Dr. Il Park is the Founder and CEO of Primemas Inc. Prior to founding Primemas, he was Vice President at SK hynix where he led memory solutions, design innovation, and CAE. Prior to that he was the head of the SOC architecture development and engineering team at Samsung Electronics. Earlier in his career, Il was at IBM T.J. Watson Research… Read More
Author: Daniel Nenni
CEO Interview with Dr. Il Park of Primemas
CEO Interview with Mohit Gupta of TYLsemi
Mohit Gupta founded TYLsemi to build chiplet-based intelligent power and connectivity solutions for AI infrastructure—an area where custom silicon has long been underserved. TYLsemi exists to provide the foundational chiplet platform that enables tailored custom silicon solutions for the evolving needs of AI infrastructure.… Read More
CEO Interview with Madhulima Tewari of VerifAIX
Madhulima Tewari is the CEO and founder of VerifAIX. After two decades building EDA tools, taping out chips, and working on distributed systems, cloud infrastructure, and enterprise AI applications, she teamed up with chip design and methodology leaders and university researchers to build an agentic AI system aimed at helping… Read More
TSMC CoWoS versus Intel EMIB Semiconductor Packaging
There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:
Jeff Su: I guess very simply put, EMIB-T, in his view, is… Read More
TSMC’s Raises the Bar on CAPEX!
On the latest investor call the big story was the increase in CAPEX for 2026 and the expected CAPEX for 2027. TSMC raised the CAPEX ceiling for 2026 from US$56 billion to US$64 billion. My guess would be US$64 billion will be spent if not more. We have been discussing this in the SemiWiki Forum and my guess for the 2027 TSMC CAPEX is an incredible… Read More
Agentrys a New Paradigm for Semiconductor Engineering at 2026 DAC
Agentrys is pioneering Agentic Design Automation (ADA), a new paradigm for semiconductor engineering. Electronic Design Automation (EDA) has transformed the industry by automating engineering algorithms. Today, frontier AI can automate many engineering tasks by understanding specifications, generating RTL and … Read More
WAVE-P: Hardware Acceleration for the APV Professional Video Codec
Professional video workflows demand a difficult combination of image quality, editing responsiveness, high throughput, and manageable silicon cost. Chips&Media’s WAVE-P addresses that combination as a dedicated hardware IP core for the Advanced Professional Video, or APV, codec. Designed for professional and prosumer… Read More
DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!
Analog Bits, Inc. is an established provider of mixed-signal semiconductor IP that integrates into advanced system-on-chip (SoC) designs to enable intelligent energy and power management. Its full portfolio of IP blocks includes precision clocking macros, power and temperature sensors including LDO and regulators, programmable… Read More
Perforce Enabling Innovation Without Introducing Risk at DAC 2026
Perforce delivers a DevOps Tech Stack for teams building and running high-stakes software systems and revenue-critical applications, where failure is not an option. As a trusted partner helping organizations govern software delivery for AI, Perforce solutions enforce guardrails across code quality, infrastructure, and… Read More
Arteris at DAC 2026 Connecting Innovation for Silicon Success
The semiconductor industry has entered a new era as AI workloads, chiplets, heterogeneous computing, software-defined vehicles, and intelligent edge devices are transforming how chips are designed.
Silicon success is no longer determined by transistor counts alone, but by how efficiently data moves across increasingly… Read More
TSMC CoWoS versus Intel EMIB Semiconductor Packaging