Ceva and Actions Technology have expanded their longstanding partnership with the introduction of the ATS296X series, a new family of Bluetooth audio chips designed to bring High Data Throughput technology into commercial wireless products. Powered by the Ceva-Waves Bluetooth HDT platform, the series is positioned as one… Read More
Author: Daniel Nenni
New Audio SoCs Combine Bluetooth HDT with Dual-RF Technology
White Paper: The Semiconductor Foundation of Modern AI Data Centers
Artificial intelligence AI has become one of the most significant drivers of semiconductor innovation in history. While AI applications often receive the most attention, the underlying hardware infrastructure that enables AI consists of a highly sophisticated ecosystem of semiconductor technologies. Modern AI data centers… Read More
McClean Report June 2026: Q2 Semiconductor Market Forecast Update
The semiconductor industry is entering an extraordinary growth phase, driven primarily by artificial intelligence infrastructure and the severe supply constraints surrounding advanced logic and memory devices. According to the McClean Report’s June 2026 update, the global semiconductor market is forecast to grow 98.3%… Read More
Imec Unlocks System-Level III-V Chiplet Integration on Si-CMOS with Advanced 300mm RF Silicon Interposer Platform
As wireless communication systems evolve toward 6G, satellite connectivity, advanced radar, and high-performance sensing applications, the integration of heterogeneous semiconductor technologies has become a critical challenge. Silicon CMOS remains the dominant platform for digital processing and system control,… Read More
Shift Left with S2C Prodigy: From RTL Verification to Real-World Software Validation
For modern SoC teams, “shift left” no longer means finding a few more RTL bugs before tape-out. It means moving meaningful system validation earlier—far enough left that firmware, operating systems, drivers, applications, and external interfaces can be exercised before first silicon arrives. This change is essential as software… Read More
How SOCAMM2 Could Reshape Server Memory for AI
As artificial intelligence systems become larger and more demanding, memory is becoming one of the most important constraints in server design. Modern AI workloads do not only require powerful GPUs and accelerators; they also require enormous amounts of data to move quickly and efficiently between memory and compute engines.… Read More
Executive Interview with James Huang of AlChip
I had a chance sit down with James Huang, Director of Engineering at Alchip Technologies, to discuss the company’s recent multi-die packaging achievements and learn about Alchip’s next steps in pushing the boundaries of innovation for next generation AI ASIC.
James is acknowledged as a leading light in advanced node ASICs, based… Read More
Synopsys Demonstrates Leadership in AI-Powered Engineering at 2026 DAC Chips to Systems Conference
Purple was in fashion at the 2026 Design Automation Conference, where Synopsys reinforced its position at the forefront of AI-powered engineering. Under the conference’s “Chips to Systems” theme, the company showcased intelligent, end-to-end technologies designed to help the semiconductor industry manage unprecedented… Read More
WAVE-J: Redefining High-Performance JPEG for the 8K Era
Chips&Media WAVE-J is a high-performance JPEG codec intellectual property core designed for advanced imaging systems that require very large image support, high throughput, flexible pixel formats, and integrated pre- and post-processing. It succeeds the CODAJ12V architecture while retaining compatibility with … Read More
CEO Interview with Joseph Krause of Radical AI
Joseph F. Krause is an American materials scientist, entrepreneur, and U.S. Army National Guard veteran. He is the cofounder and CEO of Radical AI, a New York deep-tech startup founded to accelerate the discovery of advanced materials.
Before Radical AI, Krause conducted nanomaterials research at Rice University, worked on… Read More
ASML High-NA EUV is Not Ready for High-Volume Production