A new powerhouse to dominate over AMAT
Combination of best of Breeds
KLAC shareholders get $32 cash plus stock
The wedding invitation…….
Lam Research Corporation (NASDAQ: LRCX) (“Lam”) and KLA-Tencor Corporation (NASDAQ: KLAC) (“KLA-Tencor”) today announced that they have entered… Read More
WEBINAR: Edge AI Optimization: How to Design Future-Proof Architectures for Next-Gen Intelligent DevicesEdge AI is rapidly transforming how intelligent solutions…Read More
WEBINAR Unpacking System Performance: Supercharge Your Systems with Lossless Compression IPsIn today's data-driven systems—from cloud storage and AI…Read More
ChipAgents Tackles Debug. This is ImportantInnovation is never ending in verification, for performance,…Read More
Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and AnalysisIn a major announcement at the 2025 Design…Read More
CEO Interview with Faraj Aalaei of CognichipFaraj Aalaei is a successful visionary entrepreneur with…Read More
Innovative Apps to Evolutionize Wearable Segment
In recent years, excessive cold or heat in particular regions of the world has become a regular phenomenon; it reminds me about a movie I saw a couple of years ago, “The Day After Tomorrow” in which the whole Manhattan was shown covered with ice. Can’t say whether that can ever happen if at all, but on a better note today, I can see the possibility… Read More
Who Will Get the Next Bite of Apple Chip Business?
Recent reports have Intel displacing Qualcomm as the modem supplier and TSMC as the foundry for the next Apple A10 SoC. That is if you call this a credible report: … Read More
Price of Admission $0.00 at Inaugural Silicon Valley Conference
Back in 2002, the Southwest DFT Conference was born and experts on design for test (DFT) and test got together to share ideas and talk to people in this industry that were trying to solve test challenges of the day.… Read More
FDSOI Cost Analysis – Part I
One of the most frequently discussed concerns regarding FDSOI adoption is the higher starting wafer cost compared to bulk technology. This discussion was also brought up after my earlier post,… Read More
Profile of an IoT Processor for Industrial, Consumer Markets
The intersection of data with intelligent machines is creating new possibilities in industrial automation, and this new frontier is now being increasingly known as the Industrial Internet of Things (IIoT). However, if there is a single major stumbling block that is hindering the IoT take-off at the larger industrial scale, … Read More
SEMI Releases Industry’s First “Global 200mm Fab Outlook to 2018” and Announces Webinar
SEMI, the global industry association advancing the interests of the worldwide electronics supply chain, today (October 19) published a new report, “Global 200mm Fab Outlook to 2018.” According to the report, worldwide 200mm semiconductor wafer fab capacity is forecast at 5.2 million wafer starts per month (wspm) in 2015 and… Read More
About That Landauer Limit…
You may have heard of the Landauer principle or the Landauer limit. This defines a lower bound on switching power dissipation in any form of digital circuit. Rolf Landauer first presented this principle in 1961, while working at IBM. It’s not limited by how the circuit is built – you can use FinFETS or spintronics or even dilithium… Read More
How LETI IP will speed-up GlobalFoundries 22FDX™ ASIC Development
GlobalFoundries has positioned FDSOI proposal -22FDX- to provide better performance and power dissipation than competitive FDSOI offers on 28nm node. The FDSOI licensing agreement between LETI and GlobalFoundries is only a couple of months old (July 2015), but the real work has started in Dresden as several engineers from … Read More
Samsung’s Luck with Gear S2
The wave of new and improved smartwatches started this year. Apple launched its first smartwatch in April. Several other players including Motorola, LG, ASUS, and Huawei have launched their new smartwatches this year. Sony launched its latest ‘SmartWatch 3’ in October last year. Rising consumer electronics brands like Xiaomi… Read More
Facing the Quantum Nature of EUV Lithography