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A Brief History of IP Management

A Brief History of IP Management
by Daniel Nenni on 04-24-2019 at 12:00 pm

As RTL design started to increase in the late 1980’s and early 1990’s, it was becoming apparent that some amount of management was needed to keep track of all the design files and their associated versions. Because of the parallels to software development, design teams looked to the tools and methodologies that were in use by software… Read More


Delivering Innovation for Regulated Markets

Delivering Innovation for Regulated Markets
by Daniel Nenni on 02-25-2019 at 7:00 am

When delivering devices to markets that require heavily audited compliance it is necessary to document and demonstrate development processes that follow the various standard(s) such as IEC65108, IATF16949, ISO26262.

For complex multi-disciplinary designs this can be difficult as they are often developed by multiple teams… Read More


Webinar: Next Generation Design Data & Release Management

Webinar: Next Generation Design Data & Release Management
by Daniel Nenni on 05-12-2017 at 12:00 pm

Design Data Management (DDM) is a bit like insurance. It’s something every semiconductor company has to have, and as a result it’s probably something taken for granted. In order to make their products more useful, the DDM vendors have added more functionality to manage more of the lifecycle of design data.

Dassault’s Synchronicity… Read More


IP Traffic Control

IP Traffic Control
by Bernard Murphy on 04-14-2017 at 7:00 am

From an engineering point of view, IP is all about functionality, PPA, fitness for use and track record. From a business/management point of view there are other factors, just as critical, that relate less to what the IP is and more to its correct management and business obligations. The problems have different flavors depending… Read More


Synchronizing Collaboration

Synchronizing Collaboration
by Bernard Murphy on 04-12-2017 at 7:00 am

Much though some of us might wish otherwise, distributed development teams are here to stay. Modern SoC design requires strength and depth in expertise in too many domains to effectively source from one site; competitive multi-national businesses have learned they can very effectively leverage remote sites by building centers… Read More


Dassault Systemes Hosts New Microsite Focused on IP Reuse Challenges

Dassault Systemes Hosts New Microsite Focused on IP Reuse Challenges
by Mitch Heins on 01-04-2017 at 12:00 pm

I recently wrote an article about networks-on-chip (NoC) and how Systems-On-Chip integrated circuits (SoCs) are becoming increasingly more complex and heterogeneous in nature. While researching for that article I came upon a new micro-site by Dassault Systemes that goes into great detail about the operational challenges… Read More


Behind the 3DEXPERIENCE for silicon

Behind the 3DEXPERIENCE for silicon
by Don Dingee on 10-31-2016 at 4:00 pm

We’ve been covering the Dassault Systèmes “Silicon Thinking” platform for a while here, but, as I’m often prone to do, I wanted to explore the backstory to uncover more about the concept. With over 25M users of their product lifecycle management (PLM) solutions, why is Dassault Systèmes becoming so interested in semiconductor… Read More


Latest Pinpoint release tackles DRC and trend lines

Latest Pinpoint release tackles DRC and trend lines
by Don Dingee on 07-06-2016 at 4:00 pm

After reading previous SemiWiki coverage on Dassault Systèmes and their ENOVIA Pinpoint solution, one big item seemed missing: how does this thing actually work? With all due respect to our other bloggers who covered when Dassault Systèmes acquired Pinpoint from Tuscany Design Automation, why Qualcomm is using Pinpoint, and… Read More


Sustainability, Semiconductor Companies and Software Companies

Sustainability, Semiconductor Companies and Software Companies
by Daniel Payne on 02-25-2016 at 12:00 pm

I certainly want to leave the Earth a better place to live for my children and generations to come, so sustainability is a value that resonates with me. How is a consumer like me to know which companies are the most sustainable in areas that matter, like:… Read More


The Mechanical Reliability of IC Packages

The Mechanical Reliability of IC Packages
by Daniel Payne on 01-31-2016 at 12:00 pm

At Intel back in the late 1970’s we were designing DRAM chips and mounting them in ceramic and plastic packages, however there were problems when some of the die would crack inside of the package because of thermal mismatch issues with how the die was attached to the heat spreader inside the package. Back then we really didn’t… Read More