Podcast EP374: How proteanTecs Tames Multi-Die Packaging Challenges with Nir Server
Daniel is joined by Nir Sever, an industry veteran with over 30 years of technological and managerial experience in advanced VLSI engineering. Before joining proteanTecs, Nir served for 10 years as the COO of Tehuti Networks, a pioneer in the area of high-speed networking Semiconductors. Prior to that, he served for 9 years as Senior Director of VLSI Design and Technologies for Zoran Corporation, a recognized world leader in Semiconductors for the highly competitive Consumer Electronics market. Nir was responsible for driving Zoran’s silicon technologies and delivering more than 10 new silicon products each year. Prior to that, Nir held various managerial and technological VLSI roles at 3dfx Interactive, GigaPixel Corporation, Cadence Design Systems, ASP Solutions, and Zoran Microelectronics.
Daniel explores the challenges of multi-die packaging with Nir, who explains that the issues for multi-die systems share many similarities with monolithic design, though with some important differences. He describes how, in a multi-die system each chiplet depends on the performance of other chiplets and this cross-dependency creates new requirements. Nir describes several approaches developed by proteanTecs to address these difficult problems.
The ability to gain telemetry about operating chip performance is one key technology that creates effective solutions. In this very detailed and informative session Nir describes how to improve items such as power efficiency, reliability, and implement failure prevention capabilities.
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