GSA 2024 European Executive Forum

GSA 2024 European Executive Forum
by Admin on 03-15-2024 at 2:06 pm

The GSA European Executive Forum is our flagship event in Europe which, over two days, always attracts the very top speakers and attendees: 300 senior decision makers, the majority VP and C-level profiles.

Over the past 20 years, it has become the reference executive event for the semiconductor industry in the EMEA region.

This… Read More


2024 Outlook with Elad Alon of Blue Cheetah Analog Design

2024 Outlook with Elad Alon of Blue Cheetah Analog Design
by Daniel Nenni on 03-13-2024 at 10:00 am

elad alon sq

We have been working with Blue Cheetah Analog Design for three years now with great success. With new process nodes coming faster than ever before and with chiplets being pushed to the forefront of technology, the die-to-die interconnect traffic on SemiWiki has never been greater and chiplets is one of our top search terms.

TellRead More


Chiplet ecosystems enable multi-vendor designs

Chiplet ecosystems enable multi-vendor designs
by Don Dingee on 02-20-2024 at 6:00 am

Chiplet Product Use Cases

Chiplets dominate semiconductor industry conversations right now – and after the recent Chiplet Summit, we expect the intensity to go up a couple of notches. One company name often heard is Blue Cheetah, and we had the opportunity to sit down with them recently to discuss their views and their just-announced design win at Tenstorrent.… Read More


How Disruptive will Chiplets be for Intel and TSMC?

How Disruptive will Chiplets be for Intel and TSMC?
by Daniel Nenni on 01-15-2024 at 10:00 am

UCIe Consortium

Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More


Keysight EDA Connect World Tour

Keysight EDA Connect World Tour
by Daniel Payne on 01-08-2024 at 6:00 am

RF System Explorer min

Video webinars are a main staple to learn what’s new about EDA tools and methodologies, but there’s nothing quite like meeting in person, where you can ask questions and gauge the expertise of the presenters. I was delighted to learn that Keysight is planning a literal world tour to update EDA customers and prospects on what they … Read More


Alphawave Semiconductor Powering Progress

Alphawave Semiconductor Powering Progress
by Daniel Nenni on 01-03-2024 at 6:00 am

Alphawave Semiconductor Chiplets

Do you know who had another great year? Alphawave Semi did. Despite being relatively young in the industry (founded in 2017), the company has quickly gained recognition for its advancements in high-speed connectivity solutions.

They specialize in developing high-speed connectivity solutions for Data centre, AI, 5G wireless… Read More


2024 Big Race is TSMC N2 and Intel 18A

2024 Big Race is TSMC N2 and Intel 18A
by Daniel Nenni on 01-01-2024 at 6:00 am

Intel PowerVia backside power delivery

There is a lot being said about Intel getting the lead back from TSMC with their 18A process. Like anything else in the semiconductor industry there is much more here than meets the eye, absolutely.

From the surface, TSMC has a massive ecosystem and is in the lead as far as process technologies and foundry design starts but Intel is … Read More


Will Chiplet Adoption Mimic IP Adoption?

Will Chiplet Adoption Mimic IP Adoption?
by Eric Esteve on 12-28-2023 at 6:00 am

Adoption theory

If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to chiplet-based architecture… Read More


Webinar: Meet Advanced IC Package Design Schedule Challenges with In-Design Analysis

Webinar: Meet Advanced IC Package Design Schedule Challenges with In-Design Analysis
by Admin on 12-26-2023 at 8:13 pm

The heterogeneous integration of chips/chiplets has added significant complexity to the IC package design process, further compressing schedules for many design teams. Design teams must work more efficiently to meet quality and performance goals while maintaining schedule milestones.

One way to improve efficiency is to… Read More


Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure

Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure
by Kalar Rajendiran on 12-19-2023 at 6:00 am

Alphawave Semi 224G SerDes 1st TestChip

In the rapidly evolving landscape of artificial intelligence (AI) and data-intensive applications, the demand for high-performance interconnect technologies has never been more critical. Even the 100G Interconnect is already not fast enough for infrastructure applications. AI applications, with their massive datasets… Read More