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Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions

Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions
by Daniel Nenni on 06-17-2026 at 2:00 pm

Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions

Synopsys has announced the availability of the first wave of its Multiphysics Fusion Solutions, extending its vision of a unified engineering environment that connects EDA, semiconductor physics, system simulation, and artificial intelligence-driven optimization. The announcement addresses one of the most significant… Read More


The Memory Sector Is Becoming One of the Main Beneficiaries of the AI Boom

The Memory Sector Is Becoming One of the Main Beneficiaries of the AI Boom
by Daniel Nenni on 06-11-2026 at 10:00 am

The Memory Sector Is Becoming One of the Main Beneficiaries of the AI Boom

The explosive growth of artificial intelligence is transforming the semiconductor industry, and nowhere is this more evident than in the memory sector. AI training and inference workloads are fundamentally memory-intensive, driving unprecedented demand for advanced DRAM architectures, High Bandwidth Memory (HBM), and… Read More


Technical Paper: FPGA Prototyping That Creates Useful PreSilicon Evidence

Technical Paper: FPGA Prototyping That Creates Useful PreSilicon Evidence
by Daniel Nenni on 06-11-2026 at 6:00 am

FPGA Prototyping Beyond RTL Fit Building Useful Pre Silicon Evidence

As semiconductor designs continue to grow in complexity, FPGA prototyping has become an essential component of modern pre-silicon validation strategies. While FPGA capacity and gate-count equivalence often dominate discussions around prototyping platforms, the true value of an FPGA prototype lies elsewhere: its ability… Read More


From Evidence to Authority: Bounded Gate Authority for Governed Semiconductor Realization

From Evidence to Authority: Bounded Gate Authority for Governed Semiconductor Realization
by Moh Kolb on 06-09-2026 at 6:00 am

Picture1 BGA JUne2

Advanced semiconductor systems are no longer limited by a single engineering domain. They are constrained by the convergence of many interdependent vectors: silicon nodes, advanced packaging architectures, substrate materials, platform PCBs, power-delivery networks, thermal behavior, manufacturing variation, firmware… Read More


Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools

Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools
by Daniel Nenni on 06-04-2026 at 6:00 am

synopsys intel linkedin update 1200x1200 v3

As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More


Convergence Evidence Maturity Hierarchy: From Raw Data to Convergence-Authoritative Evidence

Convergence Evidence Maturity Hierarchy: From Raw Data to Convergence-Authoritative Evidence
by Moh Kolb on 06-03-2026 at 8:00 am

Picture1 CEMH

The semiconductor industry is generating more engineering data than ever before.

This article follows the previously published GFL and TCG foundation pieces. GFL introduced the lifecycle-governance problem. TCG clarified why observable or interoperable data is not automatically trustworthy convergence evidence. CEMH… Read More


A Look at the High-Profile Speakers Presenting at #DAC2026

A Look at the High-Profile Speakers Presenting at #DAC2026
by Mike Gianfagna on 06-01-2026 at 10:00 am

A Look at the High Profile Speakers Presenting at #DAC2026

Many of us think of DAC as an important trade show for the Semiconductors and EDA industries. That is certainly part of the history of DAC, but the event is also a highly prestigious technical conference dating back to 1964. In fact, the exhibits at DAC began 20 years after the conference started. That long history as a premier technical… Read More


Engineering the Next Era of Semiconductor Innovation

Engineering the Next Era of Semiconductor Innovation
by Kalar Rajendiran on 05-27-2026 at 8:00 am

Da Yang U2UNA2026 77

The semiconductor industry is entering a transformative new phase, driven by the convergence of artificial intelligence, cloud computing, and increasingly complex chip architectures. That message took center stage during the keynote talks at the Siemens EDA User2User 2026 North America conference. Executives from Siemens,… Read More


Trusted Convergence Governance: Preserving Admissibility Integrity Across Heterogeneous Semiconductor Systems

Trusted Convergence Governance: Preserving Admissibility Integrity Across Heterogeneous Semiconductor Systems
by Moh Kolb on 05-26-2026 at 8:00 am

Picture1 TCG (1)

As semiconductor systems evolve toward heterogeneous integration, chiplets, 2.5D and 3D packaging, distributed observability, runtime adaptation, Fleet Learning, and lifecycle convergence governance, the industry is entering a fundamentally new operational reality.

Convergence decisions are no longer driven only… Read More


CEO Interview with Vivek Raghunathan of Xscape Photonics

CEO Interview with Vivek Raghunathan of Xscape Photonics
by Daniel Nenni on 05-22-2026 at 4:00 pm

Vivek Raghunathan Xscape Photonics

Vivek Raghunathan has over 18 years of experience in silicon photonics. He was a Sr. Principal Engineer, Product Architect and Program Leader for Integrated Silicon Photonics at Broadcom driving key core technology development required to co-package optics with switches and demonstrated industry’s first 25.6T Ethernet … Read More