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Electronic Design Automation
Part 1 of this 4-part series introduces the complexities of developing and bringing up the entire software stack on a System on Chip (SoC) or Multi-die system. It explores various approaches to deployment, highlighting their specific objectives and the unique challenges they address.
As the saying goes, it’s… Read More
#61DAC is evolving. The big get bigger and ultimately focus on other venues for customer outreach and branding. This is a normal evolution in any industry. For EDA, it was noticed by many that Cadence and Synopsys have downsized their booths at DAC. Everyone knows CDNLive and SNUG are very successful events for these companies and… Read More
RISC-V is clearly gaining momentum across many applications. That was quite clear at #61DAC as well. Breker Verification Systems solves challenges across the functional verification process for large, complex semiconductors. Its Trek family of products is production-proven at many leading semiconductor companies worldwide.… Read More
The theme of this year’s DAC was Chips to Systems which is a full circle type of thing since systems companies used to make their own chips. Old school computer companies were the biggest chip makers when I started in the semiconductor industry. IDMs like Motorola and Intel replaced them at the chip level. Shortly after I joined… Read More
As the complexity of modern System-on-Chip (SoC) designs continues to rise, achieving energy efficiency measured as performance per watt has become a crucial design goal. With the increasing demand for powerful, multifunctional chips, balancing performance with power consumption has become essential. Realistic workloads… Read More
In my 40 years, I have worked for dozens of companies and just about everyone of them was acquired. Some of the acquisitions were accretive and some were not. Probably the best and most accretive one would be the Solido acquisition by Siemens EDA in 2017. I worked for Solido for ten years reporting to CEO Amit Gupta. I handled Taiwan … Read More
Chip design and Electronic Design Automation (EDA) are two sides of the same coin in the semiconductor industry. Both fields are critical for developing the advanced integrated circuits (ICs) that power our modern world. This article explores the differences between a career in chip design and EDA, drawing on my personal experience… Read More
The week before DAC I had the privilege to take a video call with Pradeep Thiagarajan – Product Manager, Simulation, Custom IC Verification at Siemens EDA to get an update on new simulation products. I’ve been following Solido for years now and knew that they were an early adopter of ML for Monte Carlo simulations with SPICE users.… Read More
Heterogeneous multi-die integration is gaining more momentum all the time. The limited roadmap offered by Moore’s Law monolithic, single-die integration has opened the door to a new era of more-than-Moore heterogeneous integration. The prospects offered by this new design paradigm are exciting and the entire ecosystem is… Read More
An emerging trend with IC design is the growing use of chiplets and even 3D IC designs, as the disaggregated approach has some economic and performance benefits over a single SoC. There are thermal challenges with using chiplets and 3D IC designs, so that means that thermal analysis has become more important. I just spoke with Michael… Read More
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Has ASML Reached the Great Wall of China