ASML’s dominance was not born from a single invention. It emerged from four decades of systems engineering, supplier orchestration, and repeated bets on lithographic transitions that competitors judged too expensive. Founded in 1984 as a Philips–ASM joint venture, the Dutch company first differentiated itself with modular… Read More
Intel EMIB and Intel Foveros are advanced semiconductor-packaging technologies designed to combine multiple silicon dies, or chiplets, within one processor package. Both support heterogeneous integration: manufacturers can build different functions using the process technology best suited to each one, then connect … Read More
As wireless communication systems evolve toward 6G, satellite connectivity, advanced radar, and high-performance sensing applications, the integration of heterogeneous semiconductor technologies has become a critical challenge. Silicon CMOS remains the dominant platform for digital processing and system control,… Read More
Purple was in fashion at the 2026 Design Automation Conference, where Synopsys reinforced its position at the forefront of AI-powered engineering. Under the conference’s “Chips to Systems” theme, the company showcased intelligent, end-to-end technologies designed to help the semiconductor industry manage unprecedented… Read More
Every generation of semiconductor innovation has relied on one fundamental principle: before a technology can be manufactured at scale, it must first be understood. That understanding comes through characterization.
For decades, characterization enabled process learning. It helped engineers understand transistor behavior,… Read More
TSMC’s CoPoS, generally described as Chip-on-Panel-on-Substrate, and Intel’s EMIB, or Embedded Multi-die Interconnect Bridge, address the same strategic problem: integrating increasingly large, heterogeneous chiplet systems. However, they attack different physical constraints. CoPoS is an emerging panel-level … Read More
Accellera Systems Initiative invites the design and verification community to join us at the 2026 Design Automation Conference for a focused technical luncheon, “Embracing AI for Advanced Design and Verification,” on Tuesday, July 28, from 12:30–1:45 p.m. at the Long Beach Convention Center, Meeting Room 104C.
Artificial… Read More
From Photonic Device Design to Electro-Optical Realization
Co-packaged optics will not scale through photonic device performance alone.
As AI infrastructure pushes bandwidth, power, latency, and reach to new limits, optics is moving closer to the compute engine. The industry is no longer asking only whether a photonic device… Read More
Systems-in-package (SIPs) with 2.5D and 3D heterogenous integration, consisting of multiple dies and chiplets deliver 10x more functionality than traditional monolithic chips. This capability enables innovative solutions for diverse needs in scientific computing, automotive, edge computing, and aerospace/defense.… Read More
As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More
