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L.C. leads efforts in design enablement, ensuring that the company can meet the diverse and evolving requirements of its global customer base. Prior to this, he headed the Design and Technology Platform organization starting in 2018.
Since joining TSMC in 2000, Dr. Lu has held multiple leadership positions in design services.… Read More
Dr. Y.J. Mii joined TSMC in 1994 as a manager at Fab 3 before moving into the company’s research and development organization in 2001. He was appointed Vice President of R&D in 2011 and later advanced to Senior Vice President in November 2016.
Over more than 20 years at TSMC, Dr. Mii has played a central role in advancing and manufacturing… Read More
The world stands at the threshold of a new era in wireless communication as research communities, standards bodies, and technology companies begin shaping what will become sixth generation mobile networks. While fifth generation systems are still expanding across global markets, attention has already shifted toward defining… Read More
The rapid growth of AI applications in edge devices has created a strong demand for specialized hardware capable of performing high-performance neural network inference under strict power and latency constraints. Traditional CPUs and GPUs often struggle to meet the efficiency requirements of embedded and mobile systems.… Read More
Before assuming his current position, Dr. Hou held several key leadership roles. He served as Vice President of Design and Technology Platform from 2011 to 2018, and later as Vice President of Technology Development starting in August 2018. Earlier in his career, from 1997 to 2007, he established TSMC’s technology design kit
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The semiconductor industry is undergoing a profound transformation as system complexity, performance expectations, and time-to-market pressures continue to rise. Traditional monolithic system-on-chip (SoC) designs are increasingly giving way to modular, chiplet-based architectures that enable flexibility, scalability,… Read More
The rapid evolution of wireless audio has placed unprecedented demands on system integration, power efficiency, and performance. Against this backdrop, the webinar “All-in-One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die” offers a timely and technically rich exploration of how modern semiconductor design… Read More
The Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, an international association of companies providing goods and services throughout the semiconductor design ecosystem, is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. It acts … Read More
Xianxin is the CEO and Co-Founder of Lumai, an Oxford University spin-out pioneering disruptive optical computing technologies for Al and data center acceleration. He brings over 15 years of experience in physics and engineering, and was previously an RCE 1851 Research Fellow, a prestigious fellowship whose past awardees … Read More
After more than 15 years of collaboration with Dr. Eric Esteve and IPnest, SemiWiki has acquired the famed IP reports with Eric Esteve staying on through 2026 to ease the transition. Not only will SemiWiki provide the industry standard Interface IP and Design IP reports, SemiWiki will be expanding the depth and breadth of the coverage.… Read More
Siemens U2U 3D IC Design and Verification Panel