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Another Smart EDA Merger Adds RF Tools

Another Smart EDA Merger Adds RF Tools
by Daniel Payne on 12-12-2019 at 10:00 am

Mergers and acquisitions are just a fact of modern business life, so the semiconductor, IP and EDA industries all can benefit, but only when the two companies have complementary products with some actual synergy. Cadence acquired OrCAD back in 1999, adding a Windows-based PCB tool to their product lineup, and here in 2019 some … Read More


Cadence Shows off 5LPE Hercules Implementation

Cadence Shows off 5LPE Hercules Implementation
by Randy Smith on 10-28-2019 at 10:00 am

In a joint presentation given by Samsung, Arm, and Cadence at the Arm TechCon event on October 9, 2019, Cadence showed some results and explained its collaboration project used to implement the new Arm Hercules CPU on Samsung’s advanced 5LPE process. I do not want to minimize the significance of Samsung’s and Arm’s participation… Read More


Cadence and Green Hills Share More Security Thoughts at ARM Techcon

Cadence and Green Hills Share More Security Thoughts at ARM Techcon
by Randy Smith on 10-15-2019 at 10:00 am

On Wednesday, October 9, 2019, I had the pleasure of spending the day at ARM Techcon at the San Jose Convention Center. In the morning, in addition to getting some sneak peeks into the exhibitor area, I attended some of the morning keynote presentations, which focused on artificial intelligence (AI) and machine learning (ML) topics.… Read More


Cadence Celsius Heats Up 3D System-Level Electro-Thermal Modeling Market

Cadence Celsius Heats Up 3D System-Level Electro-Thermal Modeling Market
by Tom Simon on 09-24-2019 at 6:00 am

A few years back people were saying that the “EDA” problem was solved and that design tools had become commodity. At the same time people hailed ADAS, smart homes, mobile communication and AI as the frontiers of electronics.  Perhaps it could be said that layout tools, routers, placers, and circuit simulators had largely matured… Read More


Lint for Implementation

Lint for Implementation
by Bernard Murphy on 08-29-2019 at 6:00 am

When I was at Atrenta, we took advantage of opportunities to expand our static tool (aka linting) first to clock domain crossing (CDC) analysis and DFT compatibility and later to static analysis of timing constraints, all of which have importance in implementation. CDC is commonly thought of as an RTL-centric analysis, however,… Read More


Virtuoso Adapts to Address Cyber Physical Systems

Virtuoso Adapts to Address Cyber Physical Systems
by Tom Simon on 07-29-2019 at 2:00 pm

LIDAR is a controversial topic, with even Elon Musk weighing in on whether it will ever be feasible for use in self driving cars. His contention is that the sensors will remain too expensive and potentially be unreliable because of their mechanical complexity. However, each of the sensors available for autonomous driving have … Read More


#DAC56 – Optimizing Verification Throughput for Advanced Designs in a Connected World

#DAC56 – Optimizing Verification Throughput for Advanced Designs in a Connected World
by Daniel Payne on 07-24-2019 at 10:00 am

It was the final day of DAC56 and my head was already spinning from information overload after meeting so many people and hearing so many presentations, but I knew that IC functional verification was a huge topic and looming bottleneck for many SoC design teams, so I made a last-minute email request to attend a luncheon panel discussion… Read More


SiP is the new SoC @ 56thDAC

SiP is the new SoC @ 56thDAC
by Tom Dillinger on 06-19-2019 at 6:48 pm

The emergence of 3D packaging technology has been accompanied by the term “more than Moore”, to reflect the increase in areal circuit density at a rate that exceeds the traditional IC scaling pace associated with Moore’s Law.  At the recent Design Automation Conference in Las Vegas, numerous exhibits on the vendor floor presented… Read More


Parallel SPICE Circuit Simulator Debuts

Parallel SPICE Circuit Simulator Debuts
by Daniel Payne on 06-03-2019 at 10:01 am

In EDA the most successful companies will often re-write their software tools in order to add new features, improve accuracy, increase capacity and of course, shorten run times. For SPICE circuit simulators we typically look at several factors to see if a new tool is worth a look or not:

  • Netlist compatibility
  • Model support
  • Foundry
Read More

JasperGold Gets Smarter, Faster and Easier for Signoff

JasperGold Gets Smarter, Faster and Easier for Signoff
by Bernard Murphy on 05-28-2019 at 5:00 am

Machine learning (ML) is already making its way into EDA tools and flows, but the majority of announcements have been around implementation, especially in guiding toward improved timing and area. This is a pretty obvious place to start; ML is in one sense an optimization technique, trained on prior examples, which should be able… Read More