The headline is: Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers. The acquisition complements Ansys’ existing signoff solutions and enables integrated circuit (IC) designers to detect problems earlier in the design flow.
Which is certainly true but let me tell you what Diakopto really is, they are a diamond in the rough. A very large diamond. This is definitely one of those 1+1=3 types of situations, absolutely. Congratulations to John Lee and his Ansys M&A team on another amazing acquisition.
We have been working with Diakopto for less than a year but we have learned a lot about them. Starting with the CEO interview (Dr. Maxim Ershov) followed by a series of articles written by Maxim directly that earned an amazing amount of traffic.
Even though Diakopto was relatively young the customer list is most impressive with more than 30 companies using the tool. The only thing holding Diakopto back, in my opinion, was the sales and support channel which is no longer an issue with Ansys. Ansys has one of the strongest channels in EDA which is one reason why I enjoy working closely with them. Ansys and Diakopto also have very strong product synergy, which is highlighted below, thus the 1+1=3 reference.
- The addition of Diakopto’s solutions to Ansys’ portfolio will deliver a competitive edge to engineers using Ansys to create high-performance integrated circuits
- Diakopto’s unique and market-leading products complement Ansys’ existing solutions – the combination will empower our customers to deliver optimal designs and accelerate time to market
- The transaction is subject to the satisfaction of customary closing conditions and is expected to close in the second quarter of 2023
PITTSBURGH, May 16, 2023 /PRNewswire/ — Ansys, (NASDAQ: ANSS) the global leader and innovator of engineering simulation software, announced today that it has entered into a definitive agreement to acquire Diakopto. A provider of differentiated EDA solutions to accelerate integrated circuit (IC) development, Diakopto focuses on helping resolve critical issues caused by layout parasitics. The transaction is subject to the satisfaction of customary closing conditions and is expected to close in the second quarter of 2023. It is not expected to have a material impact on Ansys’ consolidated financial statements in 2023.
Ansys has entered into a definitive agreement to acquire Diakopto
Diakopto develops products that address the growing complexities and unintended effects of designing ICs in the modern era. Semiconductor designs increasingly employ advanced process node technologies, where interconnect parasitic effects limit the performance, reliability, and functionality of designs. Diakopto’s market-leading products have been adopted by dozens of customers, including tier-one semiconductor companies, for a broad range of applications.
With the acquisition, Ansys will better enable design engineers to “shift left,” and to detect interconnect parasitic problems early in the design cycle. Diakopto’s products provide actionable analytics to guide designers to fix these problems – a capability that has not existed before. Through early identification and what-if analysis of parasitic problems, engineers can minimize costly iterations late in the design cycle – furthering cost and time savings.
“Diakopto’s culture of strong engineering excellence and its innovative and highly differentiated products create a natural alignment with our organization. We are eager to welcome their team to the Ansys family,” said Shane Emswiler, senior vice president of products at Ansys. “Incorporating Diakopto’s unique methodology will support designers using Ansys to quickly and easily pinpoint the few elements, out of billions, causing bottlenecks. Designers can then optimize and debug designs more efficiently for enhanced IC performance and reliability, and accelerate time to market. The acquisition will complement Ansys’ existing offerings for engineers at every level as Diakopto’s intuitive and out-of-the-box experience doesn’t require extensive training or complicated setups or configurations.”
“Today’s announcement brings together two like-minded companies on the forefront of innovation, and we are excited about becoming part of the Ansys family,” said Maxim Ershov, CEO and CTO at Diakopto. “By joining forces with Ansys, we’re confident that we can solve a broader set of problems in the chip design workflow together, strengthening offerings for our customers and driving more innovations in high-tech designs for data center, 5G, automotive, and mobile applications.”
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Mary Kate Joyce