As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More
Consider this a standout presentation at the Silicon Catalyst Spring Portfolio Update Meeting held yesterday at the Computer History Museum. Mahesh Tirupattur, CEO of Analog Bits, is a modern-day, multidimensional semiconductor hero and one of my trusted few. Analog Bits is a premier member of the semiconductor ecosystem,… Read More
The designation of Silicon Catalyst as the exclusive strategic partner for Microelectronics US 2026 represents a significant alignment between a leading semiconductor startup ecosystem and a rapidly growing U.S. microelectronics industry event. This partnership reflects broader trends in semiconductor innovation, … Read More
One of my favorite times of the year is coming (sailing season) and my favorite event of the year is coming as the company I most respect will host the best international semiconductor networking event starting here in Silicon Valley.
The 32nd annual TSMC Technology Symposium represents one of the most influential events in the … Read More
Daniel is joined by Dr. Debendra Das Sharma, a Senior Fellow and Chief I/O architect in the Data Platforms and Artificial Intelligence Group at Intel. He is a member of the National Academy of Engineering (NAE), Fellow of IEEE, and Fellow of International Academy of AI Sciences. He is a leading expert on I/O subsystem and interface… Read More
In a significant move aimed at empowering semiconductor and systems-design engineers, MZ Technologies has announced the launch of a new video series focused on advanced packaging design. This initiative comes at a time when the semiconductor industry is rapidly shifting toward multi-die, 2.5D/3D integration, heterogeneous… Read More
Silicon Creations continues to strengthen its position as one of the most reliable and widely used analog and mixed-signal IP providers in the semiconductor industry. Founded in 2006, the company focuses on high-performance and low-risk IP solutions including PLLs, oscillators, SerDes interfaces, and high-speed differential
GlobalFoundries’ (GF) acquisition of MIPS in 2025 wasn’t a nostalgic move to revive a legacy CPU brand. It was a calculated step into one of the most lucrative frontiers in semiconductors: AI, high-performance computing (HPC), and datacenters. As Nvidia, AMD, Intel, and hyperscalers embrace chiplet architectures, GF is betting… Read More
In a significant milestone for the semiconductor industry, Teradyne was honored as the 2025 TSMC Open Innovation Platform® Partner of the Year for TSMC 3DFabric® Testing. This award, announced on September 25, 2025, underscores the deep collaboration between Teradyne, a leader in automated test equipment and robotics, and… Read More
In chiplet-based design we continue the march of Moore’s Law by scaling what we can put in a semiconductor package beyond the boundaries of what we can build on a single die. This style is already gaining traction in AI applications, high performance computing, and automotive, each of which aims to scale out to highly integrated … Read More
