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Synopsys at Design Automation Conference 2026

Synopsys at Design Automation Conference 2026
by Daniel Nenni on 07-14-2026 at 6:00 am

dac 2026 semiwiki 600x300 v1

Synopsys is catalyzing the era of pervasive intelligence with comprehensive engineering solutions spanning silicon design, IP, and simulation and analysis. At this year’s Design Automation Conference (DAC), the company will showcase innovations transforming silicon and systems development for a wide range of applications… Read More


DAC 2026: Join Accellera for a dynamic luncheon exploring how artificial intelligence is reshaping the standards landscape for design and verification.

DAC 2026: Join Accellera for a dynamic luncheon exploring how artificial intelligence is reshaping the standards landscape for design and verification.
by Daniel Nenni on 07-13-2026 at 2:00 pm

DAC 2026 luncheon promo 400x400 (1)

Accellera Systems Initiative invites the design and verification community to join us at the 2026 Design Automation Conference for a focused technical luncheon, “Embracing AI for Advanced Design and Verification,” on Tuesday, July 28, from 12:30–1:45 p.m. at the Long Beach Convention Center, Meeting Room 104C.

Artificial… Read More


Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?

Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?
by Kalar Rajendiran on 07-09-2026 at 2:00 pm

2025 TSMC Revenue by Platform

The semiconductor landscape is currently undergoing a structural transformation as the “Data-Centric Shift” moves the industry’s center of gravity from smartphones toward High-Performance Computing (HPC) and AI infrastructure.

This transition is clearly validated by TSMC’s 2025 filings, which show… Read More


The Packaging PDK Is the Missing Layer for Co-Packaged Optics

The Packaging PDK Is the Missing Layer for Co-Packaged Optics
by Moh Kolb on 07-07-2026 at 10:00 am

PKG PDK MISSION CPO JUne26

From Photonic Device Design to Electro-Optical Realization

Co-packaged optics will not scale through photonic device performance alone.

As AI infrastructure pushes bandwidth, power, latency, and reach to new limits, optics is moving closer to the compute engine. The industry is no longer asking only whether a photonic device… Read More


All-Embracing Multiphysics Analysis for Chiplet-Based Systems

All-Embracing Multiphysics Analysis for Chiplet-Based Systems
by Bernard Murphy on 06-24-2026 at 6:00 am

Revised multiphysics graphic

What systems can accomplish by combining semiconductors, AI, and software seems at times boundless. Chiplet-based semiconductors deliver this promise, allowing a myriad of complex digital, memory, analog and photonic functions to be condensed into a single semiconductor package for higher performance, lower power consumption… Read More


AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoption

AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoption
by raghu shankar on 06-22-2026 at 6:00 am

2026 Jun AI Native Virtual Chiplet ecosystem Shift Left Shift Up Shift Out

Systems-in-package (SIPs) with 2.5D and 3D heterogenous integration, consisting of multiple dies and chiplets deliver 10x more functionality than traditional monolithic chips. This capability enables innovative solutions for diverse needs in scientific computing, automotive, edge computing, and aerospace/defense.… Read More


Feed Forward Intelligence: Enabling Testability in the Chiplets Era

Feed Forward Intelligence: Enabling Testability in the Chiplets Era
by Kalar Rajendiran on 06-18-2026 at 6:00 am

Data Feed Forward Architecture

The semiconductor industry is entering a new era in which advanced packaging and chiplets-based architectures are becoming the primary drivers of system-level innovation. As traditional process-node scaling becomes increasingly complex and expensive, manufacturers are turning to heterogeneous integration, combining… Read More


Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions

Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions
by Daniel Nenni on 06-17-2026 at 2:00 pm

Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions

Synopsys has announced the availability of the first wave of its Multiphysics Fusion Solutions, extending its vision of a unified engineering environment that connects EDA, semiconductor physics, system simulation, and artificial intelligence-driven optimization. The announcement addresses one of the most significant… Read More


The Memory Sector Is Becoming One of the Main Beneficiaries of the AI Boom

The Memory Sector Is Becoming One of the Main Beneficiaries of the AI Boom
by Daniel Nenni on 06-11-2026 at 10:00 am

The Memory Sector Is Becoming One of the Main Beneficiaries of the AI Boom

The explosive growth of artificial intelligence is transforming the semiconductor industry, and nowhere is this more evident than in the memory sector. AI training and inference workloads are fundamentally memory-intensive, driving unprecedented demand for advanced DRAM architectures, High Bandwidth Memory (HBM), and… Read More


Technical Paper: FPGA Prototyping That Creates Useful PreSilicon Evidence

Technical Paper: FPGA Prototyping That Creates Useful PreSilicon Evidence
by Daniel Nenni on 06-11-2026 at 6:00 am

FPGA Prototyping Beyond RTL Fit Building Useful Pre Silicon Evidence

As semiconductor designs continue to grow in complexity, FPGA prototyping has become an essential component of modern pre-silicon validation strategies. While FPGA capacity and gate-count equivalence often dominate discussions around prototyping platforms, the true value of an FPGA prototype lies elsewhere: its ability… Read More