Arteris at DAC 2026 Connecting Innovation for Silicon SuccessThe semiconductor industry has entered a new era…Read More
DAC 2026 Mach42: A new generation of physics-driven AI models for analog circuit verificationMach42 spun out of the Department of Physics…Read More
Synopsys at Design Automation Conference 2026Synopsys is catalyzing the era of pervasive intelligence…Read More
DAC 2026: Join Accellera for a dynamic luncheon exploring how artificial intelligence is reshaping the standards landscape for design and verification.Accellera Systems Initiative invites the design and verification…Read More
Enabling AI to Understand Complex Runtime Behavior for Accurate, Automated Root Cause Analysis — DAC 2026Undo gives AI coding agents the runtime context…Read More
Last week I attended the Linley Fall Processor Conference held in Santa Clara, CA. This blog is the first of three blogs I will be writing based on things I saw and heard at the event.
In April, Flex Logix announced its InferX X1 edge inference co-processor. At that time, Flex Logix announced that the IP would be available and that a chip,… Read More
At TechCon Arm announced two more advances against competitive threats, one arguably tactical and the other strategic, at least in this writer’s view. The tactical move was to add support for custom instructions, the ability to collapse multiple instructions into a single instruction through customer-added logic which hooks… Read More
Connecting the Divide between Design and Manufacturing is an overarching theme within the ESD Alliance as these two essential semiconductor disciples become more reliant on each other. It’s also the reason we’re hosting SMART Design, the first system-centric series showcasing advances in electronic system design to be held… Read More
This morning, Synopsys announced its new Die-to-Die PHY IP. This announcement is critically important as it addresses two major market drivers – the growing need for faster connectivity in the datacenter and similar markets, and a path to better exploit the latest processes by dealing with yield issues for larger dies in a different… Read More
The transition to the digital age from a mostly analog world really began with the invention of the A-to-D and D-to-A converters. However scalar processors can easily be overwhelmed by the copious data produced by something as simple as an audio stream. To solve this problem and to really jumpstart the digital age, the development… Read More
In a joint presentation given by Samsung, Arm, and Cadence at the Arm TechCon event on October 9, 2019, Cadence showed some results and explained its collaboration project used to implement the new Arm Hercules CPU on Samsung’s advanced 5LPE process. I do not want to minimize the significance of Samsung’s and Arm’s participation… Read More
My first DAC was in 1987 so I’ve seen our industry expand greatly over the years, and I expect that #57DAC on July 19-23, 2020 in SFO to be another exciting event to attend for semiconductor professionals from around the globe. What makes DAC so compelling for me to visit are the people, exhibitors, panel discussions, technical… Read More
What is it about General Motors? The once largest maker of cars in the world (now sixth or seventh) has been in an all-fronts retreat for years – while Wall Street analysts and top GM brass whistle past the graveyard touting gains in the company’s stock price and profitability.
GM has exited key markets including Europe, India and
It’s happened again. The 42nd fatality of 2019 in the U.S. from a child being left behind in a hot car has occurred – this time, in New Mexico. While horrific and staggering, the total number of fatalities due to children being left in overheated cars for 2019 is still less than the 54 fatalities suffered in 2018.
According… Read More
This will be a combination of the recent TSMC quarterly report, a look back at Cliff Hou’s keynote at the most recent TSMC conference, and conversations on SemiWiki.com. There has been a lot of press on this but of course the most important points are being missed. Semiconductors are complicated and getting more so, absolutely.… Read More
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TSMC CoWoS versus Intel EMIB Semiconductor Packaging