Dan is joined by Dr. Rahul Manepalli. Rahul is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization. Rahul and his team are responsible for developing the next generation of materials, processes and equipment for Intel’s package substrate pathfinding and development efforts. He has been with Intel for over 23 years
Rahul recounts the R&D efforts that Intel invested in glass substrates over the past decade. He details the challenges of bringing this material to the mainstream, with reliable handling being a major focus The performance, flexibility and scaling benefits of glass substrates are also discussed, along with a forward view of production deployment.
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