Presto Engineering recently held a webinar discussing vision chip technology – what a vision chip is, what are the applications and how can you optimize its use. Samer Ismail, a design engineer at Presto Engineering with deep domain expertise in vision chip technology was the presenter. Samer takes you on a very informative … Read More
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I concluded my last post on the topic with an inventory of the key attributes needed to fill the ASIC void created by the relentless consolidation in semiconductors. There were five items, as follows:
- Design and manufacturing expertise in a market that requires custom chips
- Differentiating IP and the skills to integrate it into
It started slowly at first. Then it began picking up steam. I’m referring to consolidation in the semiconductor sector. I had a front-row seat for what consolidation did to the ASIC part of semiconductor and that is the topic of this discussion. I was the VP of marketing at eSilicon, the company that invented the fabless ASIC model.… Read More
Managing the ASIC manufacturing is one of the biggest challenges of chip projects.
Building an ASIC supply chain requires specific expertise. Throughout the process you’ll be confronted with hundreds of decisions that will require specific knowledge in order to be addressed correctly, avoid costly mistakes and lose time. … Read More
As the traditional ASIC business disappears before our eyes with the recent divestitures and acquisitions, I have been asking questions amongst the fabless semiconductor ecosystem and am getting few answers.
Who or what is going to step in to enable start-ups and new to silicon systems companies with application specific chips?… Read More
Minimizing ASIC production costs is the goal of every company. The problem is that this requires extensive knowledge. You must understand the technical intricacies and the financial implications of multiple activities like wafer production, packaging and QA activities such as electrical tests.
Generally, the more your company… Read More
Semiconductor chip package technologies have evolved throughout the years to the point where hundreds of package types are available today.
Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc. However,… Read More
Customer Case Study
digitalSTROM develops smart home automation solutions providing users with superior comfort and a whole new style of living. Based on proprietary ASIC and software, digitalSTROM’s solutions connect electrical household appliances through existing power lines and enable an intelligent home via light… Read More