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Auto Shows No Connection

Auto Shows No Connection
by Roger C. Lanctot on 04-21-2019 at 12:00 pm

The Washington Auto Show, one of the largest auto shows in the U.S., has a problem and it is a problem shared by other auto shows in the U.S. and around the world. It is a problem that plagues the entire industry and it may spell trouble for connecting with car customers.

I visited the Washington Auto Show last week. The event closed on … Read More


A Tale of Two Semis

A Tale of Two Semis
by Robert Maire on 04-21-2019 at 7:00 am

It was the best of times (for stocks)
It was the worst of times (for memory chips)
The disconnect between stock & chip prices

The Venn Diagram of Stocks and Chips

Having been involved with semiconductor and tech stocks for a long time there has always been a loose correlation between the fortunes of the industry and the fortunes… Read More


SPIE Advanced Lithography Conference – Imec and Veeco on EUV

SPIE Advanced Lithography Conference – Imec and Veeco on EUV
by Scotten Jones on 04-19-2019 at 12:00 pm

At the SPIE Advanced Lithography Conference Imec presented several papers on EUV and Veeco presented about etching for EUV masks. I had the opportunity to see the presentations and speak with some of the authors. In this article I will summarize the key issues around EUV based on this research.

EUV is ramping up into high volume 7nm… Read More


TSMC Q1 2019 Earnings Call Discussion!

TSMC Q1 2019 Earnings Call Discussion!
by Daniel Nenni on 04-19-2019 at 7:00 am

It’s no coincidence that the TSMC Symposium is right after the Q1 earnings call. This will allow TSMC to talk more freely and they certainly will, my opinion. It is a very interesting time in the semiconductor industry and TSMC, being the bellwether, can tell us what will happen the rest of the year and give us some 2020 insights.… Read More


Flex Logix InferX X1 Optimizes Edge Inference at Linley Processor Conference

Flex Logix InferX X1 Optimizes Edge Inference at Linley Processor Conference
by Camille Kokozaki on 04-18-2019 at 12:00 pm

Dr. Cheng Wang, Co-Founder and SVP Engineering at Flex Logix, presented the second talk in the ‘AI at the Edge’ session, at the just concluded Linley Spring Processor Conference, highlighting the InferX X1 Inference Co-Processor’s high throughout, low cost, and low power. He opened by pointing out that existing inference solutions… Read More


ML and Memories: A Complex Relationship

ML and Memories: A Complex Relationship
by Bernard Murphy on 04-18-2019 at 7:00 am

No, I’m not going to talk about in-memory-compute architectures. There’s interesting work being done there but here I’m going to talk here about mainstream architectures for memory support in Machine Learning (ML) designs. These are still based on conventional memory components/IP such as cache, register files, SRAM and various… Read More


TechInsights Gives Memory Update at IEDM18 DRAM and Emerging Memories

TechInsights Gives Memory Update at IEDM18 DRAM and Emerging Memories
by BHD on 04-17-2019 at 12:00 pm

On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees.

This is the second part of the review of Jeongdong’s talk, we covered NAND flash technology in the last post. Jeongdong is a Senior Technical… Read More


Hogan Fireside Chat with Paul Cunningham at ESDA

Hogan Fireside Chat with Paul Cunningham at ESDA
by Bernard Murphy on 04-17-2019 at 7:00 am

If you’re in verification and you don’t know who Paul Cunningham is, this is a guy you need to have on your radar. Paul has risen through the Cadence ranks fast, first in synthesis and now running the verification group, responsible for about a third of Cadence revenue and a hefty percentage of verification tooling in the semiconductor… Read More


Samsung 5nm and TSMC 6nm Update

Samsung 5nm and TSMC 6nm Update
by Daniel Nenni on 04-16-2019 at 12:00 pm

TSMC and Samsung continue to raise the competitive bar for FinFET foundry market share with dueling announcements this week. As I mentioned previously in the blog Semiconductor Foundry Landscape Update 2019, FinFETs are the market to watch with the coming onslaught of 5G and AI chips on the edge, in the cloud, and in our autonomous… Read More


Using ML to Build Efficient Low Power Platforms for Augmented Vision

Using ML to Build Efficient Low Power Platforms for Augmented Vision
by Tom Simon on 04-16-2019 at 7:00 am

We are all pretty familiar with augmented reality, where real world images are overlaid with computer generated images, graphics and even audio. Of course, our first exposure to augmented reality might have been images of heads up displays in fighter jets or perhaps in the movie The Terminator. Augmented reality is moving rapidly… Read More