FinFET ASICs for Networking, Data Center, AI and 5G

FinFET ASICs for Networking, Data Center, AI and 5G
by Daniel Nenni on 01-08-2018 at 12:00 pm

On the heels of successful seminars in Tokyo and Shanghai, eSilicon is starting the new year back in the cloud with a webinar version of the live events for those, like myself, who could not attend. The webinar will compress the 3 hour live event into 60 minutes which will provide a great place to start a conversation on your next chip… Read More


The Interface IP Market has Grown to $530 Million!

The Interface IP Market has Grown to $530 Million!
by Eric Esteve on 10-22-2017 at 7:00 am

According with IPnest, the Interface IP market, including USB, PCI Express, (LP)DDRn, HDMI, MIPI and Ethernet IP segments, has reached $532 million in 2016, growing from $472 million in 2015. This is an impressive 13% Year-over-Year growth rate, and 12% CAGR since 2012!



Who integrate functions to interface a chip with others Read More


Open-Silicon SerDes TCoE Enables Successful Delivery of ASICs for Next-generation, High-Speed Systems

Open-Silicon SerDes TCoE Enables Successful Delivery of ASICs for Next-generation, High-Speed Systems
by Mitch Heins on 06-26-2017 at 12:00 pm

With 5G cellular networks just around the corner, there is an ever-increasing number of companies working to bring faster communications chips to the market. Data centers are now deploying 100G to handle the increased bandwidth requirements, typically in the form of four 28Gbps channels and that means ASIC designers are looking… Read More


IP Vendors: Call for Contribution to the Design IP Report!

IP Vendors: Call for Contribution to the Design IP Report!
by Eric Esteve on 04-13-2017 at 12:00 pm

The EDA & IP industry enjoys high growth for the Design IP segment, but a detailed analysis tool is missing. IPnest will address this need in 2017, expecting the IP vendors’ contribution! If we consider the results posted last March by the ESD Alliance, the EDA (and IP) industry is doing extremely well, as the global revenue has… Read More


Samsung Should Just Buy eSilicon Already!

Samsung Should Just Buy eSilicon Already!
by Daniel Nenni on 03-22-2017 at 12:00 pm

As you all know I’m a big fan of the ASIC business dating back to the start of the fabless semiconductor transformation where anybody could send a design spec to an ASIC company and get a chip back. The ASIC business model also started the smart phone revolution when Samsung built the first Apple SoCs for the iPhones and iPads.

Today … Read More


Succeeding with 56G SerDes, HBM2, 2.5D and FinFET

Succeeding with 56G SerDes, HBM2, 2.5D and FinFET
by Daniel Nenni on 03-17-2017 at 4:00 pm

eSilicon presented their advanced ASIC design capabilities at a seminar last Wednesday evening. This event was closed to the press, bloggers and analysts, but I managed to get some details from a friend who attended. The event title was: “Advanced ASICs for the Cloud-Computing Era: Succeeding with 56G SerDes, HBM2, 2.5D and FinFETRead More


Another Live Event at Samsung!

Another Live Event at Samsung!
by Daniel Nenni on 02-25-2017 at 7:00 am

Last week Samsung hosted the GSA Silicon Valley “State of the Industry” Meet-up which was well attended by the semiconductor elite, myself included. The agenda started with an update on the semiconductor industry outlook followed by deep dives into Automotive, IoT, Artificial Intelligence, and Cybersecurity all of which areRead More


CEO Interview: Geoff Tate of Flex Logix

CEO Interview: Geoff Tate of Flex Logix
by Daniel Nenni on 10-10-2016 at 7:00 am

Geoff Tate Flexlogix

This is the second in series of interviews we will do with executives inside the fabless semiconductor ecosystem. Geoff Tate was the founding CEO of Rambus and is now CEO and co-founder ofFlex Logix (embedded FPGA). This one should be of great interest due to the recent $16.7B acquisition of Altera by Intel. We all now know the importance… Read More


IC and System Design for Mobile and Wearable Devices!

IC and System Design for Mobile and Wearable Devices!
by Daniel Nenni on 07-16-2016 at 7:00 am

The Linley Mobile and Wearable Conference is coming up so let’s take a look at what is in store for us. Bernard Murphy, Tom Simon, and I will be covering the event live for SemiWiki and we will also be doing a book giveaway/signing for our new “Prototypical” book (compliments of S2C Inc.) during the networking event on Tuesday evening.… Read More


Intel is Still Missing Mobile!

Intel is Still Missing Mobile!
by Daniel Nenni on 05-07-2014 at 9:00 am

Paul McLellan was on assignment in Hong Kong last week so I attended the Linley Mobile Conference and was not surprised Intel did not present. During the networking sessions I asked more than a dozen people why and the answers were pretty focused on “Intel still does not play well with others” and “Intel’s current mobile offerings… Read More