As semiconductor manufacturing becomes increasingly knowledge-intensive, protecting intellectual property and trade secrets has emerged as a strategic imperative. The world’s leading foundry, TSMC is advancing beyond conventional information security practices by integrating artificial intelligence into… Read More
Author: Daniel Nenni
TSMC Pioneers a New Era in AI-Powered Trade Secret Management, Achieving Intelligent Innovation
Breaking the Clock Lane Barrier: MIPI C-PHY/D-PHY Combo IP on TSMC N2P
The transition to advanced process nodes is reshaping high-speed interface IP requirements for mobile, automotive, AR/VR, and AI edge devices. As SoC designers migrate to cutting-edge foundry technologies, the demand for highly optimized MIPI PHY solutions continues to grow. A key development in this space is the availability… Read More
CEO Interview with Vivek Vishwakarma of ThirdAI Automation
Vivek Vishwakarma is an entrepreneur, investor, and technologist leading ThirdAI Automation, an industrial AI company that accelerates troubleshooting and reporting through automated root-cause analysis. A former technologist at Intel with 10+ patents and 300+ research citations, he speaks on the intersection of advanced… Read More
Re-Spins Get You Fired, Says Intel CEO Lip-Bu Tan
Intel CEO Lip-Bu Tan’s statement that “re-spins get you fired” reflects the enormous pressure facing semiconductor companies as chip complexity, manufacturing costs, and competitive demands continue to rise. In the semiconductor industry, a “re-spin” occurs when a chip design must be revised and manufactured again because… Read More
CFrame60: Rewriting the Rules of Frame Compression
Chips&Media CFrame60 is a next-generation frame compression hardware IP designed to address the growing bandwidth and memory challenges in modern SoCs targeting imaging, video, AI, and display applications. Unlike conventional compression architectures that prioritize either bandwidth reduction or image quality,… Read More
CEVA Accelerates Wireless Edge Innovation with Bluetooth HDT and Integrated RF Design Win
CEVA, the leading licensor of wireless connectivity and smart sensing technologies, is advancing its full-stack wireless strategy with the introduction of next-generation Bluetooth High Data Throughput (HDT) capabilities and a major integrated RF subsystem design win. The announcement underscores CEVA’s growing role… Read More
TSMC Powers Up: 408,000 Batteries Get a Safety Intelligence Upgrade
As semiconductor manufacturing becomes increasingly dependent on uninterrupted power and energy efficiency, battery reliability has emerged as a critical operational issue for advanced fabs. Taiwan Semiconductor Manufacturing Company, better known as TSMC, is addressing this challenge through an ambitious global initiative… Read More
Power-SOI: The Reliability Engine Behind Functional Safety ICs
Power-SOI technology is rapidly emerging as a foundational platform for next-generation functional safety integrated circuits used in autonomous vehicles, industrial automation, humanoid robotics, and other mission-critical systems. The growing convergence of high-voltage power management and low-voltage digital… Read More
CEO Interview with Vivek Raghunathan of Xscape Photonics
Vivek Raghunathan has over 18 years of experience in silicon photonics. He was a Sr. Principal Engineer, Product Architect and Program Leader for Integrated Silicon Photonics at Broadcom driving key core technology development required to co-package optics with switches and demonstrated industry’s first 25.6T Ethernet … Read More
CEO Interview with Baratunde Cola of Carbice
Baratunde Cola is the CEO and founder of Carbice, an Atlanta, Georgia-based company that develops scalable interface solutions to protect semiconductors and electrical components from overheating in any physical environment. He received his bachelor’s and master’s degrees from Vanderbilt University and … Read More
ASML High-NA EUV is Not Ready for High-Volume Production