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IC to Systems Era

IC to Systems Era
by Daniel Nenni on 05-16-2019 at 12:00 pm

One of my favorite EDA disruptions is the Siemens acquisition of Mentor, pure genius. Joe Sawicki now runs the Mentor IC EDA business for Siemens so we will be seeing him at more conferences and events than ever before. Joe did a very nice keynote at the recent U2U conference that I would like to talk about before we head to the 56thDAC… Read More


TSMC OIP: Soft Error Rate Analysis

TSMC OIP: Soft Error Rate Analysis
by Paul McLellan on 09-09-2013 at 1:34 pm

Increasingly, end users in some markets are requiring soft error rate (SER) data. This is a measure of how resistant the design (library, chip, system) is to single event effects (SEE). These manifest themselves as SEU (upset), SET (transient), SEL (latch-up), SEFI (functional interrupt).

There are two main sources that cause… Read More


How Resistant to Neutrons Are Your Storage Elements?

How Resistant to Neutrons Are Your Storage Elements?
by Paul McLellan on 08-13-2013 at 1:01 pm

There are two ways to see how resistant your designs are to single-event errors (SEE). One is to take the chip or even the entire system and put it in a neutron beam and measure how many problems occur in this extreme environment. While that may be a necessary part of qualification in some very high reliability situations, it is also … Read More


System Reliability Audits

System Reliability Audits
by Paul McLellan on 07-25-2013 at 12:09 pm

How reliable is your cell-phone? Actually, you don’t really care. It will crash from time to time due to software bugs and you’ll throw it away after two or three years. If a few phones also crash due to stray neutrons from outer space or stray alpha particles from the solder balls used in the flip-chip bonding then nobody… Read More


Increase Your Chip Reliability with iROC Tech

Increase Your Chip Reliability with iROC Tech
by Pawan Fangaria on 06-12-2013 at 9:00 pm

As we have moved towards extremely low process nodes with very high chip density, the cost of mask preparation also has become exorbitantly high. It has become essential to know about the failure rates and mitigate the same at the design time before chip fabrication, and also to make sure about chip reliability over time as it is constantly… Read More


IROC Technologies CEO on Semiconductor Reliability

IROC Technologies CEO on Semiconductor Reliability
by Daniel Nenni on 05-26-2013 at 8:10 pm

One of the best things about being part of SemiWiki is the exposure to new technologies and the people behind them. SemiWiki now works with more than 35 companies and I get to spend time with each and every one of them. Much like I do, IROC Technologies works closely with the foundries and the top semiconductor companies so it was a pleasure… Read More


Do You Need to Worry About Soft Errors?

Do You Need to Worry About Soft Errors?
by Paul McLellan on 05-22-2013 at 6:51 pm

As we get down to smaller and smaller process nodes, the problem of soft errors becomes increasingly important. These soft errors are caused by neutrons from cosmic rays, alpha particles from materials used in manufacture and other sources. For chips that go into systems with high reliability this is not something that can be ignored.… Read More


SOCFIT, Circuit Level Soft Error Analysis

SOCFIT, Circuit Level Soft Error Analysis
by Paul McLellan on 05-13-2013 at 2:50 pm

I blogged recently about reliability testing with high energy neutron beams. This is good for getting basic reliability data but it is not really a useful tool for worrying about reliability while the chip is still being designed and something can be done about it.

That is where IROC Technologies SOCFIT tool comes in. It takes all… Read More


How to Blast Your Chip with High Energy Neutron Beams

How to Blast Your Chip with High Energy Neutron Beams
by Paul McLellan on 05-06-2013 at 3:49 pm

So you want to know how reliable your chips are and how susceptible they are to single event effects (SEEs) where a neutron or an alpha particle causes a storage element (flop or memory cell) to flip in a way that alters the behavior of the device. There are two ways a particle hitting a device might not cause a problem. Firstly, the particle… Read More


Cell Level Reliability

Cell Level Reliability
by Paul McLellan on 04-03-2013 at 6:06 pm

I blogged last month about single event effects (SEE) where a semiconductor chip behaves incorrectly due to being hit by an ion or a neutron. Since we live on a radioactive planet and are bombarded by cosmic rays from space, this is a real problem, and it is getting worse at each process node. But just how big of a problem is it?


TFIT is … Read More