All Things Semiconductor!
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Image RemovedWe covered the ASIC business in Chapter 2 of our book “Fabless: The Transformation of the Semiconductor Industry” using VLSI Technology and eSilicon as shining examples. Neither of which now exist. The ASIC business model was a critical steppingstone in the transformation of the semiconductor industry. Many systems… Read More
eSilicon recently released a paper detailing its experiences and its thoughts on the future of chiplets. The author of the white paper is Dr. Carlos Macián. I have also covered a presentation given by Carlos recently at the AI Hardware Summit, and he is well-spoken and quite knowledgeable. To get the white paper, go to the eSilicon… Read More
I recently had the pleasure of attending the AI Hardware Summit at the Computer History Museum in Mountain View, CA. This two-day conference brought together many companies involved in building artificial intelligence solutions. Though the focus was on building the hardware for this area, there was naturally much discussion… Read More
In early May of this year, eSilicon announced the tape-out of a test chip which included the latest additions to its neuASIC™ IP platform. At the upcoming Hot Chips Symposium to be held at Stanford on August 19 and 20, 2019, eSilicon will be demonstrating the software component of this AI-enabling IP platform. At the event, eSilicon… Read More
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I recently watched a webinar given by eSilicon about its project to enhance its licensable solution for 56 and 112 Gigabit per second PAM4 & NRZ DSP-based SerDes family in 7nm. I am sure it was complicated enough to coordinate a webinar with a host, a moderator, and three different technical presenters – however… Read More
eSilicon was one of the first companies to focus on making the benefits of the fabless semiconductor movement available to a broader range of customers and markets. The company is credited with the creation of the fabless ASIC model. In this section, eSilicon shares some of its history and provides its view of the ever-changing … Read More
Since the beginning of May eSilicon has announced the tape-out of three TSMC 7nm test chips. The first of these, a 7nm 400G Ethernet Gearbox/Retimer design, caught my eye and I followed up with Hugh Durdan, their vice president of strategy and products, to learn more about it. Rather than just respin their 56G SerDes, they decided… Read More
Image RemovedHaving just completed a cloud evaluation for SemiWiki I can tell you why eSilicon chose Google. Simply put, they are working harder to get cloud business. Google ($4B) is the number five cloud provider behind Microsoft ($21.2B), Amazon ($20.4B), IBM ($10.3B) and Oracle ($6.08B). There is a lot of money in the cloud… Read More
A recent press release from eSilicon caught my eye. The company has been touting their 7nm SerDes quite a bit lately – reach, power, flexibility, things like that. While those capabilities are important, any high-performance chip needs to work in the context of the system, which usually contains technology from multiple sources.… Read More
At SemiWiki we usually don’t write about the press releases we are sent. However, a recent press release by eSilicon caught my eye and prompted me to call Mike Gianfagna, eSilicon Vice President of Marketing. The press release is not just about one thing, rather it focuses on a number of interesting things that together show their… Read More
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Choose the Right ASIC Manufacturing Model for Your Business
REPLAY: GPU-Powered SPICE: The Way Forward for Analog Simulation
REPLAY: Avoiding CDM (Charged Device Model) ESD Failures
REPLAY: eFPGA – "What a great idea! But I have no idea how I’d use it!"
REPLAY: Ensuring System-level Security Through Hardware/Software Security Verification
REPLAY: Fabless: The Transformation of the Semiconductor Industry
REPLAY: The Brave New World of Customized Memory
REPLAY: Embedded FPGA: The Fabric for Optimized Machine Learning
REPLAY: VLSI Design Methodology Development
REPLAY: Lightspeed Data Sync - Design Workspace Problems Solved!
REPLAY: Desinging Complex SoCs and Dealing with Multiple File Formats?
REPLAY: How ASIC/SoC Prototyping Solutions Can Help You!
REPLAY: Reusing Your IPs & PDKs Successfully With Cadence® Virtuoso®
REPLAY: Taiwan ESD Workshop Recording
REPLAY: Reduce Risk and Improve Quality of AMS IP’s using AI-Powered Automated Timing Arc Prediction
REPLAY: Text: A Year of Breakfast Bytes by Paul McLellan (Free PDF Version)
REPLAY: Finding Your Way Through Verification
REPLAY: Concerned about IP security threats for your SoCs?
