HFSS – A History of Electromagnetic Simulation Innovation

HFSS – A History of Electromagnetic Simulation Innovation
by Daniel Nenni on 01-14-2021 at 10:00 am

ansys HFSS electric field distribution in coax to waveguide adapter

In the 155 years since James Clerk Maxwell introduced the world to Maxwell’s Equations in the “Dynamic Theory of the Electromagnetic Field” there have been some amazing breakthroughs and avenues of insight. As a young electrical engineering student, we are introduced to the set of equations describing electromagnetic waves,… Read More


The Gold Standard for Electromagnetic Analysis

The Gold Standard for Electromagnetic Analysis
by Daniel Nenni on 11-04-2020 at 6:00 am

Example of a multi level board analyzed by HFSS

Ansys HFSS has been the world’s trusted gold standard for  electromagnetic analysis for many years. As chip designs get bigger and more complex many users report that they’re extremely happy with the gold standard accuracy of HFSS but wish it would run faster. Fortunately Ansys has introduced many capabilities to HFSS over the… Read More


Executive Interview: Vic Kulkarni of ANSYS

Executive Interview: Vic Kulkarni of ANSYS
by Daniel Nenni on 09-23-2020 at 6:00 am

Ansys Ideas 1

On the eve of the Innovative Designs Enabled by Ansys Semiconductor (IDEAS) Forum I spoke with Vic on a range of topics including his opening keynote: Accelerating Moore and Beyond Moore with Multiphysics. You can register here

Vic Kulkarni is Vice President and Chief Strategist, Semiconductor Business Unit, Ansys, San Jose.… Read More


World’s Leading Chip Designers at IDEAS Digital Forum Show How to Streamline Design Flows and Reduce Design Cost

World’s Leading Chip Designers at IDEAS Digital Forum Show How to Streamline Design Flows and Reduce Design Cost
by Daniel Nenni on 09-03-2020 at 10:00 am

ANSYS IDEAS Airplane

Innovative Designs Enabled by Ansys Semiconductor

I’m excited to announce that general registration is now open for the new Ansys IDEAS Digital Forum!  IDEAS, hosted by Ansys Semiconductor, is a virtual gathering of top industry executives, thought leaders, and designers from some of the biggest IP, chip design, semiconductor… Read More


The Largest Engineering Simulation Virtual Event in the World!

The Largest Engineering Simulation Virtual Event in the World!
by Daniel Nenni on 05-22-2020 at 10:00 am

ANSYS Simulation World

ANSYS is the world leader in engineering simulation across multiple markets. One of those markets just happens to be semiconductor which is why ANSYS is on SemiWiki.com. Due to the pandemic ANSYS has transformed their popular live regional events to one broad virtual event “Simulation World”.

“Simulation World is world’s largestRead More


Reliability Challenges in Advanced Packages and Boards

Reliability Challenges in Advanced Packages and Boards
by Herb Reiter on 03-02-2020 at 10:00 am

CTE Stress ANSYS SemiWiki

Today’s Market Requirements
Complex electronic devices and (sub)systems work for us in important applications, such as aircrafts, trains, trucks, passenger vehicles as well as building infrastructure, manufacturing equipment, medical systems and more. Very high reliability (the ability of a product to meet all requirements… Read More


Emerging Requirements for Electromagnetic Crosstalk Analysis

Emerging Requirements for Electromagnetic Crosstalk Analysis
by Tom Dillinger on 02-10-2020 at 10:00 am

EM coupling wire segments

This article will describe the motivations for pursuing a new flow in the SoC design methodology.  This flow involves the extraction, evaluation, and analysis of a full electromagnetic coupling model for a complex SoC and its package environment.  The results of this analysis highlight the impact of electromagnetic coupling… Read More


ANSYS, TSMC Document Thermal Reliability Guidelines

ANSYS, TSMC Document Thermal Reliability Guidelines
by Bernard Murphy on 01-01-2020 at 6:00 am

Automotive Reliability Guide min

Advanced IC technologies, 5nm and 7nm FinFET design and stacked packaging, are enabling massive levels of integration of super-fast circuits. These in turn enable much of the exciting new technology we hear so much about: mobile gaming and ultra-high definition mobile video through enhanced mobile broadband in 5G, which requires… Read More


Achieving a Predictable SignOff in 7nm

Achieving a Predictable SignOff in 7nm
by Alex Tan on 05-14-2019 at 12:00 pm

Designing with advanced-nodes FinFETs such as 7nm node involves a more complex process than prior nodes. As secondary physical effects are no longer negligible, the traditional margin-based approach applied at various design abstraction levels is considered ineffective. Coupled with the increase of device counts, failing… Read More


Webinar: Addressing Multiphysics Challenges in 7nm FinFET Designs

Webinar: Addressing Multiphysics Challenges in 7nm FinFET Designs
by Daniel Nenni on 03-12-2019 at 7:00 am

EDA is big on growth through acquisition, being acquired many times throughout my career I know this by experience. In fact, we have a wiki that tracks EDA Mergers and Acquisitions and it is the most viewed wiki on SemiWiki.com with 101,918 views thus far.

In March of 2017 ANSYS acquired CLK Design Automation which did timing variation… Read More