All Things Semiconductor!
I recently had the pleasure of attending the AI Hardware Summit at the Computer History Museum in Mountain View, CA. This two-day conference brought together many companies involved in building artificial intelligence solutions. Though the focus was on building the hardware for this area, there was naturally much discussion… Read More
Image RemovedAs more than 343 people (and counting) know, we will be releasing the 2019 updated PDF version of our first book “Fabless: The Transformation of the Semiconductor Industry” via handout at a live webinar. The response has been overwhelming and I want to personally thank you. The webinar will be a brief overview of the… Read More
Since the beginning of May eSilicon has announced the tape-out of three TSMC 7nm test chips. The first of these, a 7nm 400G Ethernet Gearbox/Retimer design, caught my eye and I followed up with Hugh Durdan, their vice president of strategy and products, to learn more about it. Rather than just respin their 56G SerDes, they decided… Read More
Image RemovedHaving just completed a cloud evaluation for SemiWiki I can tell you why eSilicon chose Google. Simply put, they are working harder to get cloud business. Google ($4B) is the number five cloud provider behind Microsoft ($21.2B), Amazon ($20.4B), IBM ($10.3B) and Oracle ($6.08B). There is a lot of money in the cloud… Read More
During the SoC Design Session at the just concluded Linley Spring Processor Conference in Santa Clara, Carlos Macian, Senior Director AI Strategy and Products at eSilicon, held a talk entitled ‘Opposites Attract: Customizing and Standardizing IP Platforms for ASIC Differentiation’.
Standardization is key to IP in modern … Read More
At SemiWiki we usually don’t write about the press releases we are sent. However, a recent press release by eSilicon caught my eye and prompted me to call Mike Gianfagna, eSilicon Vice President of Marketing. The press release is not just about one thing, rather it focuses on a number of interesting things that together show their… Read More
During the 1940s when aerospace engineers were attempting to break the sound barrier for the first time, they were confronting a slew of new technical issues that had never been dealt with before, and in some cases never seen before. In subsonic flight airflow was predictable and well understood. In crossing the sound barrier, … Read More
No matter how high the processing capability of a chip, its overall performance is limited by IO speed. This is very similar to a car with low performance tires, a powerful engine will not be able to transfer its energy to the ground effectively. There is quite literally a race going on between core processing and IO speeds for transferring… Read More
IP has always been a hot topic on SemiWiki with quite a bit of our readers doing the “make versus buy” analysis. SerDes is one of the more difficult “makes” so it is mostly a “buy” analysis made by networking class ASIC architects and a handful of other applications that demand high performance and throughput. Based on the recent traffic… Read More
Image RemovedThe cell-based ASIC business that we know today was born in the early 1980s and was pioneered by companies like LSI Logic and VLSI Technology. Some of this history is covered in Chapter 2 of our book, “Fabless: The Transformation of the Semiconductor Industry”. The ASIC business truly changed the world. Prior to this… Read More
Array
(
[0] => tribe-events-list-widget-5
[1] => search-2
[2] => media_image-8
[3] => text-6
)
tribe-events-list-widget-5
Tribe__Events__List_Widget Instance: 5Array
(
[title] => Upcoming Events
[limit] => 5
[no_upcoming_events] =>
[featured_events_only] =>
[jsonld_enable] => 1
[rw_opt] => Array
(
[widget_select] => 1
[cpt_page] => 1
[others_author_archive] => 1
[others_404_page] => 1
[others_blog_page] => 1
)
[display_widget_mobile] => 1
)
Tribe__Events__List_Widget
search-2
WP_Widget_Search Instance: 2Array
(
[display_widget_title] => on
[title] => Search Semiwiki
[rw_opt] => Array
(
[widget_select] => 1
[others_blog_page] => 1
[others_author_archive] => 1
[others_404_page] => 1
[cpt_page] => 1
)
[display_widget_mobile] => 1
[rw_opt_exclude] => Array
(
[pageid_274495] => 1
)
)
WP_Widget_Search
media_image-8
WP_Widget_Media_Image Instance: 8Array
(
[display_widget_title] => on
[attachment_id] => 275190
[url] => https://semiwiki.com/wp-content/uploads/2019/09/Threshold-Systems-Ad-300x300.jpg
[title] => Home/Default Page Advertisement 4
[size] => medium
[width] => 400
[height] => 400
[caption] =>
[alt] =>
[link_type] => custom
[link_url] => https://secure.thresholdsystems.com/Training/AdvancedCMOSTechnology.aspx
[image_classes] =>
[link_classes] =>
[link_rel] =>
[link_target_blank] =>
[image_title] => Home/Default Page Advertisement 4
[display_widget_mobile] =>
[rw_opt] => Array
(
[widget_select] => 1
[category_96] => 1
[category_14325] => 1
[category_6435] => 1
[category_95] => 1
[category_157] => 1
[category_50] => 1
[category_90] => 1
[category_151] => 1
[category_386] => 1
[others_front_page] => 1
[others_blog_page] => 1
)
)
text-6
WP_Widget_Text Instance: 6Array
(
[title] =>
[text] => 
Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
Finding Your Way Through Verification (Text)
Concerned about IP security threats for your SoCs?
