Keysight EDA 2025 Event

Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)

Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)
by Kalar Rajendiran on 12-09-2024 at 6:00 am

Synopsys SLM Solution Components

As industries become more reliant on advanced technologies, the importance of ensuring the reliability and longevity of critical systems grows. Failures in components, whether in autonomous vehicles, high performance computing (HPC), healthcare devices, or industrial automation, can have far-reaching consequences.… Read More


Podcast EP265: The History of Moore’s Law and What Lies Ahead with Intel’s Mr. Transistor

Podcast EP265: The History of Moore’s Law and What Lies Ahead with Intel’s Mr. Transistor
by Daniel Nenni on 12-08-2024 at 6:00 am

Dan is joined by Dr. Tahir Ghani, Intel senior fellow and director of process pathfinding in Intel’s Technology Research Group. Tahir has a 30-year career at Intel working on many innovations, including strained silicon, high-K metal gate devices, FinFETs, RibbonFETs, and backside power delivery (BSPD), among others. He has… Read More


Podcast EP264: How Sigasi is Helping to Advance Semiconductor Design with Dieter Therssen

Podcast EP264: How Sigasi is Helping to Advance Semiconductor Design with Dieter Therssen
by Daniel Nenni on 12-06-2024 at 10:00 am

Dan is joined by Dieter Therssen, CEO of Sigasi. Deiter started his career as a hardware design engineer, using IMEC’s visionary tools and design methodologies in the early days of silicon integration. Today, being CEO of Sigasi, a fast-growing, creative technology company is a perfect fit for Dieter. Having worked in that space… Read More


CEO Interview: GP Singh from Ambient Scientific

CEO Interview: GP Singh from Ambient Scientific
by Daniel Nenni on 12-06-2024 at 6:00 am

GP Sir Photo

Gajendra Prasad Singh, also known as GP Singh, is a seasoned tech professional with over 26 years of experience in advanced semiconductor chips. With a zeal to solve the most complex technical problems, he harped on a difficult journey to create programmable AI Microprocessors, that provide high-performance in a cost-effective… Read More


SystemReady Certified: Ensuring Effortless Out-of-the-Box Arm Processor Deployments

SystemReady Certified: Ensuring Effortless Out-of-the-Box Arm Processor Deployments
by Lauro Rizzatti on 12-05-2024 at 10:00 am

SystemReady Certified Ensuring Out of the Box Effortless Arm Processors Deployments Figure 1

When contemplating the Lego-like hardware and software structure of a leading system-on-chip (SoC) design, a mathematically inclined mind might marvel at the tantalizing array of combinatorial possibilities among its hardware and software components. In contrast, the engineering team tasked with its validation may have… Read More


PDF Solutions Hosts Executive Conference December 12 on AI’s Power to Transform Semiconductor Design and Manufacturing

PDF Solutions Hosts Executive Conference December 12 on AI’s Power to Transform Semiconductor Design and Manufacturing
by Daniel Nenni on 12-05-2024 at 6:00 am

PDF Solutions LI Post on Conference

PDF Solutions, Inc. will host an AI Executive Conference Thursday, December 12, in San Francisco featuring keynotes, presentations, panels and demonstrations offering insights into the power of AI to transform semiconductor design and manufacturing. The conference immediately follows the 70th Annual IEEE International… Read More


Accelerating Electric Vehicle Development – Through Integrated Design Flow for Power Modules

Accelerating Electric Vehicle Development – Through Integrated Design Flow for Power Modules
by Kalar Rajendiran on 12-04-2024 at 10:00 am

Existing EV Power Module Flow

The development of electric vehicles (EVs) is key to transitioning to sustainable transportation. However, designing high-performance EVs presents significant challenges, particularly in power module design. Power modules, including inverters, bulky DC capacitors, power management ICs (PMICs), and battery packs, … Read More


A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design

A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design
by Mike Gianfagna on 12-04-2024 at 6:00 am

A Master Class with Ansys and Synopsys, The Latest Advances in Multi Die Design

2.5D and 3D multi-die design is rapidly moving into the mainstream for many applications. HPC, GPU, mobile, and AI/ML are application areas that have seen real benefits. The concept of “mix/match” for chips and chiplets to form a complex system sounds deceptively simple. In fact, the implementation and analysis techniques required… Read More


SystemC Update 2024

SystemC Update 2024
by Daniel Payne on 12-03-2024 at 10:00 am

SystemC ecosystem min

SystemC version 1.0 came out in 2000 as a C++ class library for system-level modeling and simulation, and on SemiWiki.com there are some 497 references to the language. I wanted to provide an update in this blog so that engineering teams can become more efficient in using SystemC on their SoC projects, saving time and improving product… Read More


Innexis Product Suite: Driving Shift Left in IC Design and Systems Development

Innexis Product Suite: Driving Shift Left in IC Design and Systems Development
by Kalar Rajendiran on 12-03-2024 at 6:00 am

Full Spectrum Development Inexis Developer Pro

At the heart of the shift-left strategy is the goal of moving traditionally late-stage tasks—such as software development, validation, and optimization—earlier in the design process. This proactive approach allows teams to identify and resolve issues before they escalate, reducing costly rework and shortening the overall… Read More