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Search results

  1. F

    Stochastics: Yield-Killing Gap No One Wants to Talk About

    Recent outgassing studies have pinned down resist degrading significantly (losing >10% of key component) with EUV doses above 50 mJ/cm2: https://frederickchen.substack.com/p/euv-resist-degradation-with-outgassing
  2. F

    Rapidus Announces Strategic Collaboration with Keysight To Improve Yield and Achieve High-Precision PDK For 2nm GAA Semiconductors

    TOKYO, Aug. 26, 2025 — Rapidus Corporation, a leading-edge Japanese foundry that manufactures advanced logic semiconductors, today announced a strategic collaboration with Keysight Technologies Japan K.K., the Japanese subsidiary of Keysight Technologies, Inc., and has signed a Memorandum of...
  3. F

    SK hynix Presents Future DRAM Technology Roadmap at IEEE VLSI 2025

    The 3D NAND could use vertical polysilicon channels, while the 3D DRAM needs horizontal channels, preferably not polysilicon. Reliability is of utmost importance, so SLC is a must.
  4. F

    The Fall of Intel

    A couple of interesting, very likely debatable, points from Professor Bill Lazonick in this video: 1. It looks like he feels Intel did too much stock buybacks, much more than R&D investment, due to their importance to compensation. 2. He suggests PG got the boot due to close ties with Biden, in...
  5. F

    SK hynix Presents Future DRAM Technology Roadmap at IEEE VLSI 2025

    6F² scaling is now coming up against the issue of shrinking gap between bit line and storage node contact. On the other hand, 4F² has the issue of word lines too close for cell sizes <0.0009 um². So 3D DRAM probably should be expedited...
  6. F

    How are the benefits of BSPD affected by 3D stacking?

    https://tspasemiconductor.substack.com/p/the-thermal-frontier-of-bspdn-iitc At the 2025 IEEE ECTC, TSMC unveiled several advanced thermal management solutions aimed at addressing the challenges posed by high power density chips. These include innovations in thermal interface materials (TIMs)...
  7. F

    SK hynix Presents Future DRAM Technology Roadmap at IEEE VLSI 2025

    Seoul, June 10, 2025 SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it presented a new DRAM technology roadmap for the next 30 years and the direction for a sustainable innovation at the IEEE VLSI symposium 20251 held in Kyoto, Japan. Cha Seon Yong, Chief Technology...
  8. F

    Stochastics: Yield-Killing Gap No One Wants to Talk About

    Despite continuous improvements in the performance of EUV photoresists, EUV masks, and post-lithography processes, stochastic defects, or stochastic failures – space bridges and line breaks - are still a major factor of yield loss in EUV production. The detection of stochastic defects is...
  9. F

    Forget the White House Sideshow. Intel Must Decide What It Wants to Be.

    Yeah, there's a big gap from R&D to manufacturing. Volume needs and breeds statistics. Let's not also forget N5 D0>1/cm2 (on average!) at risk production: https://web.archive.org/web/20200525115643/https://www.anandtech.com/show/15219/early-tsmc-5nm-test-chip-yields-80-hvm-coming-in-h1-2020.
  10. F

    Government’s Intel intervention is ‘essential’ for national security, tech analyst says

    Published Fri, Aug 15 202510:21 AM EDT Updated Fri, Aug 15 20254:07 PM EDT Annie Palmer@in/annierpalmer/@annierpalmer Key Points - Government intervention in Intel is “essential” to protect U.S. national security, analyst Gil Luria said. - Bloomberg reported that the Trump administration is...
  11. F

    Samsung boosts HBM specialist hiring, scales back foundry recruitment

    The company will halt experienced hiring in the second half for its loss-making System LSI unit By Jeong-Soo Hwang Published August 13, 2025 at 4:42 PM(KST) Updated August 14, 2025 at 1:04 AM(KST) Samsung Electronics Co. is stepping up recruitment of seasoned high-bandwidth memory (HBM)...
  12. F

    Report: China ships first NIL lithography tool as 300-plus firms mobilize to rival EUV tech

    Apparently, the specs can be checked at PuLin's site. 50 nm alignment won't work. Another system shows 30 WPH, a tenth of the current fastest lithography machine.
  13. F

    Forget the White House Sideshow. Intel Must Decide What It Wants to Be.

    The internal product focus seems to convey the message that 18A is good enough for Intel Product even though not in general for external customers. That would be the wrong message to give.
  14. F

    Forget the White House Sideshow. Intel Must Decide What It Wants to Be.

    The key problem seems to be "that its latest chip manufacturing process called 18A is going to be mainly used for its own internal products—meaning no major external customer has yet signed up to have Intel make its chips."
  15. F

    Forget the White House Sideshow. Intel Must Decide What It Wants to Be.

    The chip maker’s future was dangling by a thread even before CEO controversy By Asa Fitch and Dan Gallagher Aug. 12, 2025 5:30 am ET In March, WSJ explained how a mistake Intel made in the mid-2000s snowballed into one of the biggest challenges now confronting CEO Lip-Bu Tan. Five months in...
  16. F

    Former Intel CEO Craig Barrett on saving Intel

    Pilot line operations to begin this year, so presumably some expenditures already: https://techhq.com/news/can-rapidus-rebuild-semiconductor-industry-in-japan/ A more practical reference than Rapidus would be TSMC (obviously): https://www.tsmc.com/static/abouttsmcaz/index.htm $65 billion for...
  17. F

    Former Intel CEO Craig Barrett on saving Intel

    A good contemporary reference is Rapidus. They're planning to spend 37 billion by 2027, but that's just for Rapidus's scale, 2nm fab only.
  18. F

    Former Intel CEO Craig Barrett on saving Intel

    Realistically, the capacity equivalent to TSMC (total) cannot be fulfilled within the US, within practical scope of money/time.
  19. F

    Former Intel CEO Craig Barrett on saving Intel

    4. Intel is cash poor and can’t afford to invest in the capacity needed in the future to replace TSMC or even a reasonable fraction of TSMC capacity. They probably need a cash infusion of $40B or so to be competitive. Is $40 billion even enough?
  20. F

    SMIC Q2 2025 Earnings and Commentary

    This still means overseas orders could drop since they have the inventory. Domestic orders would have to pick up the slack.
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