Achronix: Accelerate Data Processing Algorithms using FPGAs with 2D Network-on-Chip
PAVE360: Of SoCs, Digital Twins, and Validating Autonomous Vehicle Behavior
Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
REPLAY: GPU-Powered SPICE: The Way Forward for Analog Simulation
REPLAY: Avoiding CDM (Charged Device Model) ESD Failures
REPLAY: eFPGA – "What a great idea! But I have no idea how I’d use it!"
REPLAY: Ensuring System-level Security Through Hardware/Software Security Verification
REPLAY: Fabless: The Transformation of the Semiconductor Industry
REPLAY: The Brave New World of Customized Memory
REPLAY: Embedded FPGA: The Fabric for Optimized Machine Learning
REPLAY: VLSI Design Methodology Development
REPLAY: Lightspeed Data Sync - Design Workspace Problems Solved!
REPLAY: Desinging Complex SoCs and Dealing with Multiple File Formats?
REPLAY: How ASIC/SoC Prototyping Solutions Can Help You!
REPLAY: Reusing Your IPs & PDKs Successfully With Cadence® Virtuoso®
REPLAY: Taiwan ESD Workshop Recording
REPLAY: Reduce Risk and Improve Quality of AMS IP’s using AI-Powered Automated Timing Arc Prediction
REPLAY: Text: A Year of Breakfast Bytes by Paul McLellan (Free PDF Version)
[filter] => 1
[visual] => 1
[rw_opt] => Array
(
[widget_select] => 1
[others_front_page] => 1
[category_96] => 1
[category_6435] => 1
[category_95] => 1
[category_157] => 1
[category_50] => 1
[category_13] => 1
[category_90] => 1
[category_89] => 1
[category_3611] => 1
[category_178] => 1
[category_14418] => 1
[category_51] => 1
[category_97] => 1
[cpt_page] => 1
[others_blog_page] => 1
[category_44] => 1
[category_5] => 1
[category_32] => 1
[category_22] => 1
)
[display_widget_mobile] => 1
)
WP_Widget_Text
Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
Finding Your Way Through Verification (Text)
Concerned about IP security threats for your SoCs?
Achronix: Accelerate Data Processing Algorithms using FPGAs with 2D Network-on-Chip
PAVE360: Of SoCs, Digital Twins, and Validating Autonomous Vehicle Behavior
Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
REPLAY: GPU-Powered SPICE: The Way Forward for Analog Simulation
REPLAY: Avoiding CDM (Charged Device Model) ESD Failures
REPLAY: eFPGA – “What a great idea! But I have no idea how I’d use it!”
REPLAY: Ensuring System-level Security Through Hardware/Software Security Verification
REPLAY: Fabless: The Transformation of the Semiconductor Industry
REPLAY: The Brave New World of Customized Memory
REPLAY: Embedded FPGA: The Fabric for Optimized Machine Learning
REPLAY: VLSI Design Methodology Development
REPLAY: Lightspeed Data Sync – Design Workspace Problems Solved!
REPLAY: Desinging Complex SoCs and Dealing with Multiple File Formats?
REPLAY: How ASIC/SoC Prototyping Solutions Can Help You!
