CEO Interview with Dr. Hardik Kabaria of Vinci

CEO Interview with Dr. Hardik Kabaria of Vinci
by Daniel Nenni on 04-12-2026 at 12:00 pm

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Hardik Kabaria is the founder and CEO of Vinci, a frontier lab building systems that make physical reality continuously computable.

While software has become programmable, physics has remained episodic—accessed through discrete simulations and approximations. Vinci is changing that. Under Kabaria’s leadership, the company

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CEO Interview with Steve Kim of Chips&Media

CEO Interview with Steve Kim of Chips&Media
by Daniel Nenni on 04-10-2026 at 6:00 am

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I’m Steve Kim, the CEO of Chips&Media. I’ve been immersed in the multimedia imaging industry for approximately two decades. Prior to joining Chips&Media, I spent over five years working within handset manufacturing companies. Following more than ten years here at Chips&Media in roles spanning Marketing, Sales,… Read More


NXP Expands Arteris NoC Deployment to Scale Edge AI Architectures

NXP Expands Arteris NoC Deployment to Scale Edge AI Architectures
by Daniel Nenni on 04-09-2026 at 8:00 am

NXP announcement v4b 021026 FINAL

As edge AI systems become more centralized and compute-dense, on-chip data movement is increasingly the architectural bottleneck. NXP’s expanded deployment of Arteris network-on-chip (NoC) and cache-coherent interconnect IP highlights a broader industry trend: interconnect architecture is now a first-order design … Read More


Architecting Intelligence: The Rise of RISC-V CPUs in Agentic AI Infrastructure

Architecting Intelligence: The Rise of RISC-V CPUs in Agentic AI Infrastructure
by Daniel Nenni on 04-09-2026 at 6:00 am

The rise of RISC V CPUs SiFive

SiFive’s newly announced $400 million Series G financing represents a significant technical inflection point for high-performance RISC-V CPU development targeted at agentic AI data center workloads. The funding, which values the company at $3.65 billion, is specifically intended to accelerate next-generation CPU IP, … Read More


From SoC to System-in-Package: Transforming Automotive Compute with Multi-Die Integration

From SoC to System-in-Package: Transforming Automotive Compute with Multi-Die Integration
by Daniel Nenni on 04-08-2026 at 10:00 am

Types of Mutli Deisgn Packaging Synsopsys

Modern automotive electronics are undergoing a rapid transformation driven by increasing compute demands, functional safety requirements, and the shift toward scalable semiconductor architectures. One of the most significant technological developments enabling this transformation is the adoption of multi-die system… Read More


Agentic AI Demands More Than GPUs

Agentic AI Demands More Than GPUs
by Daniel Nenni on 04-08-2026 at 8:00 am

Agentic AI Requires More CPUs

Agentic AI workloads are reshaping the compute requirements of modern data center infrastructure by shifting performance bottlenecks from GPU-centric inference to CPU-heavy orchestration and workflow management. Traditional AI inference pipelines relied primarily on GPUs performing a single forward pass, where input… Read More


CEO Interview with Jussi-Pekka Penttinen of Vexlum

CEO Interview with Jussi-Pekka Penttinen of Vexlum
by Daniel Nenni on 04-05-2026 at 2:00 pm

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Jussi-Pekka Penttinen is the chief executive officer, chief technical officer, and cofounder of Vexlum Ltd, an advanced laser technology company. With more than 15 years of experience, he is a leading researcher in the field of Vertical External Cavity Surface Emitting Laser (VECSEL) and successfully commercialized the technology.… Read More


CEO Interview with Dr. Tony Atti of Phononic

CEO Interview with Dr. Tony Atti of Phononic
by Daniel Nenni on 04-05-2026 at 12:00 pm

Tony Atti Headshot


Tony Atti, Ph.D. is Phononic’s CEO. Tony is an experienced technology entrepreneur and executive, who is passionate about disruptive technology solutions that change our lives. As CEO and Co-Founder of Phononic, Dr. Atti has led the company’s mission to sustainably transform global cooling and heating through semiconductor… Read More


Silicon Catalyst and Microelectronics US 2026

Silicon Catalyst and Microelectronics US 2026
by Daniel Nenni on 04-02-2026 at 10:00 am

Silicon Catalyst Microelectronics US 2026 Conference

The designation of Silicon Catalyst as the exclusive strategic partner for Microelectronics US 2026 represents a significant alignment between a leading semiconductor startup ecosystem and a rapidly growing U.S. microelectronics industry event. This partnership reflects broader trends in semiconductor innovation, … Read More


Alchip’s Leadership in ASIC Innovation: Advancing Toward 2nm Semiconductor Technology

Alchip’s Leadership in ASIC Innovation: Advancing Toward 2nm Semiconductor Technology
by Daniel Nenni on 04-01-2026 at 10:00 am

Alchip’s Leadership in ASIC Innovation

Alchip Technologies has recently reported significant progress in the development of advanced 2nm  ASICs, positioning itself as a leader in next-generation semiconductor design for AI and HPC. The announcement highlights Alchip’s efforts to commercialize cutting-edge chip technologies and deliver highly customized … Read More