deeply functional, system-level intent stuff.… Read More
As software content increases in system-on-chip and system-in-package designs, emulation has become a critical enabling technology for the software team. This technology offers software developers the opportunity to verify their code in against a high-fidelity model of the target system that actually executes fast enough… Read More
There was a “research reviewed” panel on Thursday at DAC entitled Shortening the Wires Between High-Level Synthesis and Logic Synthesis. Chaired by Alric Althoff of Tortuga Logic, the panel explored methods to deal with wire delays in high-level synthesis and logic synthesis. The four speakers and their focus were:
Artificial Intelligence (AI) and Machine Learning (ML) are becoming more and more commonplace in our world. We have Siri, Alexa and Google Assistant that understand our voice commands. Vision systems that recognize objects are used for facial recognition, autonomous driving, medical, geographical and many other applications.… Read More
Many of us are now somewhat fluent in IoT-speak, though at times I have to wonder if I’m really up on the latest terminology. Between edge and extreme edge, fog and cloud, not to mention emerging hierarchies in radio access networks – how this all plays out is going to be an interesting game to watch. Ron Lowman, DesignWare IP Product… Read More
Back in my Atrenta days (before mid-2015), we were already running into a lot of very large SoC-level designs – a billion gates or more. At those sizes, full-chip verification of any kind becomes extremely challenging. Memory demand and run-times explode, and verification costs explode also since these runs require access to … Read More
Want fast debug? Synopsys recently hosted a Webinar to show off the latest and greatest improvements to Verdi® in performance, memory demand and multi-tasking, among other areas.
Performance improvements
Taruna Reddy (PMM) and Allen Hsieh (Staff apps) presented features of the latest version, released in March – Taruna started… Read More
Summary
Design Technology Co-Optimization (DTCO) analysis was pursued for library cell PPA estimates for gate-all-around (GAA) devices and new metallurgy options. The cell design and process recommendations are a bit surprising.
Introduction
During the “golden years” of silicon technology evolution that applied Dennard… Read More
Array
(
[0] => tribe-events-list-widget-5
[1] => search-2
[2] => media_image-13
[3] => better_recent_comments-2
[4] => media_image-12
)
WP_Term Object
(
[term_id] => 14
[name] => Synopsys
[slug] => synopsys
[term_group] => 0
[term_taxonomy_id] => 14
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 528
[filter] => raw
[cat_ID] => 14
[category_count] => 528
[category_description] =>
[cat_name] => Synopsys
[category_nicename] => synopsys
[category_parent] => 157
[is_post] =>
)
Tribe__Events__List_Widget Instance: 5Array
(
[title] => Upcoming Events
[limit] => 5
[no_upcoming_events] =>
[featured_events_only] =>
[jsonld_enable] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] => 1
)
Array
(
[title] => Upcoming Events
[limit] => 5
[no_upcoming_events] =>
[featured_events_only] =>
[jsonld_enable] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] => 1
)
WP_Widget_Search Instance: 2Array
(
[display_widget_title] => on
[title] => Search Semiwiki
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] => 1
[rw_opt_exclude] => Array
(
)
)
Array
(
[display_widget_title] => on
[title] => Search Semiwiki
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] => 1
[rw_opt_exclude] => Array
(
)
)
WP_Widget_Media_Image Instance: 13Array
(
[display_widget_title] => on
[size] => full
[width] => 400
[height] => 400
[caption] =>
[alt] => Webinar 2
[link_type] => custom
[link_url] => https://attendee.gotowebinar.com/register/9157755792430558219?source=SemiWiki
[image_classes] =>
[link_classes] =>
[link_rel] =>
[link_target_blank] =>
[image_title] =>
[attachment_id] => 292409
[url] => https://semiwiki.com/wp-content/uploads/2020/10/Webinar-2.jpg
[title] =>
[display_widget_mobile] =>
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
)
Barn2\Plugin\Better_Recent_Comments\Widget Instance: 2Array
(
[title] => Recent Article Comments
[number] => 8
[avatar] =>
[date] => 1
[comment] => 1
[link] => 1
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
)
Array
(
[title] => Recent Article Comments
[number] => 8
[avatar] =>
[date] => 1
[comment] => 1
[link] => 1
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
)
WP_Widget_Media_Image Instance: 12Array
(
[display_widget_title] => on
[size] => full
[width] => 400
[height] => 400
[caption] =>
[alt] => WIKI White Paper HDL Simulation Acceleration for Microchip FPGA Designs
[link_type] => custom
[link_url] => https://bit.ly/31zAnwy
[image_classes] =>
[link_classes] =>
[link_rel] =>
[link_target_blank] =>
[image_title] =>
[attachment_id] => 292410
[url] => https://semiwiki.com/wp-content/uploads/2020/10/WIKI_White-Paper_HDL-Simulation-Acceleration-for-Microchip-FPGA-Designs.jpg
[title] =>
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] =>
)
Array
(
[0] => rpwe_widget-9
[1] => gtranslate-3
[2] => media_image-9
[3] => xfrp_widget-2
[4] => media_image-8
)
WP_Term Object
(
[term_id] => 14
[name] => Synopsys
[slug] => synopsys
[term_group] => 0
[term_taxonomy_id] => 14
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 528
[filter] => raw
[cat_ID] => 14
[category_count] => 528
[category_description] =>
[cat_name] => Synopsys
[category_nicename] => synopsys
[category_parent] => 157
[is_post] =>
)