REPLAY: Reusing Your IPs & PDKs Successfully With Cadence® Virtuoso®
REPLAY: Taiwan ESD Workshop Recording
REPLAY: Reduce Risk and Improve Quality of AMS IP’s using AI-Powered Automated Timing Arc Prediction
REPLAY: Text: A Year of Breakfast Bytes by Paul McLellan (Free PDF Version)
Array
(
[0] => rpwe_widget-9
[1] => gtranslate-3
[2] => xfrp_widget-2
[3] => better_recent_comments-2
)
rpwe_widget-9
Recent_Posts_Widget_Extended Instance: 9Array
(
[title] => Trending Now
[title_url] =>
[ignore_sticky] => 1
[exclude_current] => 1
[limit] => 5
[offset] => 10
[order] => DESC
[orderby] => date
[post_type] => Array
(
[0] => post
)
[post_status] => publish
[cat] => Array
(
)
[tag] => Array
(
)
[taxonomy] =>
[excerpt] =>
[length] => 10
[date] =>
[date_relative] =>
[date_modified] =>
[readmore] =>
[readmore_text] => Read More
[comment_count] =>
[thumb] =>
[thumb_height] => 55
[thumb_width] => 55
[thumb_default] => http://images/semiwiki-small.png
[thumb_align] => rpwe-alignleft
[styles_default] => 1
[cssID] =>
[css_class] =>
[css] => .rpwe-block ul{
list-style: none !important;
margin-left: 0 !important;
padding-left: 0 !important;
}
.rpwe-block li{
border-bottom: 1px solid #eee;
margin-bottom: 10px;
padding-bottom: 10px;
list-style-type: none;
}
.rpwe-block a{
display: inline !important;
text-decoration: none;
}
.rpwe-block h3{
background: none !important;
clear: none;
margin-bottom: 0 !important;
margin-top: 0 !important;
font-weight: 400;
font-size: 12px !important;
line-height: 1.5em;
}
.rpwe-thumb{
border: 1px solid #eee !important;
box-shadow: none !important;
margin: 2px 10px 2px 0;
padding: 3px !important;
}
.rpwe-summary{
font-size: 12px;
}
.rpwe-time{
color: #bbb;
font-size: 11px;
}
.rpwe-comment{
color: #bbb;
font-size: 11px;
padding-left: 5px;
}
.rpwe-alignleft{
display: inline;
float: left;
}
.rpwe-alignright{
display: inline;
float: right;
}
.rpwe-aligncenter{
display: block;
margin-left: auto;
margin-right: auto;
}
.rpwe-clearfix:before,
.rpwe-clearfix:after{
content: "";
display: table !important;
}
.rpwe-clearfix:after{
clear: both;
}
.rpwe-clearfix{
zoom: 1;
}
[before] =>
[after] =>
[rw_opt] => Array
(
[widget_select] => 1
[others_front_page] => 1
[others_author_archive] => 1
[others_404_page] => 1
)
)
gtranslate-3
GTranslateWidget Instance: 3Array
(
[title] => Google Translate
[rw_opt] => Array
(
[others_front_page] => 1
[others_author_archive] => 1
[others_404_page] => 1
[widget_select] => 1
)
[display_widget_mobile] =>
)
xfrp_widget-2
XF2_Latest_Posts_Widget Instance: 2Array
(
[title] => Recent Forum Threads
[title_url] =>
[ignore_sticky] => 0
[exclude_current] => 0
[limit] => 10
[offset] => 0
[order] =>
[orderby] => ID
[post_type] => Array
(
[0] => post
)
[post_status] =>
[cat] => Array
(
)
[tag] => Array
(
)
[taxonomy] =>
[excerpt] =>
[length] => 0
[date] =>
[date_relative] =>
[date_modified] =>
[readmore] =>
[readmore_text] =>
[comment_count] =>
[thumb] =>
[thumb_height] => 0
[thumb_width] => 0
[thumb_default] =>
[thumb_align] =>
[styles_default] =>
[cssID] =>
[css_class] =>
[css] =>
[before] =>
[after] =>
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[others_front_page] => 1
[pageid_274495] => 1
)
[sluglist] => ["jobs-dashboard"]
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
)
XF2_Latest_Posts_Widget
Array
a
Array
(
[title] => Recent Forum Threads
[title_url] =>
[ignore_sticky] => 0
[exclude_current] => 0
[limit] => 10
[offset] => 0
[order] =>
[orderby] => ID
[post_type] => Array
(
[0] => post
)
[post_status] =>
[cat] => Array
(
)
[tag] => Array
(
)
[taxonomy] =>
[excerpt] =>
[length] => 0
[date] =>
[date_relative] =>
[date_modified] =>
[readmore] =>
[readmore_text] =>
[comment_count] =>
[thumb] =>
[thumb_height] => 0
[thumb_width] => 0
[thumb_default] =>
[thumb_align] =>
[styles_default] =>
[cssID] =>
[css_class] =>
[css] =>
[before] =>
[after] =>
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[others_front_page] => 1
[pageid_274495] => 1
)
[sluglist] => ["jobs-dashboard"]
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
[node_name] => esilicon
[node_id] => Array
(
[0] => 2
[1] => 283
)
)
XF\Mvc\Entity\ArrayCollection Object
(
[entities:protected] => Array
(
[391] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)
XF\Mvc\Entity\ArrayCollection Object
(
[entities:protected] => Array
(
[11865] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 49
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11865
[node_id] => 391
[title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[reply_count] => 0
[view_count] => 508
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1569201124
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41943
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1569201124
[last_post_id] => 41943
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11836] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 50
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11836
[node_id] => 391
[title] => ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Three-Meter Samtec Cable Assemblies
[reply_count] => 0
[view_count] => 218
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1568753693
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41910
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1568753693
[last_post_id] => 41910
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11827] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 51
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11827
[node_id] => 391
[title] => AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper Cable
[reply_count] => 0
[view_count] => 209
[user_id] => 5
[username] => Daniel Nenni
[post_date] => 1568320488
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41891
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1568320488
[last_post_id] => 41891
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11771] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 52
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11771
[node_id] => 391
[title] => eSilicon to debut AI Accelerator software and a new chiplet model at Hot Chips 2019
[reply_count] => 0
[view_count] => 467
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566925399
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41797
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566925399
[last_post_id] => 41797
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11770] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 53
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11770
[node_id] => 391
[title] => eSilicon, Samtec and Wild River Technology Offer High-Performance Communications Webinar
[reply_count] => 0
[view_count] => 225
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566925339
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41796
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566925339
[last_post_id] => 41796
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11769] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 54
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11769
[node_id] => 391
[title] => eSilicon to Participate in Panel Discussion on Chiplet Design Experience at a Workshop Presented by the Open Compute Project (OCP)
[reply_count] => 0
[view_count] => 213
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566925277
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41795
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566925277
[last_post_id] => 41795
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11768] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 55
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11768
[node_id] => 391
[title] => Google and eSilicon at DAC 2019: Doing EDA in the Cloud? Yes, It’s Possible!
