Podcast EP354: How Siemens EDA is Conquering New Lithography Challenges with Sagar Saxena
Daniel is joined by Sagar Saxena, Senior Product Engineer at Siemens EDA specializing in computational lithography, optical proximity correction (OPC), and advanced patterning solutions for leading-edge semiconductor manufacturing. Sagar has led the development and deployment of advanced OPC technologies, including curvilinear OPC methodologies, computational lithography workflows, and next-generation mask synthesis solutions. His work has contributed to high-volume manufacturing enablement at advanced nodes for some of the world’s most advanced semiconductor processes.
Dan explores the changing world of mask fabrication with Sagar in this informative discussion. Sagar describes the changes underway to move from orthogonal (Manhattan-style) mask layout to a curvilinear format. Sagar explains that curvilinear shapes are more compatible with current high-density manufacturing, but these types of geometries introduce substantial challenges for geometry processing and OPC. These challenges include run time, data size and overall complexity.
Sagar describes a unique approach that Siemens EDA has implemented to address these challenges, opening the way to better yield and performance. He describes the approach, along with descriptions of actual customer usage.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.
The Packaging PDK Is the Missing Layer for Co-Packaged Optics