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Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys

Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys
by Daniel Nenni on 04-17-2025 at 10:00 am

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HPC Bandwidth Explosion and 1.6T Ecosystem Interop Need

The exponential growth in data bandwidth requirements driven by HPC systems, AI, and ML applications has set the stage for an ever-increasing need for 1.6Tbps Ethernet. As data centers strive to manage vast data transfers with maximum efficiency, the urgency for interoperability… Read More


SNUG 2025: A Watershed Moment for EDA – Part 1

SNUG 2025: A Watershed Moment for EDA – Part 1
by Lauro Rizzatti on 04-15-2025 at 6:00 am

SNUG 2025 A Watershed Moment for EDA Figure 1

Hot on the heels of DVConUS 2025, the 35th annual Synopsys User Group (SNUG) Conference made its mark as a defining moment in the evolution of Synopsys—and the broader electronic design automation (EDA) industry. This year’s milestone event not only underscored Synopsys’ continued innovation but also affirmed the vision… Read More


Synopsys Webinar: The Importance of Security in Multi-Die Designs – Navigating the Complex Landscape

Synopsys Webinar: The Importance of Security in Multi-Die Designs – Navigating the Complex Landscape
by Daniel Nenni on 04-11-2025 at 6:00 am

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In today’s rapidly evolving digital landscape, the security of electronic systems is of the highest priority. This importance is underscored by technological advancements and increasing regulatory demands. Multi-die designs which integrate multiple dies (also called chiplets) into a single package, introduce … Read More


Synopsys Executive Forum: Driving Silicon and Systems Engineering Innovation

Synopsys Executive Forum: Driving Silicon and Systems Engineering Innovation
by Kalar Rajendiran on 04-09-2025 at 10:00 am

Sassine Keynote (with Satya)

The annual SNUG (Synopsys Users Group) conference, now in its 35th year, once again brought together key stakeholders to showcase accomplishments, discuss challenges, and explore opportunities within the semiconductor and electronics industry. With approximately 2,500 attendees, SNUG 2025 served as a dynamic hub for collaboration… Read More


Evolution of Memory Test and Repair: From Silicon Design to AI-Driven Architectures

Evolution of Memory Test and Repair: From Silicon Design to AI-Driven Architectures
by Kalar Rajendiran on 04-01-2025 at 6:00 am

STAR Memory System (SMS) Solution

Memory testing in the early days of computing was a relatively straightforward process. Designers relied on simple, deterministic approaches to verify the functionality of memory modules. However, as memory density increased and systems became more complex, the likelihood of faults also rose. With advancements in memory… Read More


DVCon 2025: AI and the Future of Verification Take Center Stage

DVCon 2025: AI and the Future of Verification Take Center Stage
by Lauro Rizzatti on 03-06-2025 at 10:00 am

DVCon 2025

The 2025 Design and Verification Conference (DVCon) was a four-day event packed with insightful discussions, cutting-edge technology showcases, and thought-provoking debates. The conference agenda included a rich mix of tutorial sessions, a keynote presentation, a panel discussion, and an exhibit hall with Electronic… Read More


Synopsys Expands Hardware-Assisted Verification Portfolio to Address Growing Chip Complexity

Synopsys Expands Hardware-Assisted Verification Portfolio to Address Growing Chip Complexity
by Kalar Rajendiran on 02-25-2025 at 6:00 am

Synopsys HAV Product Family

Last week, Synopsys announced an expansion of their Hardware-Assisted Verification (HAV) portfolio to accelerate semiconductor design innovations. These advancements are designed to meet the increasing demands of semiconductor complexity, enabling faster and more efficient verification across software and hardware… Read More


How Synopsys Enables Gen AI on the Edge

How Synopsys Enables Gen AI on the Edge
by Mike Gianfagna on 02-24-2025 at 10:00 am

How Synopsys Enables Gen AI on the Edge

Artificial intelligence and machine learning have undergone incredible changes over the past decade or so. We’ve witnessed the rise of convolutional neural networks and recurrent neural networks. More recently, the rise of generative AI and transformers. At every step, accuracy has been improved as depicted in the graphic… Read More


What is Different About Synopsys’ Comprehensive, Scalable Solution for Fast Heterogeneous Integration

What is Different About Synopsys’ Comprehensive, Scalable Solution for Fast Heterogeneous Integration
by Mike Gianfagna on 02-03-2025 at 10:00 am

What is Different About Synopsys’ Comprehensive, Scalable Solution for Fast Heterogeneous Integration

Multi-die design has become the center of a lot of conversation lately. The ability to integrate multiple heterogeneous devices into a single package has changed the semiconductor landscape, permanently. This technology has opened a path for continued Moore’s Law scaling at the system level. What comes next will truly be exciting.… Read More


Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?

Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
by Kalar Rajendiran on 01-28-2025 at 6:00 am

Synopsys Predictions for Multi Die Designs in 2025

Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More