All-Embracing Multiphysics Analysis for Chiplet-Based SystemsWhat systems can accomplish by combining semiconductors, AI,…Read More
How Samtec Blazes a Trail to 224/448 Gbps at DesignCon 26I recently covered what Samtec was doing at…Read More
Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume FabsA deposition chamber drops out of production at…Read More
AION Silicon: Architecting Smarter SoCs with RISC-V: Balancing Performance, Flexibility, and Risk Architecting Smarter SoCs with…Read More
AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoptionSystems-in-package (SIPs) with 2.5D and 3D heterogenous integration,…Read More
At the TSMC Open Innovation Platform Ecosystem Forum (try saying that three times in a row) next week (on Tuesday 18th), Atrenta will present a paper on the TSMC soft IP qualification flow. It will be presented by Anuj Kumar, senior manager of the customer consulting group.
More and more, chips are not put together what we think of … Read More
Using the “Diffusion of Innovation” theory, we have built a forecast for the market of USB 3.0 IP in 2011-2015. In this new version of the report, we have inserted the actual revenues generated by USB 3.0 IP from different vendors, for 2009 and 2010, and reworked the 2011-2015 forecast. Initially, we had expected this IP market to … Read More
Intro
My first exposure to hardware prototyping was at Intel back in 1980 when the iAPX 432 chip-set group decided to build a TTL-based wire-wrap prototype of a 32 bit processor to execute the Ada language. The effort to create the prototype took much longer than expected and was only functional a few months before silicon came back.… Read More
Time to ring the Bell. With the iPhone 4S, Apple has just surpassed the 70% gross margin metric that usually equates to a compute platform becoming an industry standard. IBM’s mainframe achieved it in the 1960s with the 360 series and still is able to crank it out with their Z-series. The combined Intel and Microsoft tandem (Wintel)… Read More
In case you have not heard, the 16th Si2-hosted conference highlighting industry progress in design flow interoperability comes to Silicon Valley (Santa Clara, CA) on October 20th. Si2Con will showcase recent progress of members in the critical areas of:
[LIST=1]
Being an internationally recognized industry blogger (IRIB) does have its benefits, one of which is free invites to all of the cool industry conferences! The presentations are canned for the most part but you can learn a lot at the breaks and exhibits if you know the right questions to ask, which I certainly do.
The GSA Semiconductor… Read More
Will Rogers said that an economist’s guess is liable to be as good as anyone’s, but with advanced-node optical lithography, I might have to disagree. Unlike the fickle economy, the distorting effects of the mask and lithographic system are ruled by physics, and so can be modeled.
In this installment, I’ll talk about two critical… Read More
Solido has announced webinars for North America, Europe and Asia on October 12-13. They will be describing the variation analysis and design solutions in the TSMC AMS Reference Flow 2.0 announced at the Design Automation Conference this year.
“We are pleased to broaden our collaboration with Solido in developing advanced variation… Read More
DFM closure is a growing issue these days even at the 45nm node, and IC designers at ST-Ericsson have learned that transitioning from dummy fill to SmartFill has saved them time and improved their DFM score.
The SOC
ST-Ericsson designed an SOC for mobile platforms called the U8500 and their foundry choice was a 45nm node at STMicroelectronics… Read More
Jasper’s Annual User Group Meeting is on November 9th and 10th, in Cupertino California. It will feature users from all over the world sharing the best practices in verification. If you are a user of Jasper’s products then you should definitely plan to attend. This year there is so much good material that the meeting… Read More
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Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?