REPLAY: Achronix: Accelerate Data Processing Algorithms using FPGAs with 2D Network-on-Chip
REPLAY: PAVE360: Of SoCs, Digital Twins, and Validating Autonomous Vehicle Behavior
REPLAY: Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
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Choose the Right ASIC Manufacturing Model for Your Business
REPLAY: GPU-Powered SPICE: The Way Forward for Analog Simulation
REPLAY: Avoiding CDM (Charged Device Model) ESD Failures
REPLAY: eFPGA – “What a great idea! But I have no idea how I’d use it!”
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REPLAY: Fabless: The Transformation of the Semiconductor Industry
REPLAY: The Brave New World of Customized Memory
REPLAY: Embedded FPGA: The Fabric for Optimized Machine Learning
REPLAY: VLSI Design Methodology Development
REPLAY: Lightspeed Data Sync – Design Workspace Problems Solved!
REPLAY: Desinging Complex SoCs and Dealing with Multiple File Formats?
REPLAY: How ASIC/SoC Prototyping Solutions Can Help You!
REPLAY: Reusing Your IPs & PDKs Successfully With Cadence® Virtuoso®
REPLAY: Taiwan ESD Workshop Recording
REPLAY: Reduce Risk and Improve Quality of AMS IP’s using AI-Powered Automated Timing Arc Prediction
REPLAY: Text: A Year of Breakfast Bytes by Paul McLellan (Free PDF Version)
REPLAY: Finding Your Way Through Verification
REPLAY: Concerned about IP security threats for your SoCs?
REPLAY: Achronix: Accelerate Data Processing Algorithms using FPGAs with 2D Network-on-Chip
REPLAY: PAVE360: Of SoCs, Digital Twins, and Validating Autonomous Vehicle Behavior
REPLAY: Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
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[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
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[_writePending:protected] =>
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[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
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[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[11757] => ThemeHouse\XPress\XF\Entity\Thread Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 68
[rootClass:protected] => XF\Entity\Thread
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[thread_id] => 11757
[node_id] => 391
[title] => eSilicon to present at State of AI and ML – Spring 2019
[reply_count] => 0
[view_count] => 182
[user_id] => 25277
[username] => AmandaK
[post_date] => 1566924815
[sticky] => 0
[discussion_state] => visible
[discussion_open] => 1
[discussion_type] =>
[first_post_id] => 41783
[first_post_reaction_score] => 0
[first_post_reactions] => []
[last_post_date] => 1566924815
[last_post_id] => 41783
[last_post_user_id] => 25277
[last_post_username] => AmandaK
[prefix_id] => 0
[tags] => []
[custom_fields] => []
)
[_relations:protected] => Array
(
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 70
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[discussion_count] => 30
[message_count] => 30
[last_post_id] => 42214
[last_post_date] => 1573496402
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 12086
[last_thread_title] => Inphi to Acquire eSilicon, a Leading Provider of 2.5D Packaging, SerDes and Custom Silicon
[last_thread_prefix_id] => 0
[moderate_threads] => 1
[moderate_replies] => 1
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 48
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 391
[title] => eSilicon
[description] =>
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 355
[display_order] => 160
[display_in_list] => 1
[lft] => 51
[rgt] => 52
[depth] => 2
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"385":{"node_id":385,"title":"Companies","depth":0,"lft":13,"node_name":null,"node_type_id":"LinkForum"},"355":{"node_id":355,"title":"Company Forums","depth":1,"lft":14,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)
better_recent_comments-2
Widget_Better_Recent_Comments Instance: 2Array
(
[title] => Recent Article Comments
[number] => 10
[avatar] =>
[date] => 1
[comment] => 1
[link] => 1
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[others_front_page] => 1
[pageid_275979] => 1
)
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
)
Widget_Better_Recent_Comments
A No-Fudge ML Architecture for Arm