[reply_count] => 0
[view_count] => 219
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566925241
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41794
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566925241
[last_post_id] => 41794
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11767] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 56
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11767
[node_id] => 391
[title] => eSilicon Technical Advisory Board Members Win Facebook Research Award
[reply_count] => 0
[view_count] => 52
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566925212
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41793
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566925212
[last_post_id] => 41793
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11766] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 57
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11766
[node_id] => 391
[title] => eSilicon Announces Production Qualification of 5G Infrastructure ASIC
[reply_count] => 0
[view_count] => 220
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566925190
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41792
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566925190
[last_post_id] => 41792
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11765] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 58
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11765
[node_id] => 391
[title] => ESD Alliance CEO Outlook 2019: eSilicon CEO Jack Harding to Participate
[reply_count] => 0
[view_count] => 220
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566925140
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41791
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566925140
[last_post_id] => 41791
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11764] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 59
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11764
[node_id] => 391
[title] => eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip
[reply_count] => 0
[view_count] => 190
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566925109
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41790
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566925109
[last_post_id] => 41790
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11763] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 60
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11763
[node_id] => 391
[title] => eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip
[reply_count] => 0
[view_count] => 173
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566925072
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41789
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566925072
[last_post_id] => 41789
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11762] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 61
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11762
[node_id] => 391
[title] => Samsung Foundry Forum 2019: eSilicon to unveil 14nm switching and 5G infrastructure ASICs
[reply_count] => 0
[view_count] => 156
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566925033
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41788
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566925033
[last_post_id] => 41788
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11761] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 62
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11761
[node_id] => 391
[title] => eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC
[reply_count] => 0
[view_count] => 117
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566924986
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41787
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566924986
[last_post_id] => 41787
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11760] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 63
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11760
[node_id] => 391
[title] => eSilicon Expands Technical Advisory Board
[reply_count] => 0
[view_count] => 117
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566924954
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41786
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566924954
[last_post_id] => 41786
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11759] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 64
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11759
[node_id] => 391
[title] => eSilicon Signs Multi-Year Agreement with Google Cloud
[reply_count] => 0
[view_count] => 117
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566924914
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41785
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566924914
[last_post_id] => 41785
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11758] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 65
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11758
[node_id] => 391
[title] => Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
[reply_count] => 0
[view_count] => 119
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566924883
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41784
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566924883
[last_post_id] => 41784
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11757] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 66
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11757
[node_id] => 391
[title] => eSilicon to present at State of AI and ML – Spring 2019
[reply_count] => 0
[view_count] => 114
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566924815
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41783
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566924815
[last_post_id] => 41783
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11756] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 67
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11756
[node_id] => 391
[title] => eSilicon awards six scholarships to top female STEM students at STEMCON Vietnam 2019
[reply_count] => 0
[view_count] => 117
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566924784
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41782
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566924784
[last_post_id] => 41782
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11754] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 68
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11754
[node_id] => 391
[title] => DATE 2019: eSilicon to present two papers on advanced floor planning techniques in conjunction with the Polytechnic University of Catalonia
[reply_count] => 0
[view_count] => 106
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566924722
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41780
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566924722
[last_post_id] => 41780
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 28
[message_count] => 28
[last_post_id] => 41943
[last_post_date] => 1569201124
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 11865
[last_thread_title] => eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)
better_recent_comments-2
Widget_Better_Recent_Comments Instance: 2Array
(
[title] => Recent Article Comments
[number] => 10
[avatar] =>
[date] => 1
[comment] => 1
[link] => 1
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] =>
[pageid_274493] => 1
)
[rw_opt_exclude] => Array
(
)
)
Widget_Better_Recent_Comments
Acceleration in a Heterogenous Compute Environment