Dan is joined by Scott Best, technical director at Rambus. His research areas are memory architectures, 3D packaging, and security processors. Scott joined Rambus in 1998 and has served in many and varied technical roles. He has become one of the most prolific inventors in the company’s history. Over the course of his career at … Read More
Traveling by car is something that I take for granted and I just expect that my trips will be safe, yet our cars are increasingly using dozens of ECUs, SoCs and millions of lines of software code that combined together present a target for hackers or system failures. The Automotive Safety Integrity Levels (ASIL) are known by the letters:… Read More
It has been an exciting time in the semiconductor industry and the excitement is far from over. Years 2022 and 2023 will be more challenging in many different ways and live activities have just begun. The cornerstones to the semiconductor industry are the foundries so I look forward to the live foundry events coming up in October,… Read More
Dan and Mike are joined by Geoff Tate, founding CEO of Flex Logix. Geoff has a storied career in semiconductors that includes over ten years at AMD, ending as senior VP, microprocessors and logic. Following AMD, Geoff was founding CEO of Rambus, growing the company from four people to IPO with a $2 billion market cap.
As co-founder… Read More
Steven Woo, Fellow and Distinguished Inventor presented at the just concluded Linley Spring Processor Conference a talk about AI in the Era of Connectivity. As he put it, the world is becoming increasingly connected, with a marked surge of digital data, causing a dependence on said data. With the explosion of digital data and AI,… Read More
The euphoria of NCAA March Madness seems to spill over into the tech world. The epicenter of many tech talks this month spanning from GPU conference, OCP, SNUG to CASPA has evolved around an increased AI endorsement by many companies and its integration into many silicon driven applications. At this year CASPA Spring Symposium,… Read More
Life is full of convenience-security tradeoffs. Sometimes these are explicit, where you get to make an active choice about how secure or insecure you want things to be. Other times we are unaware of the choices we are making, and how risky they are for the convenience provided. If you leave your bike unlocked, you can expect it to be… Read More
In the wake of TSMC’s recent Open Innovation Platform event, I spoke to Frank Ferro, Senior Director of Product Management at Rambus. His presentation on advanced memory interfaces for high-performance systems helped to shed some light on the evolution of system memory for leading edge applications. System implementers now… Read More
According with ESDA, EDA revenues have grown YoY by 16.2% in Q2 2018, and this is the good news for our industry. The bad news is the decline of SIP (Design IP) revenues, by (3.1%) at the same time. As far as I am concerned, this figure looks weird, so I will try to understand the reason why SIP category can go wrong in a healthy EDA market,… Read More
High Bandwidth Memory (HBM) systems have been successfully used for some time now in the network switching and high-performance computing (HPC) spaces. Now, adding fuel to the HBM fire, there is another market that shares similar system requirements as HPC and that is Artificial Intelligence (AI), especially AI systems doing… Read More
