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I refer to this paper https://www.spiedigitallibrary.org/conference-proceedings-of-spie/12750/127500N/EUV-pellicle-technology-for-high-volume-wafer-production/10.1117/12.2688127.short where TSMC reported changing EUV pellicle materials 3 times in 2020-2023. But at 400W, the 2023 material was...
Besides being expensive on their own, EUV pellicles limited throughput due to transmission as well as rupturing or destabilizing faster at higher power. So pellicle-less procedures have been developed. DUV pellicles are much cheaper and do not limit throughput this way but still need to deal...
Apparently Comet Lake and some other processors were discontinued as of July 1st this year, so they're just renaming a discontinued product as a bookkeeping formality?
By Zhiye Liu published 2 days ago
So, should we call this 10th Gen or Core Series 1?
It appears that Intel is experiencing a sense of nostalgia, as the chipmaker (via momomo_us) has introduced the Core i5-110 processor, based on Comet Lake. Comet Lake is a stroll down memory lane for many of...
This didn't age well: https://investor.synopsys.com/news/news-details/2025/Synopsys-and-Intel-Foundry-Propel-Angstrom-Scale-Chip-Designs-on-Intel-18A-and-Intel-18A-P-Technologies/default.aspx
Mitsui Chemicals licensed technology from ASML and IMEC to produce EUV pellicles which they sell. Samsung and TSMC have published their ongoing evaluation efforts. TSMC has gone so far to set up its own EUV pellicle infrastructure in preparation for producing its own pellicles for its own use...
Very unclear article source: https://www.etnews.com/20250910000245
However, it remains unclear whether Intel will procure glass substrates in-house or through external collaboration. Mass production requires significant investment, and multiple manufacturers are needed to ensure a stable...
I found an interesting excerpt from here: https://globaltechresearch.substack.com/p/carbon-nanotube-cnt-the-next-big
Not only do memory manufacturers not use EUV pellicles, but even TSMC tries not to use EUV pellicles too much in their advanced node process, due to their high cost (over $10,000...
Since there will be many layers (like in 3D NAND), the capacitors can be spaced further apart, not requiring the highest resolution anymore.
The issue with 4-6 F^2 is that distances between different features that can couple capacitively are getting too close.
For 4F^2, there is the additional...
Without pellicles, periodic inspections are needed to infer particles on the mask before too many dies are lost. The inspection cost could force some yield risk to be accepted. https://www.researchgate.net/publication/331763063_Advanced_particle_contamination_control_in_EUV_scanners
