Dan is joined by Brandon Bautz, senior group director of product management responsible for silicon signoff and verification product lines in the Cadence Digital & Signoff Group. Brandon has more than 20 years of experience in chip design and the EDA industry and has been at Cadence for over 10 years.
Dan explores the current and future design challenges being addressed by STA at Cadence. Strategies to deliver cost-effective performance in the face of exploding design complexity are discussed. The role of STA to address variability, aging, IR drop/max frequency issues and 3D implementation are also discussed among other topics.
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