Mark Ren has 26 years of EDA and AI R&D experience spanning IBM Research and NVIDIA Research, driving design automation innovations that power modern chip design. He received the IBM Corporate Award for contributions to the design closure for high-performance microprocessors. At NVIDIA, he helped establish the company
Author: Daniel Nenni
CEO Interview with Mark Ren of Agentrys
TSMC A16 Backside Power at VLSI 2026
TSMC’s A16 technology, presented as Paper T1.5 at the June 2026 IEEE/JSAP VLSI Symposium, marks the company’s first angstrom-class CMOS platform combining enhanced nanosheet gate-all-around transistors with backside power delivery. The key integration feature is Super Power Rail, or SPR, which TSMC describes as a backside… Read More
SemiAnalysis EDA Market Primer – Market Dynamics, Cadence, Synopsys, Siemens, China EDA Rise
Electronic Design Automation, or EDA, is the software infrastructure that transforms a hardware specification into a manufacturable integrated circuit. At advanced process nodes, the problem is no longer simply drawing transistors or connecting gates. A modern system-on-chip contains billions of standard cells, hundreds… Read More
MooresLabAI at DAC 2026: Why the Future of Semiconductor Engineering Is Agentic, Not Just Generative
MooresLabAI at DAC 2026: Why the Future of Semiconductor Engineering Is Agentic, Not Just Generative
For decades, semiconductor innovation has been constrained not by imagination, but by engineering capacity. While transistor density has continued to advance, the process of building chips has remained fundamentally manual, fragmented across specifications, RTL, verification, debugging, coverage analysis, and signoff.… Read More
Caspia Technologies is pioneering a new, agentic chip and system security approach at DAC 2026
Caspia’s advanced tools and agents blend seamlessly with existing design flows to add expert-level security verification capabilities for all design teams. Founded in 2020 and headquartered in Gainesville, Florida, Caspia brings together expertise in chip design, fabrication, test, and verification with a deep understanding… Read More
See Autonomous Chip Design in Action with ChipAgents at DAC 2026
Making the AI wave at DAC 2026 in Long Beach
DAC comes to Long Beach for the first time in 2026, with artificial intelligence expected to be one of the central topics across the conference program and exhibition floor.
For semiconductor design and verification teams, the discussion has moved beyond whether AI can assist engineers.… Read More
Demonstrating the EasyAI ECO Suite – An AI-Powered Functional ECO Solution at DAC 2026
Easy-Logic, a leading provider of high-performance Engineering Change Order (ECO) solutions in Electronic Design Automation (EDA), will showcase its latest innovation — the EasyAI ECO Suite — at DAC in Los Angeles, July 27–29, 2026. This intelligent ECO solution integrates AI engines into the entire ECO workflow and systematically… Read More
Executive Interview with Chris Morrison, VP Product Marketing at Agile Analog
Chris Morrison is VP Product Marketing at Agile Analog, the customizable analog IP company. He has over 18 years’ experience of developing strong relationships with key partners across the semiconductor industry and delivering innovative analog, digital, power management and audio products, working for international companies… Read More
CEO Interview with Brice Cruchon, CEO of Dracula Technologies
Brice Cruchon is the Founder and CEO of Dracula Technologies, a company he established in 2011 to develop and industrialize organic photovoltaic (OPV) technologies for indoor energy harvesting. He holds a Master’s degree in Chemistry from the University of Nantes (France) and has built a career spanning chemistry, intellectual… Read More
Executive Interview with Genta Taniguchi of Kyocera
Genta Taniguchi serves as Executive Officer and Head of the Corporate Ceramic Materials Semiconductor Components Group at Kyocera Corporation. He leads initiatives in advanced ceramics and semiconductor-related technologies, supporting the company’s global business in electronic and communication components.
With… Read More
The Packaging PDK Is the Missing Layer for Co-Packaged Optics