All Things Semiconductor!
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Image RemovedSemiconductor chip package technologies have evolved throughout the years to the point where hundreds of package types are available today.
Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna… Read More
Customer Case Study
digitalSTROM develops smart home automation solutions providing users with superior comfort and a whole new style of living. Based on proprietary ASIC and software, digitalSTROM’s solutions connect electrical household appliances through existing power lines and enable an intelligent home via light… Read More
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Achronix: Accelerate Data Processing Algorithms using FPGAs with 2D Network-on-Chip
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Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
Choose the Right ASIC Manufacturing Model for Your Business
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Achronix: Accelerate Data Processing Algorithms using FPGAs with 2D Network-on-Chip
PAVE360: Of SoCs, Digital Twins, and Validating Autonomous Vehicle Behavior
Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
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REPLAY: Reduce Risk and Improve Quality of AMS IP’s using AI-Powered Automated Timing Arc Prediction
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Safety and Platform-Based Design