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Part 1 of this 4-part series introduces the complexities of developing and bringing up the entire software stack on a System on Chip (SoC) or Multi-die system. It explores various approaches to deployment, highlighting their specific objectives and the unique challenges they address.
Introduction
As the saying goes, it’s… Read More
As the complexity of modern System-on-Chip (SoC) designs continues to rise, achieving energy efficiency measured as performance per watt has become a crucial design goal. With the increasing demand for powerful, multifunctional chips, balancing performance with power consumption has become essential. Realistic workloads… Read More
In the rapidly evolving world of high-performance computing (HPC) and artificial intelligence (AI), technological advancements must keep pace with increasing demands for speed, efficiency, and security. Synopsys recently announced the industry’s first complete PCIe 7.0 IP solution. This groundbreaking initiative addresses… Read More
Introduction of 2.5D and 3D multi-die based products are helping extend the boundaries of Moore’s Law, overcoming limitations in speed and capacity for high-end computational tasks. In spite of its critical function within the 3DIC paradigm, the interposer die’s role and related challenges are often neither fully comprehended… Read More
Prologue
Peter was running late for two reasons. First, he encountered unexpected heavy traffic and arrived ten minutes late for a crucial meeting with a customer to run a compliance test of his new 6G phone design prototyped on FPGAs. This prototype’s success was pivotal, as it could secure a significant purchase order.… Read More
Today’s advanced node chip designs are faced with many new complexities from design and verification down to manufacturing. The solutions used at every stage of chip development generate petabytes of data. Managing, analyzing, understanding, and acting upon that data is overwhelming and paralyzing. Manual interpretation… Read More
We all know that making advanced semiconductors is a team sport. TSMC can innovate the best processes, but without the right design flows, communication schemes and verified IP it becomes difficult to access those processes. Synopsys recently announced some details on this topic. It covers a lot of ground. The graphic at the top… Read More
The ever-growing demand for longer battery life in mobile devices and energy savings in general have pushed power optimization to the top of designers’ concerns. While various techniques like multi-VT transistors and clock gating offer power savings at gate-level design, the real impact occurs at system level, where hardware… Read More
Data communication speeds continue to grow. New encoding schemes, such as PAM-4 are helping achieve faster throughput. Compared to the traditional NRZ scheme, PAM4 can send twice the signal by using four levels vs. the two used in NRZ. The diagram at the top of this post shows the how data density is increased. With progress comes… Read More
Synopsys recently hosted an information rich-webinar, modestly titled “Improving Quality, FuSa, Reliability, and Security in Automotive Semiconductors”. I think they undersold the event; this was really about managing all of those things through the lifecycle of a car, in line with auto OEMs strategies for the future of the… Read More