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  1. F

    Microsoft-backed startup Lace raises $40m series A

    So if it assumed that the kinetic energy of the atom is much less than the 20 eV excited state, then when it hits the resist, it will pretty much bounce off, and all the energy will be deposited at the surface. So the energy has to diffuse downward to the rest of the resist, probably via the...
  2. F

    Cu-Cu hybrid bonding, BESI or a Korean company?

    There have been reports, maybe rumors, that ASML would be entering this space as well?
  3. F

    Microsoft-backed startup Lace raises $40m series A

    20 eV internal energy could ionize, but the number of electrons wouldn't be as many as EUV. I wonder if this reduces the sensitivity significantly?
  4. F

    Norway’s Lace Lithography lands €34.5 million to extend Moore’s Law by replacing light with atoms

    Thanks for this info. Excited atomic state decay, that's interesting! I have to wonder the pathways (radiative, ionizing, etc.).
  5. F

    Norway’s Lace Lithography lands €34.5 million to extend Moore’s Law by replacing light with atoms

    Ok, so they indeed use a mask. Then that mask could presumably get sputtered. And for that matter, so could the resist.
  6. F

    Microsoft-backed start-up raises $40 million for helium atom beam lithography that could print chips at atomic resolution — 0.1nm beam is 135 times na

    Possibly appropriating the term "BEUV" is a mistake, since the EUV community first used that to mean a wavelength around half the current EUV wavelength, as a target next-generation wavelength. As I mentioned in my earlier comments here, the details of what they do are still not available...
  7. F

    Microsoft-backed startup Lace raises $40m series A

    I read about this in the last couple of days. Some key details are missing. First, how are these atoms produced? Plasma or ion beam? Second, how are they guided to the wafer? Direct-beam or through a mask? A focused beam will be low throughput. Can they have multiple beams which can be...
  8. F

    SK Hynix to buy $8 billion in ASML chipmaking tools in largest disclosed order

    The source of this report is this filing: There are a number of things that make it look not legit. It's a lot of money, 10% of assets and almost a quarter of 2025 profit. A lot of money to drop all at once, and we haven't included non-EUV orders (if any), which would expand the spending...
  9. F

    ISSCC 2026 Samsung Electronics demonstrated a 16Gb DRAM

    The cell-over-periphery bonding benefit can apply to conventional planar ("6F^2")DRAM cells.
  10. F

    Terafab 21 March 2026

    The key understatement from that article: "Terafab will probably not succeed on exactly the schedule first announced."
  11. F

    TSMC Chairman C.C. Wei Awarded Honorary Doctorate by Asia University Taiwan

    Aging populations everywhere drive a big market for caregiver robots.
  12. F

    Samsung Electronics plans over $73 billion investment to lead in AI chip sector

    They are not very clear that it's a fab expansion. Samsung Electronics plans to spend at least 110 trillion won ($73.3 billion) on facilities and research and development (R&D) this year, positioning itself to meet robust growth in chip demand while leaving room for sizable merger and...
  13. F

    Samsung Electronics plans over $73 billion investment to lead in AI chip sector

    Always more DUV than EUV.
  14. F

    Is It Really Impossible To Cool A Datacenter In Space?

    Yeah, cooling being radiation-limited, and also heating from the Sun, Earth, and elsewhere. At the end, he acknowledges we haven't even talked about the power supply in space.
  15. F

    Samsung and AMD Expand Strategic Collaboration on Next-Generation AI Memory Solutions

    Is there an implied exclusivity? The use of the term "primary" begs the question of when they would go the secondary or further.
  16. F

    Samsung and SK hynix are scaling back their DRAM expansion plans: Is there concern about potential overcapacity?

    Samsung is also considering HBM "relief" like Groq and HBF.
  17. F

    Inside NVIDIA Groq 3 LPX: The Low-Latency Inference Accelerator for the NVIDIA Vera Rubin Platform

    784 billion transistors over 8 chips makes more sense.
  18. F

    Inside NVIDIA Groq 3 LPX: The Low-Latency Inference Accelerator for the NVIDIA Vera Rubin Platform

    4GB is a lot of SRAM (is it supposed to be 4 Gb)? From: https://www.cna.com.tw/news/ait/202603170011.aspx
  19. F

    Samsung and SK hynix are scaling back their DRAM expansion plans: Is there concern about potential overcapacity?

    16. March 2026 06:01 Samir Bashir The memory industry is currently raking in huge profits thanks to the AI boom, but behind the scenes, nervousness is growing. While Samsung and SK hynix are benefiting massively from the current demand for DRAM and HBM, that is precisely the problem: anyone who...
  20. F

    Samsung Foundry nabs Nvidia

    Groq already lost confidence in themselves last year: https://www.investing.com/news/company-news/groq-slashes-2025-revenue-projections-to-500-million--the-information-93CH-4158309 Investing.com -- AI chipmaker Groq has significantly reduced its 2025 revenue projections from more than $2...
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