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Webinar: Warpage has a Timing Problem

Webinar: Warpage has a Timing Problem
by Daniel Nenni on 08-25-2026 at 9:00 am

Thermo mechanical (1)

In advanced packaging, warpage is rarely a modeling problem. It is a timing problem.

JOHN BRUGGEMAN


By the time many advanced packages undergo high-fidelity thermo-mechanical analysis, a long chain of decisions has already been made. Stackup. Materials. Die placement. Package architecture. Each decision constrains the Read More


Optimizing for Thermoelastic in Package and PCB Design from the Outset

Optimizing for Thermoelastic in Package and PCB Design from the Outset
by Bernard Murphy on 08-25-2026 at 6:00 am

Vinci image

Signoff-quality design tools are mandatory for signoff, though not so good for early design exploration. Signoff demands high accuracy in design description and high precision in analysis. The first requirement can’t be met early in design where architecture decisions are still in flux, and the second depends on very detailed… Read More


CEO Interview with Dr. Hardik Kabaria of Vinci

CEO Interview with Dr. Hardik Kabaria of Vinci
by Daniel Nenni on 04-12-2026 at 12:00 pm

HardikKabariaHeadshot (1)

Hardik Kabaria is the founder and CEO of Vinci, a frontier lab building systems that make physical reality continuously computable.

While software has become programmable, physics has remained episodic—accessed through discrete simulations and approximations. Vinci is changing that. Under Kabaria’s leadership, the company

Read More