Recent_Posts_Widget_Extended Instance: 9Array
(
[title] => Trending Now
[title_url] =>
[ignore_sticky] => 1
[exclude_current] => 1
[limit] => 5
[offset] => 10
[order] => DESC
[orderby] => date
[post_type] => Array
(
[0] => post
)
[post_status] => publish
[cat] => Array
(
)
[tag] => Array
(
)
[taxonomy] =>
[excerpt] =>
[length] => 10
[date] =>
[date_relative] =>
[date_modified] =>
[readmore] =>
[readmore_text] => Read More
[comment_count] =>
[thumb] =>
[thumb_height] => 55
[thumb_width] => 55
[thumb_default] =>
[thumb_align] => rpwe-alignleft
[styles_default] => 1
[cssID] =>
[css_class] =>
[css] => .rpwe-block ul{
list-style: none !important;
margin-left: 0 !important;
padding-left: 0 !important;
}
.rpwe-block li{
border-bottom: 1px solid #eee;
margin-bottom: 10px;
padding-bottom: 10px;
list-style-type: none;
}
.rpwe-block a{
display: inline !important;
text-decoration: none;
}
.rpwe-block h3{
background: none !important;
clear: none;
margin-bottom: 0 !important;
margin-top: 0 !important;
font-weight: 400;
font-size: 12px !important;
line-height: 1.5em;
}
.rpwe-thumb{
border: 1px solid #eee !important;
box-shadow: none !important;
margin: 2px 10px 2px 0;
padding: 3px !important;
}
.rpwe-summary{
font-size: 12px;
}
.rpwe-time{
color: #bbb;
font-size: 11px;
}
.rpwe-comment{
color: #bbb;
font-size: 11px;
padding-left: 5px;
}
.rpwe-alignleft{
display: inline;
float: left;
}
.rpwe-alignright{
display: inline;
float: right;
}
.rpwe-aligncenter{
display: block;
margin-left: auto;
margin-right: auto;
}
.rpwe-clearfix:before,
.rpwe-clearfix:after{
content: "";
display: table !important;
}
.rpwe-clearfix:after{
clear: both;
}
.rpwe-clearfix{
zoom: 1;
}
[before] =>
[after] =>
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[display_widget_mobile] =>
)
GTranslateWidget Instance: 3Array
(
[title] => Google Translate
[rw_opt] => Array
(
[pageid_281769] => 1
[pageid_281772] => 1
[widget_select] => 1
)
[display_widget_mobile] =>
)
WP_Widget_Media_Image Instance: 9Array
(
[display_widget_title] => on
[size] => full
[width] => 400
[height] => 400
[caption] =>
[alt] => Semiwiki 400x400
[link_type] => custom
[link_url] => https://www.agnisys.com/events/webinar-on-system-development-using-agnisys/
[image_classes] =>
[link_classes] =>
[link_rel] =>
[link_target_blank] =>
[image_title] =>
[attachment_id] => 292418
[url] => https://semiwiki.com/wp-content/uploads/2020/10/Semiwiki_400x400.jpg
[title] =>
[display_widget_mobile] =>
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
)
XF2_Latest_Posts_Widget Instance: 2Array
(
[title] => Recent Forum Threads
[title_url] =>
[ignore_sticky] => 0
[exclude_current] => 0
[limit] => 10
[offset] => 0
[order] =>
[orderby] => ID
[post_type] => Array
(
[0] => post
)
[post_status] =>
[cat] => Array
(
)
[tag] => Array
(
)
[taxonomy] =>
[excerpt] =>
[length] => 0
[date] =>
[date_relative] =>
[date_modified] =>
[readmore] =>
[readmore_text] =>
[comment_count] =>
[thumb] =>
[thumb_height] => 0
[thumb_width] => 0
[thumb_default] =>
[thumb_align] =>
[styles_default] =>
[cssID] =>
[css_class] =>
[css] =>
[before] =>
[after] =>
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[sluglist] => ["jobs-dashboard"]
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
)
Array
(
[title] => Recent Forum Threads
[title_url] =>
[ignore_sticky] => 0
[exclude_current] => 0
[limit] => 10
[offset] => 0
[order] =>
[orderby] => ID
[post_type] => Array
(
[0] => post
)
[post_status] =>
[cat] => Array
(
)
[tag] => Array
(
)
[taxonomy] =>
[excerpt] =>
[length] => 0
[date] =>
[date_relative] =>
[date_modified] =>
[readmore] =>
[readmore_text] =>
[comment_count] =>
[thumb] =>
[thumb_height] => 0
[thumb_width] => 0
[thumb_default] =>
[thumb_align] =>
[styles_default] =>
[cssID] =>
[css_class] =>
[css] =>
[before] =>
[after] =>
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[sluglist] => ["jobs-dashboard"]
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
)
Array
a
Array
(
[title] => Recent Forum Threads
[title_url] =>
[ignore_sticky] => 0
[exclude_current] => 0
[limit] => 10
[offset] => 0
[order] =>
[orderby] => ID
[post_type] => Array
(
[0] => post
)
[post_status] =>
[cat] => Array
(
)
[tag] => Array
(
)
[taxonomy] =>
[excerpt] =>
[length] => 0
[date] =>
[date_relative] =>
[date_modified] =>
[readmore] =>
[readmore_text] =>
[comment_count] =>
[thumb] =>
[thumb_height] => 0
[thumb_width] => 0
[thumb_default] =>
[thumb_align] =>
[styles_default] =>
[cssID] =>
[css_class] =>
[css] =>
[before] =>
[after] =>
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
[sluglist] => ["jobs-dashboard"]
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
[node_name] => Synopsys
[node_id] => Array
(
[0] => 2
)
)
XF\Mvc\Entity\ArrayCollection Object
(
[entities:protected] => Array
(
[371] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)
XF\Mvc\Entity\ArrayCollection Object
(
[entities:protected] => Array
(
[13176] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 49
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13176
[node_id] => 371
[title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[reply_count] => 0
[view_count] => 99
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1603382801
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44258
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1603382801
[last_post_id] => 44258
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13172] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 50
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13172
[node_id] => 371
[title] => Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade
[reply_count] => 0
[view_count] => 76
