Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/search/334013/?c[users]=Fred+Chen&o=date
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2030871
            [XFI] => 1060170
        )

    [wordpress] => /var/www/html
)

Search results

  1. F

    Softbank Corp, Intel announce memory chips collaboration

    Intel did not release any schematics, and there are plenty of AI-generated pictures around :ROFLMAO: But from this graphic, it looks like combining vertically stacked DRAM dies and EMIB.
  2. F

    Changxin Storage's low-price sell-off of DDR4 reported incorrectly

    Perhaps the best argument is, could CXMT already have enough DRAM supply, even with expected low yield, to disrupt the market as claimed?
  3. F

    Changxin Storage's low-price sell-off of DDR4 reported incorrectly

    2026/02/04 13:11:08 Economic Daily reporter Cui Xinfang/instant report In response to recent media reports pointing out that Changxin Storage (CXMT) sells DDR4 at a much lower price than the market price, raising market doubts about the price trend of the old generation memory, and the market...
  4. F

    Bottlenecks in DRAM and HBM: Tailwind for China's Memory Industry

    Almost certainly, all of it is going to domestic customers, and it's likely not enough to go around even there. But in the outside chance it does go to US, we'll have to see what mood Trump is in.
  5. F

    Bottlenecks in DRAM and HBM: Tailwind for China's Memory Industry

    2026-01-21 Henrik Bork For the construction of AI data centers, so many DRAM memory chips are needed worldwide that there are no longer enough left for manufacturers of smartphones and computers. The current situation gives Chinese manufacturers like CXMT a boost. The demand for memory chips...
  6. F

    Micron’s memory map: why Taiwan, Singapore, and the U.S. each matter differently

    The Tongluo fab is not DRAM: https://evertiq.com/news/55663 PSMC started construction of the USD 9.72 billion fab in 2021 in order to ramp up its output of mature chips with 28-nanometer, 45-nanometer and 50-nanometer technologies. The fab capacity is scheduled at 50,000 12-inch wafers per...
  7. F

    ASML Statement on Strengthening Focus on Engineering and Innovation

    This statement is telling: "The feedback from our colleagues, our suppliers and our customers shows that our ways of working have, in some cases, become less agile. Engineers in particular have expressed their desire to focus their time on engineering, without being hampered by slow process...
  8. F

    Intel says it has two prospective customers for 14A — expects to hear about commitments in second half of 2026

    A Photomask Japan 2025 paper by Intel's Mask group pointed out that High-NA would bring more sensitivity to smaller defects, creating new challenges for detection and repair. In particular, "High-NA EUV reticle repair has been challenging due to more precise edge control requirements...
  9. F

    Intel says it has two prospective customers for 14A — expects to hear about commitments in second half of 2026

    By Anton Shilov published January 23, 2026 Intel still has zero committed external customers for 14A. Two potential customers are currently exploring test chips made on Intel's 14A fabrication process, Intel disclosed as part of its earnings call this week. The company said that there will be...
  10. F

    Scott Bessent: The single biggest threat to the world economy is that 97% of advanced chips are made in Taiwan

    The temptation has been there for very long. As Lai Ching-Te said, "Once Taiwan is annexed, China will gain greater strength to compete with the United States on the international stage, undermining the rules-based international order."...
  11. F

    TSMC's Patent Layout and Earnings Call Alignment

    Judy Lin 林昭儀 Jan 27, 2026 Executive Summary: The “System-Level Foundry” Shift Understanding TSMC’s current Intellectual Property (IP) layout is critical because it reveals a fundamental transformation: TSMC is no longer just shrinking transistors; it is architecting an integrated AI...
  12. F

    Samsung will first introduce EUV pellicle to US Taylor fab

    Yes, pellicles have been taken for granted with DUV (<$1000). The one in the article is >$40,000. "The economics around pellicles have encouraged divergent approaches. DUV pellicles are relatively inexpensive, at about $720, which has enabled their widespread use in earlier nodes. However, EUV...
  13. F

    Samsung will first introduce EUV pellicle to US Taylor fab

    TSMC is actually making its own, rather than relying on Mitsui: https://semiwiki.com/forum/threads/tsmc-repurposing-old-fabs-to-bring-euv-pellicle-production-in-house.23593/
  14. F

    Samsung will first introduce EUV pellicle to US Taylor fab

    Strange that it's only being deployed at Taylor, not in South Korea.
  15. F

    Samsung will first introduce EUV pellicle to US Taylor fab

    Date : 2026-01-22 10:04 Samsung Electronics will introduce the 'extreme ultraviolet (EUV) pellicle', a key component that will increase the productivity of advanced semiconductor processes, for the first time at the Taylor fab being built in the United States. Until now, it was unclear whether...
  16. F

    KeyBanc's TSMC/Intel/Samsung yield benchmark (1/13/2026)

    LBT: We are now shipping our first products built on Intel 18A – the most advanced semiconductor process developed and manufactured on U.S. soil. As stated earlier, yields continue to improve steadily as we work to ramp the supply needed to meet strong customer demand.
  17. F

    KeyBanc's TSMC/Intel/Samsung yield benchmark (1/13/2026)

    It looks like they were comparing process yields. Backend would not be 18A-specific.
  18. F

    Samsung’s U.S. Taylor Facility Reportedly Becomes Top Choice for Customers Looking Beyond TSMC, as Intel Struggles with “Execution Challenges”

    M More like a different game now than a return. If you're talking about Intel Products, everything changed after NVIDIA started dominating AI.
  19. F

    KeyBanc's TSMC/Intel/Samsung yield benchmark (1/13/2026)

    "We are seeing significant progress being made on foundry, with 18A yields improving to over 60% and good enough to ramp Panther Lake," Vinh and Rosumny said. "While not best in class, as TSMC (TSM) was at 70-80% when it launched 2nm, with INTC's aspirations of being the #2 foundry supplier...
Back
Top