The World’s Smallest Printed Circuit Boards: interposers

The World’s Smallest Printed Circuit Boards: interposers
by Paul McLellan on 04-27-2011 at 1:38 pm

Have you ever had the experience where you look up some unusual word in the dictionary since you don’t remember seeing it before. And then, in the next few weeks you keep coming across it. Twice in the last week I have been in presentations about the economics of putting die onto silicon interposers and the possibility of a new… Read More


TSMC Open Innovation Platform Explained

TSMC Open Innovation Platform Explained
by Daniel Nenni on 11-09-2009 at 10:56 pm

Launched in April 2008, the TSMC Open Innovation Platform initiative is a collaborative strategy aimed at breaking the bottlenecks of semiconductor design enablement in order to promote growth for the industry as a whole. The TSMC iPDK Debate: Lets Play Monopoly! blog I did provides more technical detail.

While Wafer count is… Read More