Captain America: Can Elon Musk Save America's Chip Manufacturing Industry?Intel has posted three consecutive years of falling…Read More
WEBINAR: Reclaiming Clock Margin at 3nm and BelowAt 3nm and below, clock networks have quietly…Read More
WEBINAR: HBM4E Advances Bandwidth Performance for AI TrainingThe rapid proliferation of LLMs and other AI…Read More
Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design EnablementThe recent Chiplet Summit in Santa Clara was…Read More
Siemens Fuse EDA AI Agent Releases to Orchestrate Agentic Semiconductor and PCB DesignThough terminology sometimes get fuzzy, consensus holds that…Read More
The list of possible stochastic patterning issues for EUV lithography keeps growing longer: CD variation, edge roughness, placement error, defects [1]. The origins of stochastic behavior are now well-known. For a given EUV photon flux into the resist, a limited fraction are absorbed. Since the absorption is less than 5% affected… Read More
We all know signal integrity and power integrity are becoming more important for advanced design. Like package engineering, the obscure and highly technical art of SI/PI optimization has taken center stage in the design process. And the folks who command expertise in these areas have become the rock stars of the design team. I … Read More
It is difficult to imagine an SoC development team not using some form of automation to assemble their SoCs; the sheer complexity of the assembly task for modern designs is already far beyond hand-crafted top-level RTLs. An increasing number of groups have already opted for solutions based on the IP-XACT integration standard.… Read More
One of my pet beefs with the car industry is that car makers, on the whole, have failed to agree among themselves as to what basic vehicle connectivity ought to consist of. From car maker to car maker prices vary, bundles vary, free periods of service access vary and the variations get worse between model years as offers change and … Read More
-Lam missed on both top & bottom line due to supply chain
-Previous guide was “overly optimistic” about fixing issues
-Demand is great but doesn’t matter if you can’t serve it
-We remain concerned about ability to fix issues in near term.
Lam reported Revenues… Read More
Dan is joined by Dr. Dave Baker, VP digital design at Luminous Computing and John Min, director of field applications at Andes Technology. Dave and John explore with Dan their collaboration to build high-performance supercomputers.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, … Read More
-ASML reported an “in line” Q1- Orders remain super strong
-Ongoing supply chain issues will limit growth and upside
-ASML targets 2025 for supply fixes- We are not so sure
-Intel, TSMC, Samsung won’t be able to build all fabs they plan
ASML reported… Read More
Integrating IP to build SoCs has been consistently on the rise. Growth in complexity and meeting time to market pressures are some primary drivers behind this phenomenon. Consequentially, the IP market segment has also been enjoying tremendous growth. While this is great news for chip design schedules, it does highlight the … Read More
Application Specific Integrated Circuits were the foundation of the semiconductor industry up until the IDMs came to power in the 1980s and 90s. Computer companies all had their own fabs, I worked in one, until start up companies like SUN Microsystems started using off the shelf chips from Motorola. SUN moved to the fabless model… Read More
Dan is joined by Tom Doyle, CEO of Aspinity. Dan explores the benefits of Aspinity’s analog signal processing technology with Tom. The ultra-low power analog computing capability delivered by Aspinity has significant implications for the design and deployment of AI/ML systems.
The views, thoughts, and opinions… Read More
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Chemical Origins of Environmental Modifications to MOR Lithographic Chemistry