Podcast EP105: Cadence STA Strategy and Capabilities, Today and Tomorrow with Brandon Bautz

Podcast EP105: Cadence STA Strategy and Capabilities, Today and Tomorrow with Brandon Bautz
by Daniel Nenni on 09-02-2022 at 10:00 am

Dan is joined by Brandon Bautz, senior group director of product management responsible for silicon signoff and verification product lines in the Cadence Digital & Signoff Group. Brandon has more than 20 years of experience in chip design and the EDA industry and has been at Cadence for over 10 years.

Dan explores the current and future design challenges being addressed by STA at Cadence. Strategies to deliver cost-effective performance in the face of exploding design complexity are discussed. The role of STA to address variability, aging, IR drop/max frequency issues and 3D implementation are also discussed among other topics.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.

Semiconductor Insiders
Semiconductor Insiders
Podcast EP105: Cadence STA Strategy and Capabilities, Today and Tomorrow with Brandon Bautz
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