From Now to 2025 – Changes in Store for Hardware-Assisted Verification

From Now to 2025 – Changes in Store for Hardware-Assisted Verification
by Daniel Nenni on 01-12-2022 at 6:00 am

Jean Marie Brunet

Lauro Rizzatti recently interviewed Jean-Marie Brunet, vice president of product management and product engineering in the Scalable Verification Solution division at Siemens EDA, about why hardware-assisted verification is a must have for today’s semiconductor designs. A condensed version of their discussion is below.… Read More


AI for EDA for AI

AI for EDA for AI
by Daniel Nenni on 12-24-2021 at 6:00 am

Agnisys AI EDA AI

I’ve been noticing over the last few years that electronic design automation (EDA) vendors just love to talk about artificial intelligence (AI) and machine learning (ML), sometimes with deep learning (DL) and neural networks tossed in as well. It can get a bit confusing since these terms are used in two distinct contexts. The first… Read More


Bringing PCIe Gen 6 Devices to Market

Bringing PCIe Gen 6 Devices to Market
by Daniel Nenni on 12-20-2021 at 6:00 am

Truechip PCIe Gen 6

PCIe is a prevalent and popular interface standard that is used in just about every digital electronic system. It is used widely in SOCs and in devices that connect to them. Since it was first released in 2003, it has evolved to keep up with rapidly accelerating needs for high speed data transfers. Each version has doubled in throughput,… Read More


Is Ansys Reviving the Collaborative Business Model in EDA?

Is Ansys Reviving the Collaborative Business Model in EDA?
by Daniel Nenni on 12-16-2021 at 10:00 am

Evolution of Multiphysics Complexity

The Electronic Design Automation (EDA) industry used to be a bustling bazaar of scrappy startups, along with medium sized companies that dominated a technology space, and big main-line vendors. The annual Design Automation Conference was noisy, hectic, and sprawled over multiple large convention halls. This diversity meant… Read More


A Practical Approach to Better Thermal Analysis for Chip and Package

A Practical Approach to Better Thermal Analysis for Chip and Package
by Daniel Nenni on 12-13-2021 at 6:00 am

ANSYS Thermal Chip Model

Thermal modeling has become a hot topic for designers of today’s high-speed circuits and complex packages. This has led to the adoption of better and more sophisticated thermal modeling tools and flows as exemplified in this presentation by Micron at the IDEAS Digital Forum. The presentation is titled “Thermal Aware Memory ControllerRead More


CEO Interview: Mo Faisal of Movellus

CEO Interview: Mo Faisal of Movellus
by Daniel Nenni on 12-10-2021 at 6:00 am

Mo Faisal Movellus

Prior to founding Movellus, Dr. Faisal held positions at semiconductor companies such as Intel and PMC Sierra. Faisal received his B.S. from the University of Waterloo, and his M.S. and Ph.D. from the University of Michigan, and holds several patents. Dr. Faisal was named a “Top 20 Entrepreneur” by the University of Michigan Zell… Read More


CEO Interview: Fares Mubarak of SPARK Microsystems

CEO Interview: Fares Mubarak of SPARK Microsystems
by Daniel Nenni on 12-06-2021 at 10:00 am

Fares Mubarak profile
Fares Mubarak is a seasoned Global Executive with more than 30 years of broad management and hands-on experience spanning semiconductor design, software development, operations, sales, marketing, applications, EDA and healthcare IT.
Mubarak was VP/GM of the Semiconductor Business Unit followed by VP of Semiconductor Industry
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Live 58th Design Automation Conference Coverage!

Live 58th Design Automation Conference Coverage!
by Daniel Nenni on 12-05-2021 at 10:00 am

Dan and Shushana Friday Harbor San Juan Islands

My beautiful first mate and I will be together at DAC this year. Her first DAC was 1985 in Las Vegas and we lived happily ever after. SemiWiki bloggers Tom Dillinger and Daniel Payne will also be at DAC attending sessions and meeting with exhibiting companies to learn and blog about the latest innovations inside the semiconductor … Read More


CEO Interview: Da Chaung of Expedera

CEO Interview: Da Chaung of Expedera
by Daniel Nenni on 12-03-2021 at 6:00 am

Da Chuang CEO Expedera

Da is co-founder and CEO of Expedera. Previously, he was cofounder and COO of Memoir Systems, an optimized memory IP startup, leading to a successful acquisition by Cisco. At Cisco, he led the Datacenter Switch ASICs for Nexus 3/9K, MDS, CSPG products. Da brings more than 25 years of ASIC experience at Cisco, Nvidia, and Abrizio.… Read More


Continuous Integration of RISC-V Testbenches

Continuous Integration of RISC-V Testbenches
by Daniel Nenni on 12-02-2021 at 6:00 am

RISC V Results

In my last blog post about AMIQ EDA, I talked with CEO and co-founder Cristian Amitroaie about their support for continuous integration (CI). We discussed in some detail how their Design and Verification Tools (DVT) Eclipse Integrated Development Environment (IDE) and Verissimo SystemVerilog Linter are used in CI flows. Cristian… Read More