Webinar: How CXL Technology will Revolutionize the Data Center

Webinar: How CXL Technology will Revolutionize the Data Center
by Admin on 10-31-2022 at 2:13 pm

Data Centers face many challenges in an environment of exponentially rising data volume growth. With workload demands increasing rapidly, the need for more bandwidth and capacity continues to rise. We’ve reached the point where half of server bill of materials (BoM) costs are for memory. How can we make the best use of this investment?

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Samsung Foundry Forum & SAFE™ Forum 2022

Samsung Foundry Forum & SAFE™ Forum 2022
by Daniel Nenni on 09-16-2022 at 6:00 am

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It has been an exciting time in the semiconductor industry and the excitement is far from over. Years 2022 and 2023 will be more challenging in many different ways and live activities have just begun. The cornerstones to the semiconductor industry are the foundries so I look forward to the live foundry events coming up in October,… Read More


Navigating the Intersection of Safety and Security

Navigating the Intersection of Safety and Security
by Admin on 04-26-2022 at 1:53 pm

Vehicle systems and the semiconductors used within them are some of the most complex electronics seen today. Ensuring these systems are both functionally safe and secure from cyberattacks is mission critical. Join us for this webinar where Thierry Kouthon of Rambus, and Ann Keffer of Siemens

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WEBINAR: Secure Your Devices with PUF Plus Hardware Root of Trust

WEBINAR: Secure Your Devices with PUF Plus Hardware Root of Trust
by Admin on 03-25-2022 at 12:49 pm

Arizona (GMT -7:00)
About
Technology experts from Rambus and Intrinsic ID will discuss how combining PUF technology with a hardware Root of Trust can provide robust security for data and devices. The session will start with the fundamentals of PUFs and example use cases. Then we will discuss how the characteristics
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Memory Bandwidth Races Higher with HBM3

Memory Bandwidth Races Higher with HBM3
by Admin on 03-03-2022 at 1:44 pm

March 15th @ 11am PT | 2pm ET

With the formal release of the HBM3 specification, memory bandwidth for AI/ML and HPC shifts to a higher gear. Terabytes of bandwidth are possible using HBM3’s 2.5D/3D architecture. Join memory expert Frank Ferro as he discusses what changes come with the new generation of HBM, and how the Rambus HBM3

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Podcast EP15: The Birth of Dynamically Reconfigurable Computing

Podcast EP15: The Birth of Dynamically Reconfigurable Computing
by Daniel Nenni on 04-09-2021 at 10:00 am

Dan and Mike are joined by Geoff Tate, founding CEO of Flex Logix. Geoff has a storied career in semiconductors that includes over ten years at AMD, ending as senior VP, microprocessors and logic. Following AMD, Geoff was founding CEO of Rambus, growing the company from four people to IPO with a $2 billion market cap.

As co-founder… Read More


[Live Webinar] Security Solutions for an Evolving Data Center

[Live Webinar] Security Solutions for an Evolving Data Center
by Admin on 10-07-2020 at 3:46 pm

Event Details

  • Date:  – 

Data Centers are rapidly evolving in response to significant tidal forces: the exponential growth in data traffic, the rise of new workloads with AI/ML being one of the foremost, and the distribution of computing to the edge of the network for low latency, real-time applications.… Read More


AI Requires Tailored DRAM Solutions

AI Requires Tailored DRAM Solutions
by Admin on 05-27-2020 at 12:22 am

Join Rambus for a webinar exploring how Dynamic Random Access Memory (DRAM) is a key enabler for Artificial Intelligence (AI). Featuring Frank Ferro, senior director of product management for memory interface IP at Rambus, and Shane Rau, research vice president, computing semiconductors at IDC, this

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