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1603291475
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44250
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1603291475
[last_post_id] => 44250
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13168] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 51
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13168
[node_id] => 371
[title] => TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
[reply_count] => 0
[view_count] => 101
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1603228025
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44245
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1603228025
[last_post_id] => 44245
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13164] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 52
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13164
[node_id] => 371
[title] => Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence
[reply_count] => 0
[view_count] => 63
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1603200838
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44241
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1603200838
[last_post_id] => 44241
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13158] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 53
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13158
[node_id] => 371
[title] => Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution
[reply_count] => 0
[view_count] => 90
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1603122925
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44231
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1603122925
[last_post_id] => 44231
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13149] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 54
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13149
[node_id] => 371
[title] => Synopsys and SiMa.ai Collaborate to Bring MachSynopsys and SiMa.ai Collaborate to Bring Machine Leine Learning Inference at Scale to the Embedded Edge
[reply_count] => 0
[view_count] => 192
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602685075
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44209
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602685075
[last_post_id] => 44209
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13148] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 55
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13148
[node_id] => 371
[title] => Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications
[reply_count] => 0
[view_count] => 163
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602684996
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44208
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602684996
[last_post_id] => 44208
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13141] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 56
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13141
[node_id] => 371
[title] => Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon Scalable Processor
[reply_count] => 0
[view_count] => 135
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602595486
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44198
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602595486
[last_post_id] => 44198
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13140] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 57
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13140
[node_id] => 371
[title] => Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon Lifecycle Management Platform
[reply_count] => 0
[view_count] => 161
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602534866
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44194
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602534866
[last_post_id] => 44194
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13139] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 58
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13139
[node_id] => 371
[title] => Synopsys Names Shankar Krishnamoorthy General Manager of the Digital Design Group
[reply_count] => 0
[view_count] => 127
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602534707
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44193
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602534707
[last_post_id] => 44193
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13137] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 59
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13137
[node_id] => 371
[title] => Synopsys IC Compiler II Delivers First-Pass Silicon Success for Graphcore's Multi-Billion Gate AI Processor
[reply_count] => 0
[view_count] => 130
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602513036
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44191
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602513036
[last_post_id] => 44191
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13129] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 60
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13129
[node_id] => 371
[title] => Synopsys' Digital Design Technology Symposium to Showcase Latest Innovations for AI, Automotive, HPC and 5G Chip Design
[reply_count] => 0
[view_count] => 143
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602170146
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44174
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602170146
[last_post_id] => 44174
