WP_Term Object
(
    [term_id] => 15
    [name] => Cadence
    [slug] => cadence
    [term_group] => 0
    [term_taxonomy_id] => 15
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 484
    [filter] => raw
    [cat_ID] => 15
    [category_count] => 484
    [category_description] => 
    [cat_name] => Cadence
    [category_nicename] => cadence
    [category_parent] => 157
    [is_post] => 
)
            
14173 SemiWiki Banner 800x1001
WP_Term Object
(
    [term_id] => 15
    [name] => Cadence
    [slug] => cadence
    [term_group] => 0
    [term_taxonomy_id] => 15
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 484
    [filter] => raw
    [cat_ID] => 15
    [category_count] => 484
    [category_description] => 
    [cat_name] => Cadence
    [category_nicename] => cadence
    [category_parent] => 157
    [is_post] => 
)

Cerebrus, the ML-based Intelligent Chip Explorer from Cadence

Cerebrus, the ML-based Intelligent Chip Explorer from Cadence
by Kalar Rajendiran on 07-29-2021 at 10:00 am

Screen Shot 2021 07 21 at 4.39.06 PM

Electronic design automation (EDA) has come a long way from its beginnings. It has enabled chip engineers from specifying designs directly in layout format during the early days to today’s capture in RTL format. Every advance in EDA has made the task of designing a chip easier and increased the design team productivity, enabling… Read More


Instrumenting Post-Silicon Validation. Innovation in Verification

Instrumenting Post-Silicon Validation. Innovation in Verification
by Bernard Murphy on 07-28-2021 at 6:00 am

Instrumenting Post-Silicon Validation

Instrumenting post-silicon validation is not a new idea but here’s a twist. Using (pre-silicon) emulation to choose debug observation structures to instrument in-silicon. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO) and I continue our series on research… Read More


EDA Flows for 3D Die Integration

EDA Flows for 3D Die Integration
by Tom Dillinger on 07-20-2021 at 6:00 am

future integration

Background

The emergence of 2.5D heterogeneous die integration using a silicon (or organic) interposer has enabled unique system architectures.  The term “More than Moore” has been used to describe the circuit density and cost advantages of leveraging multiple die in the package, the die potentially in different process technologies. … Read More


Neural Nets and CR Testing. Innovation in Verification

Neural Nets and CR Testing. Innovation in Verification
by Bernard Murphy on 06-29-2021 at 10:00 am

Instrumenting Post-Silicon Validation

Leveraging neural nets and CR testing isn’t as simple as we first thought. But is that the last word in combining these two techniques? Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO) and I continue our series on research ideas. As always, feedback welcome.… Read More


Circuit Simulation Challenges to Design the Xilinx Versal ACAP

Circuit Simulation Challenges to Design the Xilinx Versal ACAP
by Daniel Payne on 06-24-2021 at 10:00 am

xilinx versal acap min

One of the most unique acronyms that I learned about this past year is ACAP from Xilinx, which stands for Adaptive Compute Acceleration Platform. At the recent Cadence LIVE event, I had the pleasure of watching Pei Yao, a Xilinx senior staff CAD engineer, as she talked about the challenges of getting all the analog and mixed-signals… Read More


EDA Design and Amazon Web Services (AWS)

EDA Design and Amazon Web Services (AWS)
by Daniel Payne on 06-21-2021 at 10:00 am

EC2 min

I first remember blogging about EDA in the cloud starting back in 2011, so what’s changed in the last 10 years you may ask? In 2011, it was basically a handful of EDA point tools running batch mode in the cloud, and you were on your own to integrate those into a coherent flow, so expect help from the CAD and IT departments for sure.… Read More


Connecting System Design to the Enterprise

Connecting System Design to the Enterprise
by Bernard Murphy on 06-16-2021 at 6:00 am

Connecting System Design to the Enterprise min

While systems design underpins the explosion in “smart everything”, it remains somewhat isolated from another explosion—the proliferation of tools for application lifecycle management (ALM). ALM tools are prevalent on the web, in the cloud and on our phones, to streamline product design and build, to track correspondence… Read More


Keynote from Google at CadenceLIVE Americas 2021

Keynote from Google at CadenceLIVE Americas 2021
by Kalar Rajendiran on 06-14-2021 at 10:00 am

CDNLive Americas 2021

Last week, Cadence hosted its annual CadenceLIVE Americas 2021 conference. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.

One of the keynotes was from Partha Ranganathan, VP and Engineering Fellow from Google. His talk was titled,… Read More


Cadence adds a new Fast SPICE Circuit Simulator

Cadence adds a new Fast SPICE Circuit Simulator
by Daniel Payne on 06-02-2021 at 10:00 am

SPICE spectrum. Fast SPICE

In the early years of Cadence their growth was bolstered through many well-timed acquisitions, however over the last several years I’ve noticed a distinctively different trend where they have internally developed EDA tools. I had a Zoom call with Jay Madiraju from Cadence, who markets their newly announced Fast SPICE … Read More


Fuzzing to Validate SoC Security. Innovation in Verification

Fuzzing to Validate SoC Security. Innovation in Verification
by Bernard Murphy on 05-26-2021 at 6:00 am

Innovation image 2021 min

Fuzzing is to software verification what randomization is hardware verification. Can a fuzzing approach improve hardware security testing? Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO) and I continue our series on research ideas. As always, feedback… Read More