Last week Samsung hosted the GSA Silicon Valley “State of the Industry” Meet-up which was well attended by the semiconductor elite, myself included. The agenda started with an update on the semiconductor industry outlook followed by deep dives into Automotive, IoT, Artificial Intelligence, and Cybersecurity all of which are tracked quite closely on SemiWiki.com. It was a very informative session with great food and networking. Thank you GSA and special thanks to Samsung for hosting the event at their new HQ in San Jose.
Next week Samsung is hosting another live event with eSilicon and Rambus, space is limited so register now. I’m not acquainted with two of the speakers, Mohit Gupta and Dr. Kang Sung Lee, but I do know Bill Isaacson and can tell you he is an excellent no nonsense speaker. Bill started the first half of his 20 year semiconductor career at LSI Logic and the second half at eSilicon, so Bill knows the ASIC business, absolutely.
Succeeding with 56G SerDes, HBM2, 2.5D and FinFET
A dramatic increase in network bandwidth and cloud-computing infrastructure is on the way. Fueled by applications such as deep machine learning and massive data volumes from a connected world, the performance demands of ASICs to support these new applications are daunting.
Join eSilicon, Rambus and Samsung Foundry for an overview of the advanced technologies being deployed to address these challenges. We’ll discuss HBM technology and the associated PHY, high-speed SerDes technology, 2.5D integration, high-performance ASIC design, interposer/package design and the manufacturing and packaging technologies available to address this class of FinFET-based designs.
There is no charge for this live event.
Registration closes at noon Pacific time on Friday, March 3, 2017. For security reasons, only those who have pre-registered may attend.
3:30 – 4:00Check in at the South Lobby reception area
4:00 – 4:15Welcome, overview of HBM/2.5D market and applications
4:15 – 4:45 Enabling IP
4:45 – 5:15 ASIC, interposer and package design
5:15 – 5:45 Fabrication and packaging
5:45 – 6:00 Panel discussion
6:00 – 7:00 Networking reception; drinks and light hors d’oeuvres
Wednesday, March 8, 2017
3655 N First Street
San Jose, CA 95134
Bill Isaacson manages all aspects of strategic account relationships for eSilicon. Previously, he managed advanced development for eSilicon’s custom design initiatives. Prior to this position, he ran the customer solutions engineering function at eSilicon for eight years. Bill was previously at LSI Logic, where he was a design center manager. Bill received his BS/EE degree from the University of Illinois at Urbana-Champaign.
Mohit Gupta is currently a senior director of product marketing in the Memory and Interfaces Division at Rambus managing the SerDes IP portfolio. Prior to joining Rambus in 2015, Mohit has led multiple IP development, application engineering and pre-sales teams at Open-Silicon, Infineon Technologies and ST Microelectronics. Mohit holds BE, MS and MBA Degrees from premier universities in India.
Dr. Kang Sung Lee is currently a principal engineer in Samsung Foundry marketing. He is responsible for defining and promoting Samsung Foundry technology offerings for customer product needs. Dr. Lee joined Samsung in 2007 as a customer engineer and supported worldwide customers in multiple market segments, from mobile AP, GPU, FPGA, networking to cognitive computing and etc.