eSilicon Brings a New Software Interface to its 7nm neuASIC Machine Learning Platform at Hot Chips

eSilicon Brings a New Software Interface to its 7nm neuASIC Machine Learning Platform at Hot Chips
by Randy Smith on 08-13-2019 at 10:00 am

In early May of this year, eSilicon announced the tape-out of a test chip which included the latest additions to its neuASIC™ IP platform. At the upcoming Hot Chips Symposium to be held at Stanford on August 19 and 20, 2019, eSilicon will be demonstrating the software component of this AI-enabling IP platform. At the event, eSilicon… Read More


High Performance Ecosystem for 14nm-FinFET ASICs with 2.5D Integrated HBM2 Memory

High Performance Ecosystem for 14nm-FinFET ASICs with 2.5D Integrated HBM2 Memory
by Mitch Heins on 02-07-2018 at 10:00 am


High Bandwidth Memory (HBM) systems have been successfully used for some time now in the network switching and high-performance computing (HPC) spaces. Now, adding fuel to the HBM fire, there is another market that shares similar system requirements as HPC and that is Artificial Intelligence (AI), especially AI systems doing… Read More


Advanced ASICs – It Takes an Ecosystem

Advanced ASICs – It Takes an Ecosystem
by Mike Gianfagna on 11-26-2017 at 2:00 pm

I remember the days of the IDM (integrated device manufacturer). For me, it was RCA, where I worked for 15 years as the company changed from RCA to GE and then ultimately to Harris Semiconductor. It’s a bit of a cliché, but life was simpler then, from a customer point of view at least. RCA did it all. We designed all the IP, did the physical… Read More


Navigating the System-in-a-Package Manufacturing Ecosystem

Navigating the System-in-a-Package Manufacturing Ecosystem
by Mitch Heins on 10-26-2017 at 12:00 pm

Being an old ASIC physical design guy, I tend to think of ASICs from a “bond-pads-in” perspective. This week however, I had a very eye-opening discussion with Dan Leung, Director of Packaging and Assembly for Open-Silicon, that totally changed my perspective. While I had been exposed many times to the concept of systems-in-a-package… Read More


Memories for the Internet

Memories for the Internet
by Tom Simon on 06-29-2017 at 12:00 pm

In 1969 the Internet was born at UCLA when a computer there sent a message to a computer at Stanford. By 1975, there were 57 computers on the ‘internet’. Interestingly in the early seventies I actually used the original Xerox Sigma 7 connected to the internet in Boelter Hall at UCLA. A similar vintage computer is now in this room commemorating… Read More


Samsung Should Just Buy eSilicon Already!

Samsung Should Just Buy eSilicon Already!
by Daniel Nenni on 03-22-2017 at 12:00 pm

As you all know I’m a big fan of the ASIC business dating back to the start of the fabless semiconductor transformation where anybody could send a design spec to an ASIC company and get a chip back. The ASIC business model also started the smart phone revolution when Samsung built the first Apple SoCs for the iPhones and iPads.

Today … Read More


Another Live Event at Samsung!

Another Live Event at Samsung!
by Daniel Nenni on 02-25-2017 at 7:00 am

Last week Samsung hosted the GSA Silicon Valley “State of the Industry” Meet-up which was well attended by the semiconductor elite, myself included. The agenda started with an update on the semiconductor industry outlook followed by deep dives into Automotive, IoT, Artificial Intelligence, and Cybersecurity all of which areRead More


“Thinking Outside the Chip”

“Thinking Outside the Chip”
by Students@olemiss.edu on 04-13-2016 at 7:00 am

While pushing Moore’s Law’s boundaries in the world of 2D packaging, companies are starting to explore nontraditional approaches towards designing integrated circuit chips. 2D packaging is currently the most used method in designing chips in the industry, and while it leads in efficiency of power and performance, it lacks … Read More


Pathfinding to an Optimal Chip/Package/Board Implementation

Pathfinding to an Optimal Chip/Package/Board Implementation
by Tom Dillinger on 02-04-2016 at 4:00 pm

A new term has entered the vernacular of electronic design engineering — pathfinding. The complexity of the functionality to be integrated and the myriad of chip, package, and board technologies available make the implementation decision a daunting task. Pathfinding refers to the method by which the design space of technology… Read More


GlobalFoundries and ARM

GlobalFoundries and ARM
by Paul McLellan on 11-04-2013 at 4:56 pm

GlobalFoundries had several interesting things at the ARM TechCon last week. Firstly, GlobalFoundries won the best in show award in the chip design category recognizing the best-in-class technologies introduced since the last TechCon.

Earlier in the summer GlobalFoundries and ARM announced the ARM Cortex-A12 processor,… Read More