Dan is joined by Dan Kochpatcharin, Dan joined TSMC in 2007. Prior to his current role heading up the Design Infrastructure Management Division, Dan led the Japan customer strategy team, the technical marketing and support team for the EMEA region in Amsterdam and was a part of the team leading the formation of the TSMC Open Innovation Platform. Prior to TSMC, Dan worked at Chartered Semiconductor both in the US and Singapore and LSI Logic.
The history of TSMC ecosystem collaboration is reviewed, starting with the first reference flow work in 2001. TSMC’s OIP Ecosystem has been evolving for the past 15 years and Dan provides an overview of the activities and impact of this work. Ecosystem-wide enablement of 3DIC design is also discussed with a review of the TSMC 3DFabric Alliance and 3Dblox.
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