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WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology

WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology
by Daniel Nenni on 06-12-2023 at 10:00 am

In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.

The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect wires establish connections between dies whereas TSVs are used to make connections with the package substrate.

2.5D IC design block diagram
Figure 1: 2.5D IC design block diagram
Why do we need 3D-ICs?

Emerging technologies like Artificial Intelligence, machine learning, and high-speed computing require highly functional, high-speed, and compact ICs. 3D-IC design technology offers ultra-high performance and reduced power consumption, making it suitable for multi-core CPUs, GPUs, high-speed routers, smartphones, and AI/ML applications. As the high-tech industry evolves, the need for smaller size and more functionality grows. The heterogeneous integration capability of 3D-IC design provides more functional density in a smaller area. The vertical architecture of 3D-ICs also reduces the interconnect length, allowing faster data exchange between dies. Overall, this advanced packaging technology is a much-needed IC design method to meet the growing demand for speed, more functionality, and less power consumption.

Benefits of 3D-ICs

One key advantage of 3D-ICs is heterogeneous integration. It allows the integration of chiplets in different technology nodes in the same space. Digital logic, analog circuits, memory, and sensors can be placed within a single package. This enables the creation of highly customized and efficient solutions tailored to specific application requirements.

Higher integration density is another benefit of 3D-IC design. By vertically stacking multiple layers of interconnected chiplets or wafers, the available chip area is utilized more efficiently. This increased integration density allows for the inclusion of more functionality within a smaller footprint, which is particularly beneficial in applications where size and weight constraints are critical, such as mobile devices and IoT devices.

3D-ICs also exhibit higher electrical performance. The reduced interconnect length in vertically stacked chips leads to shorter signal paths and lower resistance, resulting in improved signal integrity and reduced signal delay. This translates to higher data transfer rates, lower power consumption, and enhanced overall system performance.

With the latest configuration methods like TSMC’s CoWoS (Chip On Wafer on Substrate) and WoW (Wafer on Wafer), which utilize hybrid bonding techniques, the interconnect length is further minimized, leading to reduced power losses and improved performance.

3D-IC technology provides a range of exceptional advantages, including heterogeneous integration, higher integration density, smaller size, higher electrical performance, reduced cost, and faster time-to-market. These advantages make 3D-ICs a compelling solution for advanced chip designs in various industries.

Challenges of 3D-IC Design

Although 2.5D/3D-IC design methods have numerous advantages, these new methodologies have also introduced new challenges related to physics. The structural, thermal, Power, and Signal integrity of the entire 3D-IC system is more complicated. 3DIC designers are at the beginning of the learning curve to master the integrity challenges during the physical implementation of the system. Accurate simulation methods are a must for any chip designer especially when dealing with 3D-IC. Each component in the 3D-IC system should be examined and validated using highly accurate simulation tools.

Learn more about the latest developments in 3D-IC design, challenges, and simulation, and the key to a successful 3D-IC design by registering for the replay: Design and Analysis of Multi-Die & 3D-IC Systems by Ansys experts. He will also discuss the advanced simulation methods to predict the possible structural, thermal, Power, and Signal integrity issues in 3D-IC.

Also Read:

Chiplet Q&A with John Lee of Ansys

Multiphysics Analysis from Chip to System

Checklist to Ensure Silicon Interposers Don’t Kill Your Design

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