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Regarding new foundry customers:
Timothy Arcuri: Thanks a lot. Lip Bu, I wanted to ask about the evolution of your foundry model. You are of course pursuing typical foundry customers, but it seems like TeraFab is a little bit of a different deal and maybe even like a process licensing...
During the call, DZ said,
"Intel Foundry operating loss in Q1 was $2.4 billion, improved $72 million quarter-over-quarter as better yields across Intel 4, Intel 3, and 18A drove higher gross margins. This was mostly offset by increased operating expenses associated with an intentional step-up...
This article was written shortly before Intel's Q1 Earnings Call, but it still gives helpful perspectives on what Intel's future holds. Here are some excerpts:
On April 8th, SemiAnalysis' chief analyst pointed out that CPUs are facing a very severe production shortage. Currently, the ratio of...
Yes, I agree, I probably saw the same figures. So I think this paper is not about Z-Angle Memory. HB3DM is just something else they are trying. ZAM might still be under development. It is not mentioned in the abstract at all. TechPowerUp jumped the conclusion.
This is from the VLSI Technology 2026 symposium highlights recently released: https://www.vlsisymposium.org/wp-content/uploads/2026/04/2026-VLSI-Technical-Tipsheet-REVISED-FINAL-4.25.26-1-1.pdf
PSMC is a DRAM foundry: https://www.powerchip.com/en-global/services/foundry-services
I think Intel is just responsible for the stacking part. The DRAM is from PSMC apparently. The logic base die, if it had been made on Intel 18A or Intel 3, I'm sure that would have been called out.
ASML knows it does not have much leverage with High-NA. They said so ("not prime time for High NA today") in their last quarterly earnings call.
Along with Lam Research, they presented stochastic defectivity data with the latest, greatest dry resist this year, and it's still a big deal...
Published: April 22, 2026 | Source: Digitimes | Author: Mark Campbell
Industry hopes that Intel 18A can alleviate CPU shortages
The world isn’t just facing a memory shortage; it’s also facing a CPU shortage. Intel is currently capacity-limited, meaning it cannot make enough CPUs to meet demand...
Servers using NVIDIA's Vera Rubin CPU use LPPDR5X DRAM, and Nanya Technology has been reported to have become a supplier. Yet its technology stage is 2nd-generation 10nm-class, same level as CXMT's G3 process already available in 2024.
It is also hinted that TSMC assisted with the stacking...
These days, a new DRAM technology like IGZO, they often test to 1e11-1e12 cycles. Really we expect should go to 1e15 cycles, but that's 3 years of 100 ns cycles.
From: https://www.thelec.net/news/articleView.html?idxno=6808
"The 10a node represents the first generation below 10 nanometers, with actual line widths estimated at around 9.5 to 9.7 nanometers."
"The company plans to use the 4F² and VCT structures across three generations — 10a, 10b and 10c...
By Etiido Uko published 17 hours ago
Next-gen memory designed as a lower-cost, lower-power HBM alternative for AI workloads
NEO Semiconductor 3D X-DRAM (Image credit: NEO Semiconductor)
NEO Semiconductor announced on April 23rd that its 3D X-DRAM technology has successfully passed...
By Dylan Martin
April 14, 2026, 5:30 PM EDT
‘[Elon Musk’s] expansive vision across AI, transportation, communications, robotics and space travel relies heavily on an ample and uninterrupted supply of silicon chips. Intel is thus a natural partner to help him realize his vision,’ Intel CEO...
Going by this latest reference: https://www.semi.org/sites/semi.org/files/2023-11/07%20Carlo%20Luijten%20NNNN.pdf
The throughput is reduced 27.5% by going from 30 to 60 mJ/cm2, so from 220 WPH to 160 WPH, for example.