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13128] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 61
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13128
[node_id] => 371
[title] => Synopsys DesignWare CXL IP Supports AMBA CXS Protocol Targeting High-Performance Computing SoCs
[reply_count] => 0
[view_count] => 110
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1602170121
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44173
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1602170121
[last_post_id] => 44173
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13090] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 62
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13090
[node_id] => 371
[title] => Synopsys Delivers Industry's First Processor IP Certified for Full ISO 26262 ASIL D Compliance
[reply_count] => 0
[view_count] => 201
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1601472112
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44101
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1601472112
[last_post_id] => 44101
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13074] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 63
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13074
[node_id] => 371
[title] => Synopsys to Host Panel on AI for Chip Design at AI Hardware Summit 2020
[reply_count] => 0
[view_count] => 164
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1601309152
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44084
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1601309152
[last_post_id] => 44084
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13062] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 64
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13062
[node_id] => 371
[title] => Synopsys and GLOBALFOUNDRIES Collaborate to Expand Fusion Compiler Benefits for Latest Platforms
[reply_count] => 0
[view_count] => 176
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1600953230
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44063
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1600953230
[last_post_id] => 44063
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13061] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 65
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13061
[node_id] => 371
[title] => Synopsys and GLOBALFOUNDRIES Collaborate to Develop Broad Portfolio of DesignWare IP for 12LP+ FinFET Solution
[reply_count] => 0
[view_count] => 154
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1600952877
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 44062
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1600952877
[last_post_id] => 44062
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13038] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 66
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13038
[node_id] => 371
[title] => NSITEXE Successfully Develops Multiple Custom Processors for Automotive Applications in Half the Time with Synopsys ASIP Designer Tool
[reply_count] => 0
[view_count] => 204
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1600299989
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 43997
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1600299989
[last_post_id] => 43997
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[13025] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 67
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 13025
[node_id] => 371
[title] => Synopsys Publishes BSIMM11 Study Highlighting Fundamental Shifts in Software Security Initiatives in Response to DevOps and Digital Transformation
[reply_count] => 0
[view_count] => 208
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1600177326
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 43978
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1600177326
[last_post_id] => 43978
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[12998] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 68
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 12998
[node_id] => 371
[title] => DSP Group Selects Synopsys' ARC EM Processor IP for Adaptive Processing Smart Codecs
[reply_count] => 0
[view_count] => 238
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1599743429
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 43918
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1599743429
[last_post_id] => 43918
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[discussion_count] => 153
[message_count] => 153
[last_post_id] => 44258
[last_post_date] => 1603382801
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 13176
[last_thread_title] => Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 371
[title] => Synopsys
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 430
[display_in_list] => 1
[lft] => 119
[rgt] => 120
[depth] => 2
[style_id] => 0
[effective_style_id] => 4
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)
WP_Widget_Media_Image Instance: 8Array
(
[display_widget_title] => on
[attachment_id] => 291446
[url] => https://semiwiki.com/wp-content/uploads/2020/10/YieldHUB-SemiWiki-Webinar-300x300.jpg
[title] =>
[size] => medium
[width] => 2560
[height] => 2560
[caption] =>
[alt] => YieldHUB SemiWiki Webinar
[link_type] => custom
[link_url] => https://attendee.gotowebinar.com/register/6445215525925579788?source=SemiWiki.com
[image_classes] =>
[link_classes] =>
[link_rel] =>
[link_target_blank] =>
[image_title] =>
[display_widget_mobile] =>
[rw_opt] => Array
(
[widget_select] => 1
[pageid_281769] => 1
[pageid_281772] => 1
)
)
Intel TSMC Update!