Eric Tsai is Co-Founder and CEO of Mivium, Inc., a US-based materials technology company in Fremont, California developing submicron gallium nitride powder and related wide bandgap materials. He co-founded Mivium in 2022 after a career building and scaling consumer businesses, most recently as Vice President of Marketing… Read More
Author: Daniel Nenni
CEO Interview with Eric Tsai of Mivium
CEO Interview with Dr. Gleb Tsipursky of Disaster Avoidance Experts
Gleb Tsipursky, PhD, is the CEO and co-founder of Disaster Avoidance Experts, a consulting and training firm focused on helping organizations adopt AI through employee engagement and practical workflow redesign. He is a behavioral scientist and the author of The Psychology of AI Adoption at Work: From Resistance to Results… Read More
AJ Cooper is the Co-Founder and CEO of Itera
AJ Cooper is the Co-Founder and CEO of Itera, which developed the first-of-its-kind ‘fluid’ circuit board to make electronics physically programmable. Chips and software have been programmable for decades, but the interconnect between them has stayed fixed. By rewiring itself in real time, Itera’s board challenges
Executive Interview with Victor Lopez of RaiderChip
Victor Lopez is Co-Founder and CTO at RaiderChip, with over 20 years of experience in FPGA and ASIC design. Throughout his career, he has led the development of semiconductor IP and custom hardware solutions licensed by international companies in sectors such as defense, aerospace, automotive and professional video, specializing… Read More
CEO Interview with Vincent Cobée of ITEN
Vincent Cobée is a global industrial executive with more than 30 years of leadership experience, most of it spent in the highly demanding automotive industry, where he built a successful track record leading large-scale international organizations, driving business transformation, and bringing innovative technologies… Read More
CEO Interview with Lisa Spelman of Cornelis
Lisa Spelman is CEO of Cornelis, where she leads the company’s efforts to advance high-performance networking for AI and HPC infrastructure. She brings more than 20 years of experience across AI, cloud, enterprise infrastructure, data center operations, product strategy, and go-to-market leadership.
Before joining Cornelis,… Read More
Inside the Silicon: Analog Bits N2P2 Test Chip
The future of intelligent computing depends on silicon that delivers more performance within tighter power and thermal limits. Combining TSMC’s advanced process technology with Analog Bits’ analog and mixed-signal expertise, we help designers address those demands through local power regulation, supply monitoring, precision… Read More
WEBINAR: Cut down EDA License cost by 25% with Stratos AI Nitro
Expensive EDA licenses should keep chip design moving. Yet when license activity and job queues live in separate systems, teams can struggle to understand why work is waiting, which tools are underused, and whether additional spending will solve the problem. Idle seats, checkout failures, and stalled jobs can consume budgets… Read More
Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series
Teradyne has introduced the UltraFLEXplus S series, extending its semiconductor test platform to address the manufacturing economics of edge artificial intelligence. Announced on October 12, 2026, the series begins with the UltraFLEXplus S24, a 24-slot system intended for engineering and production testing. Its target… Read More
Why America’s Semiconductor Manufacturing Capacity Matters
America’s semiconductor future will be shaped by its ability to turn scientific discoveries into chips manufactured at scale. That is why the investments outlined in Intel Foundry’s recent editorial matter beyond the company’s own business. They address a fundamental question: whether the United States can sustain the research,… Read More
ChipAgent Raises $134Million and Why it Matters