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Cadence – Redefining EDA Through Computational Software

Cadence – Redefining EDA Through Computational Software
by Mike Gianfagna on 05-12-2020 at 10:00 am

Screen Shot 2020 05 09 at 6.52.49 PM

Based on what I’m seeing, I believe Cadence is looking at the world a bit differently these days. I first reported about their approach to machine learning for EDA in March, and then there was their white paper about Intelligent System Design in April. It’s now May, and Cadence is shaking things up again with a new white paper entitled… Read More


Cadence – Defining a Roadmap to the Future

Cadence – Defining a Roadmap to the Future
by Mike Gianfagna on 04-16-2020 at 10:00 am

Screen Shot 2020 04 08 at 7.46.46 PM

Cadence recently published a position paper that details a set of enabling technologies that will be needed for product design going forward. Entitled Intelligent System Design, the piece describes the changing landscape of system design and the requirements for success. Cadence has built a branded approach to address these… Read More


Webinar: Design Methodologies for Next-Generation Heterogeneously Integrated 2.5/3D-IC Designs

Webinar: Design Methodologies for Next-Generation Heterogeneously Integrated 2.5/3D-IC Designs
by Herb Reiter on 04-10-2020 at 6:00 am

2d 3d Semiconductor Packaging SemiWiki Cadence

I had the opportunity to preview the upcoming SemiWiki webinar titled: Design Methodologies for Next-Generation Heterogeneously Integrated 2.5/3D-IC Designs. John Park’s message, describing this powerful Cadence solution, really impressed me. That’s why I want to encourage you to register for it and join this SemiWiki … Read More


Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput

Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput
by Mike Gianfagna on 03-23-2020 at 6:00 am

FINAL2 Digital FF iSpatial Flow hi res

Artificial intelligence (AI) and machine learning (ML) are hot topics. Beyond the impact these technologies are having on the world around us, they are also having impact on the semiconductor and EDA ecosystem. I posted a blog last week that discussed how Cadence views AI/ML, both from a tool and ecosystem perspective. The is one… Read More


Machine Learning for EDA – Inside, Outside and Everywhere Else

Machine Learning for EDA – Inside, Outside and Everywhere Else
by Mike Gianfagna on 03-18-2020 at 6:00 am

Paul Cunningham

Artificial intelligence (AI) is everywhere. The rise of the machines is upon us in case you haven’t noticed. Machine learning (ML) and its associated inference abilities promise to revolutionize everything from driving your car to making breakfast. We hear a lot about the macro, end-product impact of this technology, but there… Read More


Designing Next Generation Memory Interfaces: Modeling, Analysis, and Tips

Designing Next Generation Memory Interfaces: Modeling, Analysis, and Tips
by Mike Gianfagna on 03-04-2020 at 10:00 am

IBIS AMI vs. Transient

At DesignCon 2020, there was a presentation by Micron, Socionext and Cadence that discussed design challenges and strategies for using the new low-power DDR specification (LPDDR5). As is the case with many presentations at DesignCon, ecosystem collaboration was emphasized. Justin Butterfield (senior engineer at Micron)… Read More


Bridging the Gap Between Design and Analysis

Bridging the Gap Between Design and Analysis
by Mike Gianfagna on 02-20-2020 at 6:00 am

PCB design challenges

At the recent DesignCon 2020 in Santa Clara, Cadence introduced a new product, Sigrity Aurora. You won’t find a press release about this announcement. Rather, Brad Griffin, product management group director at Cadence, presented Sigrity Aurora in the theater at the Cadence booth. This one caught my eye and deserves some discussion.… Read More


IBIS-AMI Back-Channel System Optimization in Practice

IBIS-AMI Back-Channel System Optimization in Practice
by Mike Gianfagna on 02-18-2020 at 6:00 am

Picture1 1

I recently spent some time at DesignCon 2020 in Santa Clara. For those who haven’t attended this show in a while, you need to go. It’s no longer a small event focused on chip design. It has grown into a true system-level conference, with a broad ecosystem represented on the show floor and in the technical sessions. Ecosystem is an important… Read More


AI Interposer Power Modeling and HBM Power Noise Prediction Studies

AI Interposer Power Modeling and HBM Power Noise Prediction Studies
by Mike Gianfagna on 02-07-2020 at 6:00 am

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I attended a session on 2.5D silicon interposer analysis at DesignCon 2020. Like many presentations at this show, ecosystem collaboration was a focus. In this session, Jinsong Hu (principal application engineer at Cadence) and Yongsong He (senior staff engineer at Enflame Tech) presented approaches for interposer power modeling… Read More


Signal Channel Design and Simulation for Silicon Interposer Packaging on High-Speed SerDes

Signal Channel Design and Simulation for Silicon Interposer Packaging on High-Speed SerDes
by Mike Gianfagna on 02-04-2020 at 10:00 am

Picture2

This year is the 25th anniversary for DesignCon.  The show has changed a lot over the years. Today, it’s a vibrant showcase of all aspects of advanced product design – from ICs to boards to systems. The show floor reflects the diverse ecosystem. If you missed it this year, definitely plan to go next year.

The DesignCon technical program… Read More